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Send us a textWhat happens when the world's thirst for artificial intelligence collides with physical limitations? The answer lies at the intersection of silicon innovation and packaging technology.From the conference hall of ECTC 2025 in Dallas, we're joined by Sam Naffziger of AMD who reveals how AI has transformed from a peripheral topic to the dominant force in computing within just five years. The economic motivation is clear: creating machines that generate intelligence offers "uncalculable value" to humanity. Yet as Nafziger explains, today's large language models face significant limitations—they excel at pattern recognition but struggle with true reasoning, suffer from hallucinations, and require human verification for mission-critical applications.Perhaps most surprising is Nafziger's revelation about "the data wall"—general-purpose AI models have essentially exhausted the high-quality training data available on the internet. This constraint is pushing AI development toward more sophisticated approaches involving reinforcement learning and models that check other models, gradually shifting from simple pattern recognition toward deliberative thinking that more closely resembles human reasoning.The conversation tackles the looming concern of AI's energy consumption, projected to reach 10% of global power by 2030. Rather than viewing this as an insurmountable problem, Nafziger offers a compelling perspective: AI's ability to optimize countless processes—from transportation routing to crop yields and manufacturing efficiency—could ultimately lead to net energy savings despite its own substantial power requirements.For the advanced packaging community, the message is clear: your work sits at the foundation of AI's future. As computational demands increase exponentially, innovations in thermal management, power delivery, and component integration will directly determine how quickly and effectively AI can evolve. Connect with Sam Naffziger on LinkedIn or visit AMD.com to learn more about their competitive AI solutions and join the conversation about technology that's reshaping our world.Support the showBecome a sustaining member! Like what you hear? Follow us on LinkedIn and TwitterInterested in reaching a qualified audience of microelectronics industry decision-makers? Invest in host-read advertisements, and promote your company in upcoming episodes. Contact Françoise von Trapp to learn more. Interested in becoming a sponsor of the 3D InCites Podcast? Check out our 2024 Media Kit. Learn more about the 3D InCites Community and how you can become more involved.

Send us a textWhat happens when you gather 75 years of packaging innovation under one roof? The Electronic Component Technology Conference (ECTC) has transformed from a modest gathering of 300 electronics professionals to a powerhouse event attracting over 2,500 industry leaders, researchers, and visionaries. This remarkable journey reflects how advanced packaging has evolved from supporting technology to the driving force behind modern electronics.In this special episode, we speak with three generations of ECTC committee members: Pat Thompson (with 41 years of ECTC experience), Przemek Gromala (10 years), and Florian Herault (since 2010). They share fascinating insights into how the conference has tracked—and often predicted—the industry's most significant shifts. From the days when Ball Grid Arrays were cutting-edge to today's excitement around hybrid bonding and chiplets, ECTC has been the barometer for packaging innovation.The conversation reveals how technologies that once caused standing-room-only excitement have either become industry standards or faded into obscurity. Remember 450mm wafers? That path was abandoned in favor of panel-level packaging. Through-silicon vias struggled with cost issues for years before finding their sweet spot in high-performance applications. And the longstanding debate between System-on-Chip and System-in-Package approaches has evolved into today's heterogeneous integration paradigm.Looking forward, our guests highlight the challenges driving tomorrow's innovations: thermal management for power-hungry AI chips, specialized edge computing architectures, and adapting advanced electronics to automotive and other harsh environments. As Host Françoise von Trapp observes, "It's a great time to be a nerd," with abundant technical challenges ensuring exciting work for packaging professionals for decades to come.Don't miss our upcoming episode featuring ECTC keynote speaker Sam Naffziger discussing responsible AI implementation and the critical role of packaging in creating energy-efficient high-performance devices!Real Talk About MarketingAn Acxiom podcast where we discuss marketing made better, bringing you real...Listen on: Apple Podcasts SpotifySupport the showBecome a sustaining member! Like what you hear? Follow us on LinkedIn and TwitterInterested in reaching a qualified audience of microelectronics industry decision-makers? Invest in host-read advertisements, and promote your company in upcoming episodes. Contact Françoise von Trapp to learn more. Interested in becoming a sponsor of the 3D InCites Podcast? Check out our 2024 Media Kit. Learn more about the 3D InCites Community and how you can become more involved.

Send us a textPratyush Kamal explains how 3DIC technologies are transforming semiconductor design as Moore's Law slows, requiring closer integration between chip and package design to maximize performance.• Traditional chip design treated packaging as an afterthought with designers "throwing designs over the wall"• Economic realities of advanced nodes mean companies now pay more for smaller transistors, driving chiplet adoption• Thermal challenges multiply in 3D stacks as power density doubles with each added layer• Data centers projected to consume 10% of US electricity by 2030, making power efficiency critical• Siemens working to standardize design languages across tools and enable open chiplet ecosystems• Average age of electrical engineers in US is 57, creating urgent need for workforce development• Universal Chiplet Interconnect Express (UCIe) emerging as key standard for chiplet interoperabilityVisit siemens.com/3DIC to learn more about Siemens' comprehensive 3DIC solutions.Siemens EDA Siemens' EDA software helps you turn today's ideas into the sustainable products of the future.Disclaimer: This post contains affiliate links. If you make a purchase, I may receive a commission at no extra cost to you.Support the showBecome a sustaining member! Like what you hear? Follow us on LinkedIn and TwitterInterested in reaching a qualified audience of microelectronics industry decision-makers? Invest in host-read advertisements, and promote your company in upcoming episodes. Contact Françoise von Trapp to learn more. Interested in becoming a sponsor of the 3D InCites Podcast? Check out our 2024 Media Kit. Learn more about the 3D InCites Community and how you can become more involved.

Let's talk toilet troubles. Constipation isn't just a minor inconvenience, it's a signal from your body that something needs attention.Whether it's the occasional discomfort after a big meal, a road trip setback, or a long-term issue, constipation can leave you feeling sluggish and off balance. No matter the cause, I've got you covered with 9 powerful tools to help you shift constipation fast!Subscribe & ReviewI'd absolutely love for you to subscribe to my podcast so you don't miss an episode! I'll be adding a new episode each week, and if you're not subscribed you might miss out. Click here to subscribe in iTunes!If you have a few minutes to spare, I would be so grateful if you left a review over on iTunes. These reviews help other people find my podcast and they're also so much fun for me to read. Just click here to review, select “Ratings and Reviews” and “Write a Review” and let me know what you enjoyed about the podcast. Thank you!Links from today's episodeJoin the 14 Day Gut Detox: https://frandargaville.com/detoxFollow Fran on Instagram: https://www.instagram.com/frandargavilleSubmit a question: frandargaville.com/askfranGot a question you'd like answered? Contact Fran via Instagram on @frandargaville or by email on hello@frandargaville.com.

Send us a textAndrew Mathers, Principal Product Line Manager at Nordson Test and Inspection, discusses the revolutionary advancements in 3D x-ray inspection technology and how they're improving semiconductor manufacturing quality.• X-ray inspection requires high resolution, speed, and cost-effectiveness to drive better product quality• Traditional 2D radiographic imaging is being replaced by 3D imaging for more stringent manufacturing requirements• Planar CT imaging suffers from artifacts when inspecting flat electronic components like circuit boards and wafers• Dynamic Planar CT takes more images from different angles with a wider field of view, reducing artifacts• New technology operates twice as fast as traditional methods while reducing x-ray dose to sensitive components• Automated inspection systems integrate directly into manufacturing lines with no human interaction required• Common applications include detecting voids in ball grid arrays and micro bumps in flip chip devices• The technology supports Quality 4.0 initiatives by providing feedback to improve manufacturing processes• Nordson's systems are in use worldwide with an install base exceeding 2000 automated x-ray inspection systemsLearn more about Dynamic Planar CT and Nordson's x-ray inspection solutions at nordson.com or on their YouTube channel.Nordson Test and Inspection Delivering best-in-class test, inspection, and metrology solutions for semiconductor applications. Disclaimer: This post contains affiliate links. If you make a purchase, I may receive a commission at no extra cost to you.Support the showBecome a sustaining member! Like what you hear? Follow us on LinkedIn and TwitterInterested in reaching a qualified audience of microelectronics industry decision-makers? Invest in host-read advertisements, and promote your company in upcoming episodes. Contact Françoise von Trapp to learn more. Interested in becoming a sponsor of the 3D InCites Podcast? Check out our 2024 Media Kit. Learn more about the 3D InCites Community and how you can become more involved.

Send us a textThe IEEE MTTS International Microwave Symposium attracts over 9,000 attendees and 500+ exhibitors to share cutting-edge developments in RF, microwave, and advanced packaging technologies. Tim Hancock and Jim Buckwalter from the IMS committee explain why this premier event, taking place in San Francisco's Moscone Center from June 15-20, has become increasingly relevant to professionals in advanced packaging and heterogeneous integration.• Approximately 15% of accepted papers directly address packaging and heterogeneous integration topics• Papers undergo rigorous double-blind review with an in-person committee meeting to ensure highest quality content• Technical focus includes laminate technology, chip stacking, thermal management, and other critical packaging technologies• Special workshops address 3D heterogeneous integration, millimeter-wave phased arrays, and advanced packaging solutions• Exhibition floor features 500+ companies providing networking opportunities and technology discovery• Student programs include design competitions, volunteer opportunities, and dedicated sessions for underrepresented groups• Early bird registration ends May 16th with regular registration continuing at ims-ieee.orgRegister at ims-ieee.org to secure your spot and book accommodations before they fill up.THE 2025 IEEE MTT-S IMSThe 2025 IEEE MTT-S IMS is the largest event for RF and microwave professionals in the world.Disclaimer: This post contains affiliate links. If you make a purchase, I may receive a commission at no extra cost to you.Support the showBecome a sustaining member! Like what you hear? Follow us on LinkedIn and TwitterInterested in reaching a qualified audience of microelectronics industry decision-makers? Invest in host-read advertisements, and promote your company in upcoming episodes. Contact Françoise von Trapp to learn more. Interested in becoming a sponsor of the 3D InCites Podcast? Check out our 2024 Media Kit. Learn more about the 3D InCites Community and how you can become more involved.

Dealing with an inflamed gut? Whether it's from a dodgy meal, a recent stomach bug, or just a sensitive system, it can be hard to know what to eat. In this episode, we're clearing up the confusion and walking you through exactly what to eat to soothe inflammation and support real gut healing.We'll cover:᭼ Why the BRAT diet (bananas, rice, applesauce, toast) is outdated᭼ The best gut-soothing foods that are gentle yet nourishing᭼ Extra tips and tricks to support you along the waySo, if you're stuck on what to eat when your gut's acting up, this episode's for you.Subscribe & ReviewI'd absolutely love for you to subscribe to my podcast so you don't miss an episode! I'll be adding a new episode each week, and if you're not subscribed you might miss out. Click here to subscribe in iTunes!If you have a few minutes to spare, I would be so grateful if you left a review over on iTunes. These reviews help other people find my podcast and they're also so much fun for me to read. Just click here to review, select “Ratings and Reviews” and “Write a Review” and let me know what you enjoyed about the podcast. Thank you!Links from today's episodeJoin the 14 Day Gut Detox: https://frandargaville.com/detoxFollow Fran on Instagram: https://www.instagram.com/frandargavilleSubmit a question: frandargaville.com/askfranClick here to book a free call with Fran: https://frandargaville.com/callGot a question you'd like answered? Contact Fran via Instagram on @frandargaville or by email on hello@frandargaville.com.

Ever felt confused by all the buzz around probiotics? You're not alone! In this episode, we're busting the biggest myths about probiotics and setting the record straight on what's actually true.We'll cover:᭼ Why probiotics aren't just for gut issues (yep, they impact so much more!)᭼ The truth about taking probiotics during antibiotics — is it a waste of money, or actually helpful?᭼ Do you actually need probiotics at all? Is a higher dose better? What about strain types?So, if you've ever wondered whether probiotics are worth the hype (or if you're just tired of all the conflicting info out there), this episode is for you. Let's get clear on how to make the most of probiotics and whether they're right for you.Subscribe & ReviewI'd absolutely love for you to subscribe to my podcast so you don't miss an episode! I'll be adding a new episode each week, and if you're not subscribed you might miss out. Click here to subscribe in iTunes!If you have a few minutes to spare, I would be so grateful if you left a review over on iTunes. These reviews help other people find my podcast and they're also so much fun for me to read. Just click here to review, select “Ratings and Reviews” and “Write a Review” and let me know what you enjoyed about the podcast. Thank you!Links from today's episodeTry my favourite collagen from Nutra Organics! Use code ‘FRAN15' at checkout or follow this link for 15% off: https://bit.ly/3QjXKDcJoin the 14 Day Gut Detox: https://frandargaville.com/detoxFollow Fran on Instagram: https://www.instagram.com/frandargavilleSubmit a question: frandargaville.com/askfranClick here to book a free call with Fran: https://frandargaville.com/callGot a question you'd like answered? Contact Fran via Instagram on @frandargaville or by email on hello@frandargaville.com.

Send us a textAcoustic inspection stands as a silent sentinel in semiconductor manufacturing, detecting microscopic defects that could lead to catastrophic failures in high-value applications. Bryan Schackmuth, Senior Product Line Manager at Nordson Test and Inspection, reveals how this technology has evolved from laboratory tools to production-line essentials.When ultrasound encounters even the tiniest air gap—we're talking hundreds of angstroms—it reflects completely, making acoustic imaging uniquely powerful for evaluating bonds between materials. While optical inspection shows surface defects and X-ray reveals density variations, acoustic inspection peers between layers, identifying delamination and other hidden flaws that might otherwise escape detection until field failure.The challenges of advanced packaging have driven significant innovation in acoustic inspection technology. As manufacturers stack more die, create complex interconnects, and push toward heterogeneous integration, the value of each wafer increases dramatically. Nordson's SpinSam system represents a breakthrough in this space, replacing traditional raster scanning with a rotational approach that achieves 41 wafers per hour—eight times faster than previous generation technology—while maintaining resolution down to 10 microns.Beyond pure speed, the system's spinning scan technology offers unique advantages for edge inspection where defects are more common due to coefficient of thermal expansion effects. The modular design allows maintenance on individual scanners while others continue operating, maximizing uptime in production environments. Most exciting is the integration of AI and machine learning for defect detection, moving beyond simple thresholds to analyze complex multilayer images simultaneously.Want to see how your inspection strategies might benefit from these advances? Check out Nordson's SpinSam technology at nordson.com and discover how acoustic inspection is helping manufacturers achieve higher yields and more reliable products in today's most demanding semiconductor applications.Support the showBecome a sustaining member! Like what you hear? Follow us on LinkedIn and TwitterInterested in reaching a qualified audience of microelectronics industry decision-makers? Invest in host-read advertisements, and promote your company in upcoming episodes. Contact Françoise von Trapp to learn more. Interested in becoming a sponsor of the 3D InCites Podcast? Check out our 2024 Media Kit. Learn more about the 3D InCites Community and how you can become more involved.

Send us a textThe 3D InCites Podcast celebrates microelectronics industry innovation with a special episode featuring this year's award winners in heterogeneous integration and chiplet technology.• SallyAnn Henry, Jim Straus and David Wang, ACM Research, describe a horizontal rotation plating system for panel-level packaging with superior uniformity across square substrates• Eric Gongora, of MacDermid Alpha, explains how NovaFab fine-grained copper enables hybrid bonding with customizable annealing times and improved electron migration resistance• Chuck Woychik, NHanced Semiconductors, talks about how the company brings hybrid bonding capabilities onshore with expertise in wafer processing for both defense and commercial applications• Keith Felton, Siemens Digital Industries Software, introduces Innovator 3DIC for hierarchical device planning that automatically propagates design changes throughout chiplet interfaces• Kazuyuki Mitsukura explains how Resonac builds collaborative consortia in Japan and the US to solve complex advanced packaging challenges through shared resources• Rex Anderson from Micross shares his engineering journey and passion for mentoring the next generation of technologists• Ron Huemoeller and Eelco Bergman discuss how Saras Micro Devices addresses AI power challenges with embeddable S-Tile capacitors. They also talk about Saras corporate culture.EV Group EV Groups supplies high-volume equipment and process solutions for semiconductor manufacturing. KLA, SPTS Division KLA provides semiconductor equipment for metrology, inspection, wafer processing, and more. Disclaimer: This post contains affiliate links. If you make a purchase, I may receive a commission at no extra cost to you.Support the showBecome a sustaining member! Like what you hear? Follow us on LinkedIn and TwitterInterested in reaching a qualified audience of microelectronics industry decision-makers? Invest in host-read advertisements, and promote your company in upcoming episodes. Contact Françoise von Trapp to learn more. Interested in becoming a sponsor of the 3D InCites Podcast? Check out our 2024 Media Kit. Learn more about the 3D InCites Community and how you can become more involved.

Do you want to feel more energised, reduce bloating, improve digestion, and boost your mood? What if I told you this is all achievable in just 2 weeks WITHOUT any extreme diets or expensive supplements!In this episode, I'm sharing simple but effective, science-backed nutrition tips that can reset your gut and have you feeling your absolute best.We'll cover: ᭼ The key principles of the Gut Detox Diet ᭼ Practical tips for implement the diet ᭼ Where other gut-healing approaches miss the mark᭼ What you can expect after just 2 weeksSubscribe & ReviewI'd absolutely love for you to subscribe to my podcast so you don't miss an episode! I'll be adding a new episode each week, and if you're not subscribed you might miss out. Click here to subscribe in iTunes!If you have a few minutes to spare, I would be so grateful if you left a review over on iTunes. These reviews help other people find my podcast and they're also so much fun for me to read. Just click here to review, select “Ratings and Reviews” and “Write a Review” and let me know what you enjoyed about the podcast. Thank you!Links from today's episodeJoin the 14 Day Gut Detox: https://frandargaville.com/detoxFollow Fran on Instagram: https://www.instagram.com/frandargavilleSubmit a question: frandargaville.com/askfranClick here to book a free call with Fran: https://frandargaville.com/callGot a question you'd like answered? Contact Fran via Instagram on @frandargaville or by email on hello@frandargaville.com.

Send us a textNavigating today's complex manufacturing landscape demands unprecedented supply chain resilience. This eye-opening conversation with Barry O'Dowd (Kuehne+Nagel) and Kamal Aluwalia (Resilinc) reveals why robust supply chains matter more than ever—particularly for semiconductor capital equipment.The semiconductor industry operates at extraordinary precision, with equipment working at scales as small as five nanometers—roughly 1/18,000th the width of a human hair. This precision makes these multi-million dollar tools exceptionally vulnerable during transport, requiring meticulous handling across tens of thousands of miles between manufacturing and installation. With leading-edge fabs costing up to $20 billion, equipment failures or delays can trigger catastrophic financial consequences.Our experts explain how companies are reimagining resilience through sophisticated data analysis, multi-tier visibility, and proactive risk management. Barry shares how Kuehne+Nagel's risk mitigator tool brings together all supply chain stakeholders to identify vulnerabilities and implement mitigation strategies—expertise developed during their flawless delivery of over 2 billion COVID vaccines. Meanwhile, Kamal describes how Resolink helps organizations leverage AI to anticipate disruptions across 40 different risk categories, from natural disasters to financial instability.The conversation offers practical advice for strengthening your own supply chain: understand your end-to-end process, engage with experienced partners, and adopt a first-principles approach to reimagining resilience with current technology. As global uncertainties continue mounting—from geopolitical tensions to extreme weather events—supply chain resilience isn't merely about risk avoidance; it's becoming a strategic competitive advantage.Kuehne+NagelTrust Semicon Logistics by Kuehne+Nagel to navigate even the most demanding supply chain challenges.Disclaimer: This post contains affiliate links. If you make a purchase, I may receive a commission at no extra cost to you.Support the showBecome a sustaining member! Like what you hear? Follow us on LinkedIn and TwitterInterested in reaching a qualified audience of microelectronics industry decision-makers? Invest in host-read advertisements, and promote your company in upcoming episodes. Contact Françoise von Trapp to learn more. Interested in becoming a sponsor of the 3D InCites Podcast? Check out our 2024 Media Kit. Learn more about the 3D InCites Community and how you can become more involved.

Send us a textThe 3D InCites Member Spotlight episode features exclusive conversations with industry leaders at IMAPS Device Packaging Conference 2025, exploring the cutting-edge of semiconductor packaging innovation and domestic manufacturing expansion.• Rex Anderson of Micross details their RESHAPE program funding and Integra acquisition, establishing them as North America's largest domestic OSAT• Calvin Cheung of ASE explains how advanced packaging enables AI infrastructure while reducing power consumption by 40-60% through vertical power delivery. He also describes silicon photonics emerging as a game-changer for data transmission, using light instead of electrons for faster, more energy-efficient signal integrity• Keith Felton of Siemens discusses digital twin technology allowing early predictive analysis during package prototyping to prevent costly downstream engineer change orders - or ECOs.• Vahid Akhavan highlights PulseForge's photonic debonding technology partnerships for clean, high-yield wafer release• Bernd Krafthoefer and Florian Lechner, ERS Electonic representatives,  share insights on their new European competence center and sub-micron photonic debonding capabilities for 300mm wafers.Join us next week as we explore supply chain resilience in the semiconductor capital equipment sector with Barry O'Dowd from Kuehne+Nagel and special guest Kamal Aluwalia, CEO of Resilinc. Learn more about member benefits at 3DInCites.com/memberships.IMAPS Device Packaging ConferenceInterconnects for Tomorrow's Applications Disclaimer: This post contains affiliate links. If you make a purchase, I may receive a commission at no extra cost to you.Support the showBecome a sustaining member! Like what you hear? Follow us on LinkedIn and TwitterInterested in reaching a qualified audience of microelectronics industry decision-makers? Invest in host-read advertisements, and promote your company in upcoming episodes. Contact Françoise von Trapp to learn more. Interested in becoming a sponsor of the 3D InCites Podcast? Check out our 2024 Media Kit. Learn more about the 3D InCites Community and how you can become more involved.

Are you ready to prioritise your gut health without draining your wallet? In today's episode, I'm sharing how you can improve your gut health with simple, budget-friendly strategies that won't break the bank.We'll cover:᭼ Why gut health is key to feeling your best all-round᭼ Budget-friendly staples that'll support your gut without the hefty price tag᭼ How to get gut-boosting superfoods like broth and sauerkraut in an affordable wayLet's dive in and make gut health easy and affordable – no stress about the grocery bill!Subscribe & ReviewI'd absolutely love for you to subscribe to my podcast so you don't miss an episode! I'll be adding a new episode each week, and if you're not subscribed you might miss out. Click here to subscribe in iTunes!If you have a few minutes to spare, I would be so grateful if you left a review over on iTunes. These reviews help other people find my podcast and they're also so much fun for me to read. Just click here to review, select “Ratings and Reviews” and “Write a Review” and let me know what you enjoyed about the podcast. Thank you!Links from today's episodeTry my favourite collagen from Nutra Organics! Use code ‘FRAN15' at checkout or follow this link for 15% off: https://bit.ly/3QjXKDcJoin the 14 Day Gut Detox: https://frandargaville.com/detoxFollow Fran on Instagram: https://www.instagram.com/frandargavilleSubmit a question: frandargaville.com/askfranClick here to book a free call with Fran: https://frandargaville.com/callGot a question you'd like answered? Contact Fran via Instagram on @frandargaville or by email on hello@frandargaville.com.

Send us a textArizona is transforming into the "Silicon Oasis" of America through an unprecedented collaboration that's reshaping semiconductor education from high school through graduate studies. At the heart of this revolution is a groundbreaking partnership between the University of Arizona and Chandler Unified School District, launching the nation's first high school career and technical education program focused on semiconductor manufacturing.Starting July 2025, forty students will begin a two-year journey learning on industry-grade equipment—not "glorified children's toys" but actual mechatronic systems, universal robots, and PCB printing technology. What makes this program revolutionary is its design for multiple pathways; graduates can either enter the workforce immediately as technicians or continue to higher education with college credits already earned.Meanwhile, Arizona State University is building the advanced end of this educational pipeline through CHIPS Act-funded initiatives like the Southwest Advanced Prototyping Hub and the SHIELD project. Graduate courses in semiconductor packaging have exploded in popularity, growing from just 27 students to over 175 in two years. The university is getting creative with outreach too, developing a "Packaging on Wheels" mobile facility to bring semiconductor education to schools nationwide.The strength of Arizona's approach lies in its extensive industry involvement. Fifteen major companies form the steering committee for the high school program, providing real-world problems and case studies. Students from diverse backgrounds—electrical, mechanical, materials science, and chemical engineering—all find pathways into this multidisciplinary field.As one industry expert notes, students with hands-on, industry-specific training demonstrate markedly better performance both during interviews and on the job. This educational ecosystem is creating not just the chips of tomorrow, but the workforce that will design, build, and innovate them. Contact Our Guests on LinkedIn: Scott Hayes, NXPLiesl Folks, University of ArizonaJanet Hartkopf, Chandler Unified School DistrictChris Bailey, ASUPallavi Praful, ASU Rohit Gandhi, ASU IMAPS Device Packaging ConferenceInterconnects for Tomorrow's Applications Disclaimer: This post contains affiliate links. If you make a purchase, I may receive a commission at no extra cost to you.Support the showBecome a sustaining member! Like what you hear? Follow us on LinkedIn and TwitterInterested in reaching a qualified audience of microelectronics industry decision-makers? Invest in host-read advertisements, and promote your company in upcoming episodes. Contact Françoise von Trapp to learn more. Interested in becoming a sponsor of the 3D InCites Podcast? Check out our 2024 Media Kit. Learn more about the 3D InCites Community and how you can become more involved.

Send us a textWhat happens when AI diagnoses patients better than doctors? Where does artificial intelligence truly stand on the hype cycle? Is all this computational power actually benefiting society? These critical questions frame our fascinating discussion recorded live at IMAPS Device Packaging Conference in Phoenix, Arizona. Join our expert panel featuring Hemanth Jagannathan (IBM Research), Mark Kumerle (Marvell), and Kimon Michaels (PDF Solutions) as they tackle AI's most pressing challenges and opportunities. Their collective expertise reveals surprising insights about how AI is transforming industries while raising important considerations about its implementation.The conversation explores AI's evolution from specialized technical applications in semiconductors to today's consumer-facing generative tools. Our experts draw fascinating parallels between AI and previous technological breakthroughs like laser technology, suggesting we've only scratched the surface of potential applications. They provide compelling examples from healthcare where AI systems demonstrate superior diagnostic capabilities by processing complex datasets beyond human capacity.While acknowledging concerns around data accuracy, power consumption, and appropriate boundaries, the panel remains optimistic about AI's future. They emphasize that today's implementations represent merely the beginning of a transformative technology whose full impact remains largely unanticipated. Yet they also agree on applications where human judgment should remain primary – including, amusingly, matchmaking.Dive into this thought-provoking conversation to understand why organizations must either leverage AI effectively or risk being outpaced by competitors who do. Subscribe to 3D IncItes Podcast for more cutting-edge discussions on technologies shaping our future.IMAPS Device Packaging ConferenceInterconnects for Tomorrow's Applications Disclaimer: This post contains affiliate links. If you make a purchase, I may receive a commission at no extra cost to you.Support the showBecome a sustaining member! Like what you hear? Follow us on LinkedIn and TwitterInterested in reaching a qualified audience of microelectronics industry decision-makers? Invest in host-read advertisements, and promote your company in upcoming episodes. Contact Françoise von Trapp to learn more. Interested in becoming a sponsor of the 3D InCites Podcast? Check out our 2024 Media Kit. Learn more about the 3D InCites Community and how you can become more involved.

Your body is always talking to you, so if you've been dealing with bloating, discomfort, or feeling "off" after eating certain foods, it may be time to start listening. This week, I'm here to help you decode your body's signals and guide you toward targeted solutions that actually work. If any of these symptoms sound familiar, this episode is for you:᭼ Bloating, gas, and burping after eating garlic, onion, or fibre-rich foods᭼ Discomfort after eating meat᭼ Feeling sick after eating fatty foods᭼ Sugar cravings, bloating, or a white-coated tongue after sugar᭼ Post-nasal drip, throat clearing, or mucus after dairySubscribe & ReviewI'd absolutely love for you to subscribe to my podcast so you don't miss an episode! I'll be adding a new episode each week, and if you're not subscribed you might miss out. Click here to subscribe in iTunes!If you have a few minutes to spare, I would be so grateful if you left a review over on iTunes. These reviews help other people find my podcast and they're also so much fun for me to read. Just click here to review, select “Ratings and Reviews” and “Write a Review” and let me know what you enjoyed about the podcast. Thank you!Links from today's episodeJoin the 14 Day Gut Detox: https://frandargaville.com/detoxFollow Fran on Instagram: https://www.instagram.com/frandargavilleSubmit a question: frandargaville.com/askfranClick here to book a free call with Fran: https://frandargaville.com/callGot a question you'd like answered? Contact Fran via Instagram on @frandargaville or by email on hello@frandargaville.com.

Are you tired of feeling sluggish, bloated or just a bit off? Then this is the pep talk you need to start feeling your best. This week, I'm going to explain why you should ditch the trendy health fads and “miracle” fixes, and instead get back to the basics. It's time to simplify and focus on the habits that truly make a difference when it comes to your health. So grab a cuppa, relax, and let's dive into the core principles that will leave you feeling bloody good. Here's what we'll cover:᭼ Why sticking to the basics is the key to lasting progress᭼ 6 core principles for feeling your best (and how to make them work for you)᭼ Where to start and how to build habits that stick᭼ Why consistency beats perfection, every timeSubscribe & ReviewI'd absolutely love for you to subscribe to my podcast so you don't miss an episode! I'll be adding a new episode each week, and if you're not subscribed you might miss out. Click here to subscribe in iTunes!If you have a few minutes to spare, I would be so grateful if you left a review over on iTunes. These reviews help other people find my podcast and they're also so much fun for me to read. Just click here to review, select “Ratings and Reviews” and “Write a Review” and let me know what you enjoyed about the podcast. Thank you!Links from today's episodeJoin the 14 Day Gut Detox: https://frandargaville.com/detoxFollow Fran on Instagram: https://www.instagram.com/frandargavilleSubmit a question: frandargaville.com/askfranClick here to book a free call with Fran: https://frandargaville.com/callGot a question you'd like answered? Contact Fran via Instagram on @frandargaville or by email on hello@frandargaville.com.

Send us a textExplore the transformative world of microelectronics packaging with industry visionaries Amy Lujan, Tim Olson, and Jan Vardaman as they share their journey at the IMAPS Annual Device Packaging Conference (DPC). With the conference relocating to the vast Wild Horse Pass, expect an enriched experience with expanded technical tracks and exhibitor opportunities reflecting the rising interest in this field. Get ready to embrace the future of packaging with insights that redefine its significance in the semiconductor industry.Uncover the critical challenges facing AI infrastructure in a thought-provoking panel discussion with experts from IBM Research, Intel, and leading OSATs. We'll tackle whether today's infrastructure can keep pace with AI's explosive growth, especially concerning energy-efficient chip designs and packaging solutions. Learn about groundbreaking advancements and the potential to alleviate data center power consumption concerns through innovative packaging techniques. Beyond the tech talk, we'll highlight the vibrant networking scene at the conference, featuring events like the Backyard Olympics and a charity golf tournament, ensuring a perfect blend of professional growth and community building. Join us for a chance to network, learn, and potentially reshape the future of microelectronics packaging.IMAPS Device Packaging ConferenceInterconnects for Tomorrow's Applications Disclaimer: This post contains affiliate links. If you make a purchase, I may receive a commission at no extra cost to you.Support the showBecome a sustaining member! Like what you hear? Follow us on LinkedIn and TwitterInterested in reaching a qualified audience of microelectronics industry decision-makers? Invest in host-read advertisements, and promote your company in upcoming episodes. Contact Françoise von Trapp to learn more. Interested in becoming a sponsor of the 3D InCites Podcast? Check out our 2024 Media Kit. Learn more about the 3D InCites Community and how you can become more involved.

Send us a textThe episode explores the key insights from the recent SEMI ISS event, focusing on the semiconductor industry's journey toward a trillion-dollar market by 2030. It discusses the significant themes of uncertainty and the transformative impact of AI, while also addressing industry challenges and emerging trends.Additionally, SEMI's Market Intelligence team dive into the revised 2024 equipment forecast and World Fab Forecast, discussing trends influenced by AI technology and geopolitical factors, especially those linked to China. As we detail the upswing in equipment sales, driven by Chinese investments and AI progress, we also spotlight the trends shaping both front and back-end equipment markets. From the resurgence of advanced packaging to the anticipated rebound in test equipment, this episode provides a thorough look at the semiconductor industry's current state and its promising future, including insights into the world fab forecast and its implications for the automotive and power sectors.Highlights:• Overview of SEMI ISS and its significance in the semiconductor industry • Highlights on this year's theme: Ready, Set Ramp! and its implications • Insights on overcoming market uncertainties and challenges • AI's transformative role in driving semiconductor innovation • Discussion of upcoming semi events and their importance for networking • Market intelligence updates on forecasts and growth opportunitiesContact Our Guests on LinkedIn: Joe Stockunas, President, SEMI AmericasChristian Dieseldorf, Senior Analyst, SEMI MITInna Skvortsova, Market Analyst, SEMI MIT SEMIA global association, SEMI represents the entire electronics manufacturing and design supply chain. Disclaimer: This post contains affiliate links. If you make a purchase, I may receive a commission at no extra cost to you.Support the showBecome a sustaining member! Like what you hear? Follow us on LinkedIn and TwitterInterested in reaching a qualified audience of microelectronics industry decision-makers? Invest in host-read advertisements, and promote your company in upcoming episodes. Contact Françoise von Trapp to learn more. Interested in becoming a sponsor of the 3D InCites Podcast? Check out our 2024 Media Kit. Learn more about the 3D InCites Community and how you can become more involved.

In today's episode, I'm joined by a very special guest, Dr. Pedre, a Board-Certified Functional Medicine Practitioner and pioneer in the gut health space. We take a deep dive into his personal philosophy on gut health and tackle some of the biggest myths and misconceptions that can leave people confused—like the real story behind gluten, coffee, and reflux. If you've ever wondered whether these so-called “gut offenders” are as bad as they're made out to be, you definitely won't want to miss this eye-opening conversation!Subscribe & ReviewI'd absolutely love for you to subscribe to my podcast so you don't miss an episode! I'll be adding a new episode each week, and if you're not subscribed you might miss out. Click here to subscribe in iTunes!If you have a few minutes to spare, I would be so grateful if you left a review over on iTunes. These reviews help other people find my podcast and they're also so much fun for me to read. Just click here to review, select “Ratings and Reviews” and “Write a Review” and let me know what you enjoyed about the podcast. Thank you!Links from today's episodeJoin the 14 Day Gut Detox: https://frandargaville.com/detoxFollow Fran on Instagram: https://www.instagram.com/frandargavilleSubmit a question: frandargaville.com/askfranClick here to book a free call with Fran: https://frandargaville.com/callGot a question you'd like answered? Contact Fran via Instagram on @frandargaville or by email on hello@frandargaville.com.

Today's episode is one of our less glamorous topics BUT it's definitely an important one when it comes to gut health. We're talking diarrhoea and loose stools. Let's be real, we've all been there, and it can be disruptive to say the least.While an occasional loose stool might not be a big concern, chronic diarrhoea can greatly affect your day-to-day life and overall health. In this episode, I'll walk you through the most common causes to help you pinpoint what may be going on and I'll share natural solutions to help get your gut back on track.This week you'll learn:᭼ The most common causes of diarrhoea and loose stools᭼ Natural solutions to support your gut and manage symptomsSubscribe & ReviewI'd absolutely love for you to subscribe to my podcast so you don't miss an episode! I'll be adding a new episode each week, and if you're not subscribed you might miss out. Click here to subscribe in iTunes!If you have a few minutes to spare, I would be so grateful if you left a review over on iTunes. These reviews help other people find my podcast and they're also so much fun for me to read. Just click here to review, select “Ratings and Reviews” and “Write a Review” and let me know what you enjoyed about the podcast. Thank you!Links from today's episodeJoin the 14 Day Gut Detox: https://frandargaville.com/detoxFollow Fran on Instagram: https://www.instagram.com/frandargavilleSubmit a question: frandargaville.com/askfranClick here to book a free call with Fran: https://frandargaville.com/callGot a question you'd like answered? Contact Fran via Instagram on @frandargaville or by email on hello@frandargaville.com.

Do you kick off the new year feeling excited to make changes, only to get overwhelmed by big goals and lose momentum by February? If that sounds familiar, this episode has you covered!In this episode I'm diving into how to approach the new year with intention, clarity, and excitement—so you can stay inspired and empowered to make 2025 YOUR year, on YOUR terms.Subscribe & ReviewI'd absolutely love for you to subscribe to my podcast so you don't miss an episode! I'll be adding a new episode each week, and if you're not subscribed you might miss out. Click here to subscribe in iTunes!If you have a few minutes to spare, I would be so grateful if you left a review over on iTunes. These reviews help other people find my podcast and they're also so much fun for me to read. Just click here to review, select “Ratings and Reviews” and “Write a Review” and let me know what you enjoyed about the podcast. Thank you!Links from today's episodeJoin the 14 Day Gut Detox: https://frandargaville.com/detoxFollow Fran on Instagram: https://www.instagram.com/frandargavilleSubmit a question: frandargaville.com/askfranClick here to book a free call with Fran: https://frandargaville.com/callGot a question you'd like answered? Contact Fran via Instagram on @frandargaville or by email on hello@frandargaville.com.

Send us a textUnlock the secrets of semiconductor packaging materials with insights from industry experts Dariush Tari and Rose Guino of Henkel's Semiconductor Packaging Materials Division. This episode promises a deep dive into the processes behind developing materials that are both reliable and high-performing, crucial for the ever-evolving demands of AI, machine learning, and quantum technologies. Dariush and Rose share their wealth of knowledge on material characterization, modeling, and application engineering, and discuss how Henkel maintains its pivotal role within the semiconductor ecosystem. From underfills to thermal interface materials, discover how comprehensive material offerings are shaping the future of high-performance computing.Explore the fascinating advancements in material modeling for semiconductors, where physics-based simulations are transforming reliability testing and development cycles. Gain a clearer understanding of capillary underfill materials and their vital role in enhancing solder joint reliability under thermal stress. This episode delves into the collaboration between material developers and modeling experts, underscoring the importance of early customer engagement to tailor innovative solutions. If you are interested in learning how cutting-edge materials are propelling the semiconductor industry forward, this conversation is a must-listen.Contact the Speakers on LinkedInDariush Tari, Henkel Semiconductor Packaging MaterialsRose Guino, Semiconductor Packaging Materials Henkel Semiconductor Packaging MaterialsHenke's advanced materials elevate semiconductor packaging to meet power, performance, area and costDisclaimer: This post contains affiliate links. If you make a purchase, I may receive a commission at no extra cost to you.Support the showBecome a sustaining member! Like what you hear? Follow us on LinkedIn and TwitterInterested in reaching a qualified audience of microelectronics industry decision-makers? Invest in host-read advertisements, and promote your company in upcoming episodes. Contact Françoise von Trapp to learn more. Interested in becoming a sponsor of the 3D InCites Podcast? Check out our 2024 Media Kit. Learn more about the 3D InCites Community and how you can become more involved.

With the holiday season in full swing it's no secret that alcohol can be a big part of the celebrations. The good news is, there's a way to enjoy it without wreaking havoc on your gut.Now, I'm sure we all know that from a purely physical perspective, alcohol isn't the healthiest choice, but that doesn't mean you can't enjoy a drink or two—especially when you do it mindfully. This week, I'm sharing my top tips for enjoying alcohol in a way that's gentler on your body, so you can indulge without the guilt or negative side effects.Subscribe & ReviewI'd absolutely love for you to subscribe to my podcast so you don't miss an episode! I'll be adding a new episode each week, and if you're not subscribed you might miss out. Click here to subscribe in iTunes!If you have a few minutes to spare, I would be so grateful if you left a review over on iTunes. These reviews help other people find my podcast and they're also so much fun for me to read. Just click here to review, select “Ratings and Reviews” and “Write a Review” and let me know what you enjoyed about the podcast. Thank you!Links from today's episodeJoin the 14 Day Gut Detox: https://frandargaville.com/detoxFollow Fran on Instagram: https://www.instagram.com/frandargavilleSubmit a question: frandargaville.com/askfranClick here to book a free call with Fran: https://frandargaville.com/callGot a question you'd like answered? Contact Fran via Instagram on @frandargaville or by email on hello@frandargaville.com.

Send us a textThis episode was recorded live at SEMICON Europa. Michael Zahn from Koh Young talks to Françoise von Trapp about the growing significance of metrology in semiconductor manufacturing and the need for advanced measurement technologies.  They discuss the transition from 2D to 3D measurements in semiconductor manufacturing.  Zahn explains why  non-destructive, optical 3D measurements offer precise height and position data with sub-micron resolution. You'll learn how these measurements are crucial for early defect detection, improving efficiency, and reducing waste. You'll also gain an understanding about the importance of real-time, in-line measurements for quality assurance and process optimization. Zahn also highlights Koh Young's AI integration for process control and the future potential of sub-micron resolution systems. Contact Michael Zahn on LinkedInKoh Young EuropeKoh Young paves the way for smart factory solutions with 3D measurement-based inspection solutions.Disclaimer: This post contains affiliate links. If you make a purchase, I may receive a commission at no extra cost to you.Support the showBecome a sustaining member! Like what you hear? Follow us on LinkedIn and TwitterInterested in reaching a qualified audience of microelectronics industry decision-makers? Invest in host-read advertisements, and promote your company in upcoming episodes. Contact Françoise von Trapp to learn more. Interested in becoming a sponsor of the 3D InCites Podcast? Check out our 2024 Media Kit. Learn more about the 3D InCites Community and how you can become more involved.

The holiday season is here and let's face it, between the festive meals, extra treats and endless Christmas parties, it can be easy to overindulge. So If you're often left feeling sluggish and uncomfortably bloated after a little too much Christmas ham, then I've got you covered!In this episode, I'm sharing simple, science-backed tips to help you beat the bloat fast. Whether you're dealing with post-feast discomfort or just want to feel like yourself again, these strategies will help you reset, recover, and get back to feeling your best—without the guilt. Subscribe & ReviewI'd absolutely love for you to subscribe to my podcast so you don't miss an episode! I'll be adding a new episode each week, and if you're not subscribed you might miss out. Click here to subscribe in iTunes!If you have a few minutes to spare, I would be so grateful if you left a review over on iTunes. These reviews help other people find my podcast and they're also so much fun for me to read. Just click here to review, select “Ratings and Reviews” and “Write a Review” and let me know what you enjoyed about the podcast. Thank you!Links from today's episodeJoin the 14 Day Gut Detox: https://frandargaville.com/detoxFollow Fran on Instagram: https://www.instagram.com/frandargavilleSubmit a question: frandargaville.com/askfranClick here to book a free call with Fran: https://frandargaville.com/callGot a question you'd like answered? Contact Fran via Instagram on @frandargaville or by email on hello@frandargaville.com.

Send us a textThis episode was recorded live at SEMICON Europa. It features interviews with four of the 20 under 30 Recognition Award recipients from Cadence, ERS Electronic, KLA, and Semilab.  It also features updates from Comet Yxlon, Trymax Semiconductor, and DSV-IMS. SEMI Europe's 20 Under 30 program recognizes future leaders in the microelectronics industry. James McGrath from KLA discussed his role as a PE CBD Process Engineer and his unexpected entry into the semiconductor industry. Augustin Detruit from ERS Electronics highlighted his growth from a master's thesis to Head of Production, overseeing a significant increase in production capacity. Luca Sinkó from Semilab shared her journey from physics to R&D Team Leader and her recent promotion to Product Manager. Charis Kalantzi from Cadence detailed her role in supporting digital design tools and her involvement in community volunteering. All four talk about what brought them into the semiconductor industry, what made them stand out to the judges, and the honor of receiving such an award. From Dionys van de Ven, we hear about the announced the launch of Comet Yxlon's new 3D X-ray system for fab-level yield improvement, Peter Dijkstra from Trymax, discussed what is driving the company's growth and it's expansion into the U.S. market.Spencer Wall talks about DSV's acquisition of Schenker, and shares the progress so far. Michael Murray talks about DSV-IMS foray into using AI and machine learning to improve supply chain efficiencies. Support the showBecome a sustaining member! Like what you hear? Follow us on LinkedIn and TwitterInterested in reaching a qualified audience of microelectronics industry decision-makers? Invest in host-read advertisements, and promote your company in upcoming episodes. Contact Françoise von Trapp to learn more. Interested in becoming a sponsor of the 3D InCites Podcast? Check out our 2024 Media Kit. Learn more about the 3D InCites Community and how you can become more involved.

Today we're talking about STRESS! So many people experiencing bloating, fatigue, brain fog, or even PMS don't realise how much of this can be linked to stress. It's a powerful root cause of symptoms, especially those related to digestion.In this episode, we're diving into:- Our body's stress regulation system and how it works.- Key sources of stress—beyond just emotional stress!- How stress impacts digestion and gut health.- Practical tips for managing stress to support a happy, healthy gut.Subscribe & ReviewI'd absolutely love for you to subscribe to my podcast so you don't miss an episode! I'll be adding a new episode each week, and if you're not subscribed you might miss out. Click here to subscribe in iTunes!If you have a few minutes to spare, I would be so grateful if you left a review over on iTunes. These reviews help other people find my podcast and they're also so much fun for me to read. Just click here to review, select “Ratings and Reviews” and “Write a Review” and let me know what you enjoyed about the podcast. Thank you!Links from today's episodeJoin the 14 Day Gut Detox: https://frandargaville.com/detoxFollow Fran on Instagram: https://www.instagram.com/frandargavilleSubmit a question: frandargaville.com/askfranClick here to book a free call with Fran: https://frandargaville.com/callGot a question you'd like answered? Contact Fran via Instagram on @frandargaville or by email on hello@frandargaville.com.

Send us a textIn this episode, recorded live at SEMICON Europa in Munich, Françoise von Trapp continues her conversations with the keynote speakers on helping to build Europe's technical sovereignty, and how implementing digital twins can help achieve this goal. John Behnke, of Inficon, discussed the evolution of smart manufacturing in the semiconductor industry. He highlighted how smart software can increase factory productivity by 5-15% by making autonomous decisions based on digital twins. You'll learn about Behnke's vision for the Smart Control Room. Catherine Le Lan, Synopsys, emphasized the need for collaboration between academia and industry to address the talent shortage, suggesting cross-disciplinary education and early branding of microelectronics. Katharina Westrich, Siemens, explained how digital twins optimize factory planning, reduce emissions, and train workforce remotely, envisioning a future where virtual and real-world operations are seamlessly integrated. SEMIA global association, SEMI represents the entire electronics manufacturing and design supply chain. Disclaimer: This post contains affiliate links. If you make a purchase, I may receive a commission at no extra cost to you.Support the showBecome a sustaining member! Like what you hear? Follow us on LinkedIn and TwitterInterested in reaching a qualified audience of microelectronics industry decision-makers? Invest in host-read advertisements, and promote your company in upcoming episodes. Contact Françoise von Trapp to learn more. Interested in becoming a sponsor of the 3D InCites Podcast? Check out our 2024 Media Kit. Learn more about the 3D InCites Community and how you can become more involved.

Are you your own toughest critic? Do thoughts like “it's too hard,” “that won't work for me,” or “I'll never stick to it” keep you from pursuing your health goals? If so, this week's episode is exactly the motivation you need.Join me for this short pep talk episode to help you reframe those limiting beliefs and start taking steps toward your healthiest self. If you're ready to imagine what you could accomplish if failure wasn't an option, make sure to tune in!Subscribe & ReviewI'd absolutely love for you to subscribe to my podcast so you don't miss an episode! I'll be adding a new episode each week, and if you're not subscribed you might miss out. Click here to subscribe in iTunes!If you have a few minutes to spare, I would be so grateful if you left a review over on iTunes. These reviews help other people find my podcast and they're also so much fun for me to read. Just click here to review, select “Ratings and Reviews” and “Write a Review” and let me know what you enjoyed about the podcast. Thank you!Links from today's episodeJoin my new gut healing membership, The High Vibe & Gut Healthy Collective (use code “PODFRIEND” for $10 off your monthly membership): https://frandargaville.com/collectiveFollow Fran on Instagram: https://www.instagram.com/frandargavilleSubmit a question: frandargaville.com/askfranClick here to book a free call with Fran: https://frandargaville.com/callGot a question you'd like answered? Contact Fran via Instagram on @frandargaville or by email on hello@frandargaville.com.

Send us a textThis episode was recorded live at SEMICON Europa in Munich. This year's theme of this year's conference is "Innovation and Collaboration: Powering Sustainable Exponential Growth". In other words, how the semiconductor industry can work together to sustainably reach the trillion dollar goal by 2030 without compromising its Net Zero goals. It's going to be tricky, for sure.Frederic Godemel of Schneider Electric talks about what he calls the “energy trilemma” that is causing the energy supply challenges. These are security, affordability, and the impact on the planet. He explains how electricity generated from renewable sources will help address these issues and implores the industry to focus on growing responsibly so it can meet its goals. The conversation continues with Comet CEO, Stephan Haferl, who discusses the importance of developing power-efficient semiconductors. He talks about the power advantages of 3D stacking and heterogeneous integration and explains how 3D X-ray technologies helps bring these technologies to market.  Lastly, you'll hear from Bart Placklé of imec, who talked about next generation vehicle architectures enabled by sensing and chiplets. You'll learn what's driving the need for chiplets in today's software-defined vehicles, and how chiplet architectures can take us to the next level of autonomous vehicles.SEMIA global association, SEMI represents the entire electronics manufacturing and design supply chain. Disclaimer: This post contains affiliate links. If you make a purchase, I may receive a commission at no extra cost to you.Support the showBecome a sustaining member! Like what you hear? Follow us on LinkedIn and TwitterInterested in reaching a qualified audience of microelectronics industry decision-makers? Invest in host-read advertisements, and promote your company in upcoming episodes. Contact Françoise von Trapp to learn more. Interested in becoming a sponsor of the 3D InCites Podcast? Check out our 2024 Media Kit. Learn more about the 3D InCites Community and how you can become more involved.

With the holiday season just around the corner, it can be tough to find that sweet spot between festive fun and keeping your health goals on track.That's why this week, we'll dive into my eight simple but effective strategies to help you feel your best, indulge mindfully, and keep stress in check. Get ready to embrace the holidays with confidence and joy, free from restriction or guilt!Subscribe & ReviewI'd absolutely love for you to subscribe to my podcast so you don't miss an episode! I'll be adding a new episode each week, and if you're not subscribed you might miss out. Click here to subscribe in iTunes!If you have a few minutes to spare, I would be so grateful if you left a review over on iTunes. These reviews help other people find my podcast and they're also so much fun for me to read. Just click here to review, select “Ratings and Reviews” and “Write a Review” and let me know what you enjoyed about the podcast. Thank you!Links from today's episodeOrder your own GI-MAP gut microbiome test: https://frandargaville.com/gut-testing-packageJoin my new gut healing membership, The High Vibe & Gut Healthy Collective (use code “PODFRIEND” for $10 off your monthly membership): https://frandargaville.com/collectiveFollow Fran on Instagram: https://www.instagram.com/frandargavilleSubmit a question: frandargaville.com/askfranClick here to book a free call with Fran: https://frandargaville.com/callGot a question you'd like answered? Contact Fran via Instagram on @frandargaville or by email on hello@frandargaville.com.

Send us a textIt's been quite an exciting year for the U.S. Chips for America as the funding starts rolling out. All year long, Françoise von Trapp has interviewed various government dignitaries about various elements of the CHIPS Act. This episode brings these episodes together in order of appearance, to give you a timeline of the year's progress. First up is Dan Berger,  National Advanced Packaging Manufacturing Program (NAPMP), who explains how CHIPS Acts monies are being used to address gaps like advanced packaging and substrate manufacturing, to help revitalize the US semiconductor industry. The focus is on developing domestic manufacturing teams for U.S. leadership in microelectronics, with global collaboration and security in mind. He discusses the importance of advanced packaging roadmaps aimed at scaling down feature sizes, eliminating interposers and integrating chiplets directly onto substrates.  Next, we hear from the Honoroable Laurie Locascio, Director of NIST, and Undersecretary of Commerce for Standards and Technology. She explains importance of public-private collaboration, addressing research gaps, strategic investments, and global collaboration to ensure the industry's success and address economic and national security concerns.Lastly, Dev Palmer explains Chips Act's funding distribution and its impact on the semiconductor ecosystem. He emphasizes the importance of bridging research and industry and describes some of the programs key initiatives. Palmer highlights the need for collaboration across large and small businesses, academia, and nonprofits to achieve the Chips Act's ambitious goals, and shares the details of the recently announced Small Business Innovation Research (SBIR) program under the Biden Harris administration.  Contact the Panelists on LinkedInDan Berger, Associate Director, NAPMPDr. Laurie Locascio, NISTDev Palmer, NAPMPSupport the showBecome a sustaining member! Like what you hear? Follow us on LinkedIn and TwitterInterested in reaching a qualified audience of microelectronics industry decision-makers? Invest in host-read advertisements, and promote your company in upcoming episodes. Contact Françoise von Trapp to learn more. Interested in becoming a sponsor of the 3D InCites Podcast? Check out our 2024 Media Kit. Learn more about the 3D InCites Community and how you can become more involved.

One of the top questions I get asked is "which supplements should I be taking?" In this week's episode of High Vibe & Healthy, we're cutting through the supplement noise to bring you my ultimate go-to's for optimal health! I'll be spilling the tea on which supplements I think everyone should be taking, why quality matters SO much, and how to actually get the benefits you're after. Plus, I'll share my best food and lifestyle hacks to support these key vitamins, minerals and nutrients (and keep the supplement budget down).Subscribe & ReviewI'd absolutely love for you to subscribe to my podcast so you don't miss an episode! I'll be adding a new episode each week, and if you're not subscribed you might miss out. Click here to subscribe in iTunes!If you have a few minutes to spare, I would be so grateful if you left a review over on iTunes. These reviews help other people find my podcast and they're also so much fun for me to read. Just click here to review, select “Ratings and Reviews” and “Write a Review” and let me know what you enjoyed about the podcast. Thank you!Links from today's episodeOrder your own GI-MAP gut microbiome test: https://frandargaville.com/gut-testing-packageJoin my new gut healing membership, The High Vibe & Gut Healthy Collective (use code “PODFRIEND” for $10 off your monthly membership): https://frandargaville.com/collectiveFollow Fran on Instagram: https://www.instagram.com/frandargavilleSubmit a question: frandargaville.com/askfranClick here to book a free call with Fran: https://frandargaville.com/callGot a question you'd like answered? Contact Fran via Instagram on @frandargaville or by email on hello@frandargaville.com.

Send us a textOn September 30, 2024, Onto Innovation held the grand opening of its Packaging Applications Center of Excellence - or as it's being called, PACE. Françoise von Trapp attended the grand opening to learn why the company has partnered with like-minded suppliers of the panel-level packaging ecosystem to accelerate the development of PLP technologies for both organic and glass substrates. These include 3D InCites Members: LPKF Laser & Electronics, Evatec, MKS-Atotech and Lam Research; as well as Resonac, Corning, and others.This episode starts off with a conversation with Onto Innovation CEO, Mike Plisinski, who explains how PACE came to be, its business model, and why AI is driving growth in panel-level packaging. The story continues with a tour of PACE conducted by Keith Best, Director of PACE.  Best gives a step-by-step description of the processes as panels move from the photoresist coater, to the lithography stepper, to the developer, and then to the inspection system. He also talks about the role advanced lithography tools play in developing down-stream panel level processes. Lastly, you'll hear from PACE collaboration partners:Ralph Zoberbier, CMO, EvatecKuldip Johal, MKS-AtotechKazuyuki Mitsukura, ResonacJunro Yoon, Corning Advanced OpticsRichard Noack, LPKF Laser & Electronics Read the full story on 3D InCitesOnto Innovation Your partner for innovative solutions that improve time to market, yield, and product reliability.Disclaimer: This post contains affiliate links. If you make a purchase, I may receive a commission at no extra cost to you.Support the showBecome a sustaining member! Like what you hear? Follow us on LinkedIn and TwitterInterested in reaching a qualified audience of microelectronics industry decision-makers? Invest in host-read advertisements, and promote your company in upcoming episodes. Contact Françoise von Trapp to learn more. Interested in becoming a sponsor of the 3D InCites Podcast? Check out our 2024 Media Kit. Learn more about the 3D InCites Community and how you can become more involved.

In this week's episode, I'm pulling back the curtain on my own gut health journey with a deep dive into my recent GI-MAP results. The GI-MAP test is a powerful tool for anyone looking to get a comprehensive picture of their gut microbiome. I'll share why I chose to do the test, what I discovered in my results, and how I plan to use these insights to support my health moving forward. Tune in to find out why it's always better to “test instead of guess” when it comes to understanding what's really going on in your gut!Subscribe & ReviewI'd absolutely love for you to subscribe to my podcast so you don't miss an episode! I'll be adding a new episode each week, and if you're not subscribed you might miss out. Click here to subscribe in iTunes!If you have a few minutes to spare, I would be so grateful if you left a review over on iTunes. These reviews help other people find my podcast and they're also so much fun for me to read. Just click here to review, select “Ratings and Reviews” and “Write a Review” and let me know what you enjoyed about the podcast. Thank you!Links from today's episodeOrder your own GI-MAP gut microbiome test: https://frandargaville.com/gut-testing-package Join my new gut healing membership, The High Vibe & Gut Healthy Collective (use code “PODFRIEND” for $10 off your monthly membership): https://frandargaville.com/collectiveFollow Fran on Instagram: https://www.instagram.com/frandargavilleSubmit a question: frandargaville.com/askfranClick here to book a free call with Fran: https://frandargaville.com/callGot a question you'd like answered? Contact Fran via Instagram on @frandargaville or by email on hello@frandargaville.com.

Send us a textRecorded live at the IMAPS Symposium 2024 in Boston MA, where 3D InCites member companies presented their latest technologies and showcased their products. This episode features conversations with nine of our member companies. Brendan Wells, Amkor Technologies, Inc., explains the difference between laminate and strip-based substrates for advanced packaging and when to use each. He also discusses how chiplet integration is impacting the assembly processes.  Evan Griffith and Sze Pe Lim, Indium Corporation, talk about how changing advanced packaging requirements for AI chip sets are changing the game for materials development.  John Lannon, general manager of Micross AIT talks about progress with the company's 300mm capacity expansion and what it means to win the William T. Ashman and John A. Wagnon Technical Achievement Award.  LPKF's Richard Noack talks about the difference between glass interposers and glass core technology, and what's driving development of these materials. Sally Ann Henry, ACM Research, talks about the company's decision to invest in equipment platforms to support panel level packaging. Casey Krawiec, StratEdge Corporation, talks about what it means to receive the IMAPS Society Award for Corporate Sponsorship, and why he thinks it's important to support these activities. Habib Hichri, Ajinomoto Fine Techno, talks about his work with IMAPS Academy, and Ajinomoto's new developments beyond ABF dielectric film to address advanced packaging substrate material needs. Adeia's Guilian Gao talks about what OSATS need to do to support die to wafer hybrid bonding processes. Scott Sikorski, IBM, explains how the Northeast Corridor from New York up into Canada is becoming one of the U.S.'s hot spots in advanced packaging. Peter Cronin, MRSI Micronic, introduces the company's latest die bonders system, and talks about a new application center in LivermoIMAPS InternationalIMAPS is the largest society dedicated to microelectronics and electronics packaging advancement.Disclaimer: This post contains affiliate links. If you make a purchase, I may receive a commission at no extra cost to you.Support the showBecome a sustaining member! Like what you hear? Follow us on LinkedIn and TwitterInterested in reaching a qualified audience of microelectronics industry decision-makers? Invest in host-read advertisements, and promote your company in upcoming episodes. Contact Françoise von Trapp to learn more. Interested in becoming a sponsor of the 3D InCites Podcast? Check out our 2024 Media Kit. Learn more about the 3D InCites Community and how you can become more involved.

Send us a textAt IMAPS Symposium 2024, the annual IMAPS Society Awards were presented. These awards recognize IMAPS members who stand out for their efforts. They are peer-nominated awards and selected by a panel of previous winners, so it's very special to receive one, as it means many members have noticed their efforts. In this episode, Françoise sits down with three of the award winners to talk about their IMAPS experience, at different stages of their careers.Emma P Pawliczak was awarded the Steve Adamson Student Award. She is currently getting her Ph.D. at Binghampton University. Brandon Hamilton won the Emerging Leader Award, is a program manager at BAE Systems in Cedar Rapids IowaDr. Phil Garrou won the Lifetime Achievement Award. He is an Advanced Packaging subject matter expert for DARPA and the DoD through his consulting company Microelectronic Consultants of NC (MCNC).  You'll learn about the history of IMAPS and its origins from PhilYou'll learn how Emma benefits from student opportunities at IMAPSYou'll learn about how IMAPS helped Brandon make connections in the industryAll three talk about mentorship opportunities and how IMAPS provides a supportive community throughout a microelectronics career. Contact the Speakers on LinkedIn:Dr. Phil Garrou, MCNCEmma Pawliczak, Binghamton University Brandon Hamilton, BAE SystemsIMAPS InternationalIMAPS is the largest society dedicated to microelectronics and electronics packaging advancement.Disclaimer: This post contains affiliate links. If you make a purchase, I may receive a commission at no extra cost to you.Support the showBecome a sustaining member! Like what you hear? Follow us on LinkedIn and TwitterInterested in reaching a qualified audience of microelectronics industry decision-makers? Invest in host-read advertisements, and promote your company in upcoming episodes. Contact Françoise von Trapp to learn more. Interested in becoming a sponsor of the 3D InCites Podcast? Check out our 2024 Media Kit. Learn more about the 3D InCites Community and how you can become more involved.

Just when I think I've heard it all, a new wild wellness trend emerges. This week, I teamed up with Elle Brown—women's health practitioner, clinical nutritionist, and dear friend—on her podcast, Women Meet Wellness, to debunk some of the most buzzworthy trends out there.Hot topics we cover:• Ice baths • Intermittent fasting • The energy in vs energy out model for weight loss • Meeting your trauma • The rise of run clubs • The raw potato trendSubscribe & ReviewI'd absolutely love for you to subscribe to my podcast so you don't miss an episode! I'll be adding a new episode each week, and if you're not subscribed you might miss out. Click here to subscribe in iTunes!If you have a few minutes to spare, I would be so grateful if you left a review over on iTunes. These reviews help other people find my podcast and they're also so much fun for me to read. Just click here to review, select “Ratings and Reviews” and “Write a Review” and let me know what you enjoyed about the podcast. Thank you!Links from today's episodeJoin the 14 Day Gut Detox: https://frandargaville.com/detox Book a consultation: https://frandargaville.com/clinicJoin my new gut healing membership, The High Vibe & Gut Healthy Collective (use code “PODFRIEND” for $10 off your monthly membership): https://frandargaville.com/collectiveFollow Fran on Instagram: https://www.instagram.com/frandargavilleSubmit a question: frandargaville.com/askfranClick here to book a free call with Fran: https://frandargaville.com/callGot a question you'd like answered? Contact Fran via Instagram on @frandargaville or by email on hello@frandargaville.com.

Send us a textThis episode was recorded live at the IMAPS International Symposium in Boston MA.  Françoise von Trapp speaks with Dev Palmer, director of the National Advanced Packaging Manufacturing Program; Sandeep Sane of Lightmatter; Craig Bishop, Deca and Brett Wilkerson, AMD. Dev Palmer explains Chips Act's funding distribution and its impact on the semiconductor ecosystem. He emphasizes the importance of bridging research and industry and describes some of the programs key initiatives. Palmer highlights the need for collaboration across large and small businesses, academia, and nonprofits to achieve the Chips Act's ambitious goals, and shares the details of the recently announced Small Business Innovation Research (SBIR) program under the Biden Harris administration. Sandeep Sane, Head of Packaging at LightMatter, discusses the role of 3D optical integration in extreme compute scaling. He highlights the challenges in integrating silicon photonics into chip designs to provide high bandwidth at lower power, essential for AI and data centers. You'll learn how 3D stacking addresses memory and logic competition on chips; and how chiplet-based architectures improve performance but increase power consumption. Craig Bishop of DECA and Brett Wilkerson of AMD discuss the evolution and applications of Redistribution Layer (RDL) packaging, particularly in high-performance computing and AI. They also highlightthe role of AI in enhancing packaging design and the future of AI applications, emphasizing the need for both centralized and edge computing to balance performance and power consumption.Contact The Speakers on LInkedInDev Palmer, NAPMPSandeep Sane, LightmatterCraig Bishop, Deca Brett Wilkerson, AMD ResourcesFor General Inquiries about CHIPS for America askchips@chips.govFor CHIPS Incentives Program inquiries apply@chips.govFor Congressional inquiries about CHIPS for America legislativeaffairs@chips.govIMAPS InternationalIMAPS is the largest society dedicated to microelectronics and electronics packaging advancement.Disclaimer: This post contains affiliate links. If you make a purchase, I may receive a commission at no extra cost to you.Support the showBecome a sustaining member! Like what you hear? Follow us on LinkedIn and TwitterInterested in reaching a qualified audience of microelectronics industry decision-makers? Invest in host-read advertisements, and promote your company in upcoming episodes. Contact Françoise von Trapp to learn more. Interested in becoming a sponsor of the 3D InCites Podcast? Check out our 2024 Media Kit. Learn more about the 3D InCites Community and how you can become more involved.

Are you feeling bloated, sluggish, or just not quite yourself? It might be time for a gut reset! In this week's episode I'll be guiding you through how to support your body's natural detoxification process with nutrition and lifestyle changes designed to get your gut—and your whole body—back on track.Spoiler Alert: Fad detox trends and juice cleanses simply won't cut it!Here's what we cover: • Essential dietary adjustments for optimal gut health• The liver's vital role in detoxification• Foods that promote gut healing• The impact of exercise on digestive health• The importance of sleep and stress management• Detox supplements that actually support your gutP.S. The doors to my brand new 14 Day Gut Detox are now open! Check the link below to join usSubscribe & ReviewI'd absolutely love for you to subscribe to my podcast so you don't miss an episode! I'll be adding a new episode each week, and if you're not subscribed you might miss out. Click here to subscribe in iTunes!If you have a few minutes to spare, I would be so grateful if you left a review over on iTunes. These reviews help other people find my podcast and they're also so much fun for me to read. Just click here to review, select “Ratings and Reviews” and “Write a Review” and let me know what you enjoyed about the podcast. Thank you!Links from today's episodeJoin the 14 Day Gut Detox: https://frandargaville.com/detoxFollow Fran on Instagram: https://www.instagram.com/frandargavilleSubmit a question: frandargaville.com/askfranClick here to book a free call with Fran: https://frandargaville.com/callGot a question you'd like answered? Contact Fran via Instagram on @frandargaville or by email on hello@frandargaville.com.

Send us a textIn this episode, Françoise von Trapp speaks with Chee Ping Lee, of Lam Research, about the critical role of high bandwidth memory (HBM) in generative AI, emphasizing its high bandwidth and compact design.  HBM memory has received a lot of attention as one of the first technologies to implement 2.5D and 3D stacking. Lee explains how HBM uses advanced packaging technologies like TSV and microbumps to achieve high memory capacity and performance. Lam Research's solutions are key to HBM's success.Listen to learn details about: The importance of HBM for AI chip manufacturing  The relationship between advancedpackaging and HBMThe differences between different HBM generations The future of microbumps and hybrid bonding Lam Research's advanced packaging solutions Contact Chee Ping Lee on LinkedIN Learn more about why HBM Is a critical enabler for generative AI in this blog post. Lam Research Lam Research equipment and services allow chipmakers to build smaller and better performing devicesDisclaimer: This post contains affiliate links. If you make a purchase, I may receive a commission at no extra cost to you.Support the showBecome a sustaining member! Like what you hear? Follow us on LinkedIn and TwitterInterested in reaching a qualified audience of microelectronics industry decision-makers? Invest in host-read advertisements, and promote your company in upcoming episodes. Contact Françoise von Trapp to learn more. Interested in becoming a sponsor of the 3D InCites Podcast? Check out our 2024 Media Kit. Learn more about the 3D InCites Community and how you can become more involved.

Ready to hit reset on your health? In this episode of High Vibe & Healthy, we're diving into the 8 key signs your gut needs a reset. Here's what we cover in the episode:• Your gut's role in overall health: From digestion to hormone balance, energy, and even skin health.• 8 key signs your gut needs a detox, including some you might not expect.• Why our body's in-built detoxification isn't always enough: How modern lifestyles impact your body's ability to detox.Plus, you're the first to know about my brand new 14 Day Gut Detox! Link below to join us.Subscribe & ReviewI'd absolutely love for you to subscribe to my podcast so you don't miss an episode! I'll be adding a new episode each week, and if you're not subscribed you might miss out. Click here to subscribe in iTunes!If you have a few minutes to spare, I would be so grateful if you left a review over on iTunes. These reviews help other people find my podcast and they're also so much fun for me to read. Just click here to review, select “Ratings and Reviews” and “Write a Review” and let me know what you enjoyed about the podcast. Thank you!Links from today's episodeJoin the 14 Day Gut Detox: https://frandargaville.com/detox Follow Fran on Instagram: https://www.instagram.com/frandargavilleSubmit a question: frandargaville.com/askfranClick here to book a free call with Fran: https://frandargaville.com/callGot a question you'd like answered? Contact Fran via Instagram on @frandargaville or by email on hello@frandargaville.com.

Send us a textIn this episode, Francoise von Trapp speaks with Isabella Drolz from Comet about how AI is revolutionizing semiconductor inspection strategies, particularly in 3D X-ray systems. They discuss how AI is being used to find structural defects in advanced chip packages, and also how 3D inspection is being used to develop advanced AI technologies themselves. von Trapp and Drolz explore the evolution of inspection methods in advanced packaging, noting the complexity of 3D ICs and the limitations of traditional optical inspections. Drolz emphasizes the importance of AI in accelerating yield curves and improving inspection efficiency. She also mentions the need for an enterprise solution to integrate various inspection tools.You'll learn:About the difference between 2D and 3D X-ray technologiesHow 3D X-ray evolved over the past decade so that it can be used effectively in volume production How Comet Yxlon's CA 20 tool, integrated with the AI software Dragonfly, enhances defect detection by using deep learning to analyze X-ray imagesContact Isabella Drolz on LinkedInComet Xylon Comet Yxlon delivers high-end X-ray and CT system solutions for advanced packaging inspecton needs. Disclaimer: This post contains affiliate links. If you make a purchase, I may receive a commission at no extra cost to you.Support the showBecome a sustaining member! Like what you hear? Follow us on LinkedIn and TwitterInterested in reaching a qualified audience of microelectronics industry decision-makers? Invest in host-read advertisements, and promote your company in upcoming episodes. Contact Françoise von Trapp to learn more. Interested in becoming a sponsor of the 3D InCites Podcast? Check out our 2024 Media Kit. Learn more about the 3D InCites Community and how you can become more involved.

Send us a textIn this episode, Francoise speaks with Simon McElrea, an interconnectologist, about his career in and the evolution of interconnectology, emphasizing its importance in semiconductor packaging.McElrea discusses his roles at semiconductor start-ups like Vertical Circuits and Invensas;  his foray into wireless charging at Energous and FreePower; and his return to the semiconductor industry due to its current inflection point. He talks about how the Chips Act favors large companies over startups and stressed the need for government support to attract young talent and foster innovation. Lastly, McElrea explained how to better support startups and disruptive technologies in the semiconductor industry through policies and funding. Listen and learn: ·      How adopting the term "interconnectology" will change the narrative around advanced packaging·      Why we need to inspire young talent to pursue careers in interconnect-focused fields like packaging through initiatives at universities·      The role of consortia and joint ventures can play Contact Simon McElrea on LinkedInLQDXLQDX is setting a new metal deposition standard with its breakthrough family of Liquid Metal Inks®.Disclaimer: This post contains affiliate links. If you make a purchase, I may receive a commission at no extra cost to you.Support the showBecome a sustaining member! Like what you hear? Follow us on LinkedIn and TwitterInterested in reaching a qualified audience of microelectronics industry decision-makers? Invest in host-read advertisements, and promote your company in upcoming episodes. Contact Françoise von Trapp to learn more. Interested in becoming a sponsor of the 3D InCites Podcast? Check out our 2024 Media Kit. Learn more about the 3D InCites Community and how you can become more involved.

Send us a textIn this episode, Françoise von Trapp talks with Onto Innovation's Monita Pau and Jiangtao Hu about metrology for advanced packaging – why do we need it? What are the challenges, and how do we solve them?   In semiconductor manufacturing front-end processes, metrology has always been a critical step to ensure consistency of very fine features. It's only recently become important to back-end advanced packaging processes – especially for heterogeneous integration. As chips are designed with smaller features, advanced packaging processes are becoming more front-end like. You'll learn about how metrology designed for front-end manufacturing is being reimagined for wafer-level and assembly applications such as:Hybrid bonding3D stacking with micro bumpsRDL applications for interposersTSV applicationsThe speakers discuss the challenges, gaps, and solutions for each. You'll also learn what makes Onto Innovation uniquely qualified to support this. Contact Our Guests on LinkedIn ·       Monita Pau·       Jiangtao HuOnto Innovation Your partner for innovative solutions that improve time to market, yield, and product reliability.Disclaimer: This post contains affiliate links. If you make a purchase, I may receive a commission at no extra cost to you.Support the showBecome a sustaining member! Like what you hear? Follow us on LinkedIn and TwitterInterested in reaching a qualified audience of microelectronics industry decision-makers? Invest in host-read advertisements, and promote your company in upcoming episodes. Contact Françoise von Trapp to learn more. Interested in becoming a sponsor of the 3D InCites Podcast? Check out our 2024 Media Kit. Learn more about the 3D InCites Community and how you can become more involved.

Send us a textIn this episode, Tarak Railkar and Benson Chan join Françoise von Trapp for a preview of  The IMAPS International Symposium 2024, which takes place in Boston from September 30 to October 3, 2024. This year's symposium focuses on heterogeneous integration for paradigm-shifting microelectronics and photonics. It will feature a five-track technical program, special interactive sessions on onshoring, keynote speakers by industry leaders, and much more.  The symposium will also host a Bingo networking event to promote DEI, a career fair, student poster sessions, and off-site tours to MIT and MRSI Systems. Listen in to learn about: The benefits of volunteering for IMAPS Networking and career opportunities The speaker and panel line-up Register for this year's IMAPS Symposium here. Contact the Speakers on LinkedInTarak Railkar, General ChairBenson Chan, General Chair-ElectIMAPS InternationalIMAPS is the largest society dedicated to microelectronics and electronics packaging advancement.Disclaimer: This post contains affiliate links. If you make a purchase, I may receive a commission at no extra cost to you.Support the showBecome a sustaining member! Like what you hear? Follow us on LinkedIn and TwitterInterested in reaching a qualified audience of microelectronics industry decision-makers? Invest in host-read advertisements, and promote your company in upcoming episodes. Contact Françoise von Trapp to learn more. Interested in becoming a sponsor of the 3D InCites Podcast? Check out our 2024 Media Kit. Learn more about the 3D InCites Community and how you can become more involved.

Send us a textIn this episode, Françoise von Trapp speaks with Bruce Kim, of SurplusGLOBAL, for an update on the semiconductor secondary equipment market, and how the US. and European Chips Acts are impacting it. They also discuss the trend of top-tier OEMS prioritizing the development of innovative technology rather than investing in legacy tools that are still very much in need, and the impact this is having on device manufacturers that rely on legacy tools, but have trouble finding repair parts. This was part of an interview with Bruce by WorldFolio. Find the complete article here.   You'll learn how SurplusGLOBAL is building a global parts platform that helps legacy tool owners find parts, and also manufactures replacement parts for those that have become obsolete. You'll also learn how AI is helping to optimize this business. You'll also hear about the 2030 Big Cluster Project, the company's global expansion in semiconductor manufacturing hot spots around the globe, and more. Contact Bruce Kim on LinkedInSurplusGLOBALSurplusGLOBAL is one of the largest one-stop platforms for pre-owned semiconductor equipment. Disclaimer: This post contains affiliate links. If you make a purchase, I may receive a commission at no extra cost to you.Support the Show.Become a sustaining member! Like what you hear? Follow us on LinkedIn and TwitterInterested in reaching a qualified audience of microelectronics industry decision-makers? Invest in host-read advertisements, and promote your company in upcoming episodes. Contact Françoise von Trapp to learn more. Interested in becoming a sponsor of the 3D InCites Podcast? Check out our 2024 Media Kit. Learn more about the 3D InCites Community and how you can become more involved.

Send us a Text Message.In this episode, Françoise von Trapp and underfill materials expert, Dick Jensen, NAMICS corporation explore the societal and technological challenges that impact microelectronic materials development. The conversation focuses on the evolution of underfill materials development over the past 30 years. They discuss the importance of underfill materials in semiconductor manufacturing, focusing on their compatibility, environmental impact, and properties. You'll learn about:The development of specialized underfill materials for advanced packaging technologies, including AI chips, and the challenges arising from material changes in electronics manufacturingHistorical examples of working with restricted substances and how that created a need for alternative materials The current need for collaboration and innovation to address the issue of PFAS chemicals in productsWhy and how much testing is important to ensure material compatibility and performanceNAMICS NAMICS Corporation provides advanced materials and solutions for the semiconductor industry.Disclaimer: This post contains affiliate links. If you make a purchase, I may receive a commission at no extra cost to you.Support the Show.Become a sustaining member! Like what you hear? Follow us on LinkedIn and TwitterInterested in reaching a qualified audience of microelectronics industry decision-makers? Invest in host-read advertisements, and promote your company in upcoming episodes. Contact Françoise von Trapp to learn more. Interested in becoming a sponsor of the 3D InCites Podcast? Check out our 2024 Media Kit. Learn more about the 3D InCites Community and how you can become more involved.