3D InCites Podcast

Send us a textThe 75th anniversary celebration of ECTC in Dallas showcases a remarkable evolution in advanced packaging technologies, revealing how semiconductor priorities have dramatically shifted. Rather than the relentless miniaturization of the smartphone era, today's AI-driven applications demand larger packages with more functionality and sophisticated thermal management solutions.Glass core substrates emerged as the star technology of the conference, with standing-room-only sessions demonstrating the industry's intense interest in this promising material platform. The excitement is justified – glass offers superior dimensional stability and enables higher-density interconnects than traditional organic substrates. Meanwhile, co-packaged optics generated similar enthusiasm as engineers tackle the monumental challenge of powering AI server racks that consume between 0.5-1 megawatt each, making energy efficiency a critical concern.Through conversations with industry leaders including Monita Pau (Onto Innovation), Charles Lee and Mark Gerber (ASE), Tim Olson (Deca),  Scott Sikorski (IBM), Roland Rettenmeier, (SCHMID Group), Simon McElrea (LDQX), Henan Zhang, (ACM Research), and Evelyn Weng (ERS Electronic) we gain insights into how these technologies will reshape semiconductor packaging.With record attendance exceeding 2,500 participants, ECTC has firmly established itself as the premier venue for pre-competitive research in advanced packaging. The technologies showcased this year may take 5-10 years to reach high-volume manufacturing, but they provide a crucial window into the semiconductor industry's future direction. As one participant aptly noted, "We used to draw pictures of these advanced packaging technologies and people quite often laughed... now they are actually production products because it was the only way to get there."Support the showBecome a sustaining member! Like what you hear? Follow us on LinkedIn and TwitterInterested in reaching a qualified audience of microelectronics industry decision-makers? Invest in host-read advertisements, and promote your company in upcoming episodes. Contact Françoise von Trapp to learn more. Interested in becoming a sponsor of the 3D InCites Podcast? Check out our 2024 Media Kit. Learn more about the 3D InCites Community and how you can become more involved.

Send us a textWhat happens when the world's thirst for artificial intelligence collides with physical limitations? The answer lies at the intersection of silicon innovation and packaging technology.From the conference hall of ECTC 2025 in Dallas, we're joined by Sam Naffziger of AMD who reveals how AI has transformed from a peripheral topic to the dominant force in computing within just five years. The economic motivation is clear: creating machines that generate intelligence offers "uncalculable value" to humanity. Yet as Nafziger explains, today's large language models face significant limitations—they excel at pattern recognition but struggle with true reasoning, suffer from hallucinations, and require human verification for mission-critical applications.Perhaps most surprising is Nafziger's revelation about "the data wall"—general-purpose AI models have essentially exhausted the high-quality training data available on the internet. This constraint is pushing AI development toward more sophisticated approaches involving reinforcement learning and models that check other models, gradually shifting from simple pattern recognition toward deliberative thinking that more closely resembles human reasoning.The conversation tackles the looming concern of AI's energy consumption, projected to reach 10% of global power by 2030. Rather than viewing this as an insurmountable problem, Nafziger offers a compelling perspective: AI's ability to optimize countless processes—from transportation routing to crop yields and manufacturing efficiency—could ultimately lead to net energy savings despite its own substantial power requirements.For the advanced packaging community, the message is clear: your work sits at the foundation of AI's future. As computational demands increase exponentially, innovations in thermal management, power delivery, and component integration will directly determine how quickly and effectively AI can evolve. Connect with Sam Naffziger on LinkedIn or visit AMD.com to learn more about their competitive AI solutions and join the conversation about technology that's reshaping our world.Support the showBecome a sustaining member! Like what you hear? Follow us on LinkedIn and TwitterInterested in reaching a qualified audience of microelectronics industry decision-makers? Invest in host-read advertisements, and promote your company in upcoming episodes. Contact Françoise von Trapp to learn more. Interested in becoming a sponsor of the 3D InCites Podcast? Check out our 2024 Media Kit. Learn more about the 3D InCites Community and how you can become more involved.

Send us a textWhat happens when you gather 75 years of packaging innovation under one roof? The Electronic Component Technology Conference (ECTC) has transformed from a modest gathering of 300 electronics professionals to a powerhouse event attracting over 2,500 industry leaders, researchers, and visionaries. This remarkable journey reflects how advanced packaging has evolved from supporting technology to the driving force behind modern electronics.In this special episode, we speak with three generations of ECTC committee members: Pat Thompson (with 41 years of ECTC experience), Przemek Gromala (10 years), and Florian Herault (since 2010). They share fascinating insights into how the conference has tracked—and often predicted—the industry's most significant shifts. From the days when Ball Grid Arrays were cutting-edge to today's excitement around hybrid bonding and chiplets, ECTC has been the barometer for packaging innovation.The conversation reveals how technologies that once caused standing-room-only excitement have either become industry standards or faded into obscurity. Remember 450mm wafers? That path was abandoned in favor of panel-level packaging. Through-silicon vias struggled with cost issues for years before finding their sweet spot in high-performance applications. And the longstanding debate between System-on-Chip and System-in-Package approaches has evolved into today's heterogeneous integration paradigm.Looking forward, our guests highlight the challenges driving tomorrow's innovations: thermal management for power-hungry AI chips, specialized edge computing architectures, and adapting advanced electronics to automotive and other harsh environments. As Host Françoise von Trapp observes, "It's a great time to be a nerd," with abundant technical challenges ensuring exciting work for packaging professionals for decades to come.Don't miss our upcoming episode featuring ECTC keynote speaker Sam Naffziger discussing responsible AI implementation and the critical role of packaging in creating energy-efficient high-performance devices!Real Talk About MarketingAn Acxiom podcast where we discuss marketing made better, bringing you real...Listen on: Apple Podcasts SpotifySupport the showBecome a sustaining member! Like what you hear? Follow us on LinkedIn and TwitterInterested in reaching a qualified audience of microelectronics industry decision-makers? Invest in host-read advertisements, and promote your company in upcoming episodes. Contact Françoise von Trapp to learn more. Interested in becoming a sponsor of the 3D InCites Podcast? Check out our 2024 Media Kit. Learn more about the 3D InCites Community and how you can become more involved.

Send us a textPratyush Kamal explains how 3DIC technologies are transforming semiconductor design as Moore's Law slows, requiring closer integration between chip and package design to maximize performance.• Traditional chip design treated packaging as an afterthought with designers "throwing designs over the wall"• Economic realities of advanced nodes mean companies now pay more for smaller transistors, driving chiplet adoption• Thermal challenges multiply in 3D stacks as power density doubles with each added layer• Data centers projected to consume 10% of US electricity by 2030, making power efficiency critical• Siemens working to standardize design languages across tools and enable open chiplet ecosystems• Average age of electrical engineers in US is 57, creating urgent need for workforce development• Universal Chiplet Interconnect Express (UCIe) emerging as key standard for chiplet interoperabilityVisit siemens.com/3DIC to learn more about Siemens' comprehensive 3DIC solutions.Siemens EDA Siemens' EDA software helps you turn today's ideas into the sustainable products of the future.Disclaimer: This post contains affiliate links. If you make a purchase, I may receive a commission at no extra cost to you.Support the showBecome a sustaining member! Like what you hear? Follow us on LinkedIn and TwitterInterested in reaching a qualified audience of microelectronics industry decision-makers? Invest in host-read advertisements, and promote your company in upcoming episodes. Contact Françoise von Trapp to learn more. Interested in becoming a sponsor of the 3D InCites Podcast? Check out our 2024 Media Kit. Learn more about the 3D InCites Community and how you can become more involved.

Send us a textAndrew Mathers, Principal Product Line Manager at Nordson Test and Inspection, discusses the revolutionary advancements in 3D x-ray inspection technology and how they're improving semiconductor manufacturing quality.• X-ray inspection requires high resolution, speed, and cost-effectiveness to drive better product quality• Traditional 2D radiographic imaging is being replaced by 3D imaging for more stringent manufacturing requirements• Planar CT imaging suffers from artifacts when inspecting flat electronic components like circuit boards and wafers• Dynamic Planar CT takes more images from different angles with a wider field of view, reducing artifacts• New technology operates twice as fast as traditional methods while reducing x-ray dose to sensitive components• Automated inspection systems integrate directly into manufacturing lines with no human interaction required• Common applications include detecting voids in ball grid arrays and micro bumps in flip chip devices• The technology supports Quality 4.0 initiatives by providing feedback to improve manufacturing processes• Nordson's systems are in use worldwide with an install base exceeding 2000 automated x-ray inspection systemsLearn more about Dynamic Planar CT and Nordson's x-ray inspection solutions at nordson.com or on their YouTube channel.Nordson Test and Inspection Delivering best-in-class test, inspection, and metrology solutions for semiconductor applications. Disclaimer: This post contains affiliate links. If you make a purchase, I may receive a commission at no extra cost to you.Support the showBecome a sustaining member! Like what you hear? Follow us on LinkedIn and TwitterInterested in reaching a qualified audience of microelectronics industry decision-makers? Invest in host-read advertisements, and promote your company in upcoming episodes. Contact Françoise von Trapp to learn more. Interested in becoming a sponsor of the 3D InCites Podcast? Check out our 2024 Media Kit. Learn more about the 3D InCites Community and how you can become more involved.

Send us a textThe IEEE MTTS International Microwave Symposium attracts over 9,000 attendees and 500+ exhibitors to share cutting-edge developments in RF, microwave, and advanced packaging technologies. Tim Hancock and Jim Buckwalter from the IMS committee explain why this premier event, taking place in San Francisco's Moscone Center from June 15-20, has become increasingly relevant to professionals in advanced packaging and heterogeneous integration.• Approximately 15% of accepted papers directly address packaging and heterogeneous integration topics• Papers undergo rigorous double-blind review with an in-person committee meeting to ensure highest quality content• Technical focus includes laminate technology, chip stacking, thermal management, and other critical packaging technologies• Special workshops address 3D heterogeneous integration, millimeter-wave phased arrays, and advanced packaging solutions• Exhibition floor features 500+ companies providing networking opportunities and technology discovery• Student programs include design competitions, volunteer opportunities, and dedicated sessions for underrepresented groups• Early bird registration ends May 16th with regular registration continuing at ims-ieee.orgRegister at ims-ieee.org to secure your spot and book accommodations before they fill up.THE 2025 IEEE MTT-S IMSThe 2025 IEEE MTT-S IMS is the largest event for RF and microwave professionals in the world.Disclaimer: This post contains affiliate links. If you make a purchase, I may receive a commission at no extra cost to you.Support the showBecome a sustaining member! Like what you hear? Follow us on LinkedIn and TwitterInterested in reaching a qualified audience of microelectronics industry decision-makers? Invest in host-read advertisements, and promote your company in upcoming episodes. Contact Françoise von Trapp to learn more. Interested in becoming a sponsor of the 3D InCites Podcast? Check out our 2024 Media Kit. Learn more about the 3D InCites Community and how you can become more involved.

Send us a textAcoustic inspection stands as a silent sentinel in semiconductor manufacturing, detecting microscopic defects that could lead to catastrophic failures in high-value applications. Bryan Schackmuth, Senior Product Line Manager at Nordson Test and Inspection, reveals how this technology has evolved from laboratory tools to production-line essentials.When ultrasound encounters even the tiniest air gap—we're talking hundreds of angstroms—it reflects completely, making acoustic imaging uniquely powerful for evaluating bonds between materials. While optical inspection shows surface defects and X-ray reveals density variations, acoustic inspection peers between layers, identifying delamination and other hidden flaws that might otherwise escape detection until field failure.The challenges of advanced packaging have driven significant innovation in acoustic inspection technology. As manufacturers stack more die, create complex interconnects, and push toward heterogeneous integration, the value of each wafer increases dramatically. Nordson's SpinSam system represents a breakthrough in this space, replacing traditional raster scanning with a rotational approach that achieves 41 wafers per hour—eight times faster than previous generation technology—while maintaining resolution down to 10 microns.Beyond pure speed, the system's spinning scan technology offers unique advantages for edge inspection where defects are more common due to coefficient of thermal expansion effects. The modular design allows maintenance on individual scanners while others continue operating, maximizing uptime in production environments. Most exciting is the integration of AI and machine learning for defect detection, moving beyond simple thresholds to analyze complex multilayer images simultaneously.Want to see how your inspection strategies might benefit from these advances? Check out Nordson's SpinSam technology at nordson.com and discover how acoustic inspection is helping manufacturers achieve higher yields and more reliable products in today's most demanding semiconductor applications.Support the showBecome a sustaining member! Like what you hear? Follow us on LinkedIn and TwitterInterested in reaching a qualified audience of microelectronics industry decision-makers? Invest in host-read advertisements, and promote your company in upcoming episodes. Contact Françoise von Trapp to learn more. Interested in becoming a sponsor of the 3D InCites Podcast? Check out our 2024 Media Kit. Learn more about the 3D InCites Community and how you can become more involved.

Send us a textThe 3D InCites Podcast celebrates microelectronics industry innovation with a special episode featuring this year's award winners in heterogeneous integration and chiplet technology.• SallyAnn Henry, Jim Straus and David Wang, ACM Research, describe a horizontal rotation plating system for panel-level packaging with superior uniformity across square substrates• Eric Gongora, of MacDermid Alpha, explains how NovaFab fine-grained copper enables hybrid bonding with customizable annealing times and improved electron migration resistance• Chuck Woychik, NHanced Semiconductors, talks about how the company brings hybrid bonding capabilities onshore with expertise in wafer processing for both defense and commercial applications• Keith Felton, Siemens Digital Industries Software, introduces Innovator 3DIC for hierarchical device planning that automatically propagates design changes throughout chiplet interfaces• Kazuyuki Mitsukura explains how Resonac builds collaborative consortia in Japan and the US to solve complex advanced packaging challenges through shared resources• Rex Anderson from Micross shares his engineering journey and passion for mentoring the next generation of technologists• Ron Huemoeller and Eelco Bergman discuss how Saras Micro Devices addresses AI power challenges with embeddable S-Tile capacitors. They also talk about Saras corporate culture.EV Group EV Groups supplies high-volume equipment and process solutions for semiconductor manufacturing. KLA, SPTS Division KLA provides semiconductor equipment for metrology, inspection, wafer processing, and more. Disclaimer: This post contains affiliate links. If you make a purchase, I may receive a commission at no extra cost to you.Support the showBecome a sustaining member! Like what you hear? Follow us on LinkedIn and TwitterInterested in reaching a qualified audience of microelectronics industry decision-makers? Invest in host-read advertisements, and promote your company in upcoming episodes. Contact Françoise von Trapp to learn more. Interested in becoming a sponsor of the 3D InCites Podcast? Check out our 2024 Media Kit. Learn more about the 3D InCites Community and how you can become more involved.

Send us a textNavigating today's complex manufacturing landscape demands unprecedented supply chain resilience. This eye-opening conversation with Barry O'Dowd (Kuehne+Nagel) and Kamal Aluwalia (Resilinc) reveals why robust supply chains matter more than ever—particularly for semiconductor capital equipment.The semiconductor industry operates at extraordinary precision, with equipment working at scales as small as five nanometers—roughly 1/18,000th the width of a human hair. This precision makes these multi-million dollar tools exceptionally vulnerable during transport, requiring meticulous handling across tens of thousands of miles between manufacturing and installation. With leading-edge fabs costing up to $20 billion, equipment failures or delays can trigger catastrophic financial consequences.Our experts explain how companies are reimagining resilience through sophisticated data analysis, multi-tier visibility, and proactive risk management. Barry shares how Kuehne+Nagel's risk mitigator tool brings together all supply chain stakeholders to identify vulnerabilities and implement mitigation strategies—expertise developed during their flawless delivery of over 2 billion COVID vaccines. Meanwhile, Kamal describes how Resolink helps organizations leverage AI to anticipate disruptions across 40 different risk categories, from natural disasters to financial instability.The conversation offers practical advice for strengthening your own supply chain: understand your end-to-end process, engage with experienced partners, and adopt a first-principles approach to reimagining resilience with current technology. As global uncertainties continue mounting—from geopolitical tensions to extreme weather events—supply chain resilience isn't merely about risk avoidance; it's becoming a strategic competitive advantage.Kuehne+NagelTrust Semicon Logistics by Kuehne+Nagel to navigate even the most demanding supply chain challenges.Disclaimer: This post contains affiliate links. If you make a purchase, I may receive a commission at no extra cost to you.Support the showBecome a sustaining member! Like what you hear? Follow us on LinkedIn and TwitterInterested in reaching a qualified audience of microelectronics industry decision-makers? Invest in host-read advertisements, and promote your company in upcoming episodes. Contact Françoise von Trapp to learn more. Interested in becoming a sponsor of the 3D InCites Podcast? Check out our 2024 Media Kit. Learn more about the 3D InCites Community and how you can become more involved.

Send us a textThe 3D InCites Member Spotlight episode features exclusive conversations with industry leaders at IMAPS Device Packaging Conference 2025, exploring the cutting-edge of semiconductor packaging innovation and domestic manufacturing expansion.• Rex Anderson of Micross details their RESHAPE program funding and Integra acquisition, establishing them as North America's largest domestic OSAT• Calvin Cheung of ASE explains how advanced packaging enables AI infrastructure while reducing power consumption by 40-60% through vertical power delivery. He also describes silicon photonics emerging as a game-changer for data transmission, using light instead of electrons for faster, more energy-efficient signal integrity• Keith Felton of Siemens discusses digital twin technology allowing early predictive analysis during package prototyping to prevent costly downstream engineer change orders - or ECOs.• Vahid Akhavan highlights PulseForge's photonic debonding technology partnerships for clean, high-yield wafer release• Bernd Krafthoefer and Florian Lechner, ERS Electonic representatives,  share insights on their new European competence center and sub-micron photonic debonding capabilities for 300mm wafers.Join us next week as we explore supply chain resilience in the semiconductor capital equipment sector with Barry O'Dowd from Kuehne+Nagel and special guest Kamal Aluwalia, CEO of Resilinc. Learn more about member benefits at 3DInCites.com/memberships.IMAPS Device Packaging ConferenceInterconnects for Tomorrow's Applications Disclaimer: This post contains affiliate links. If you make a purchase, I may receive a commission at no extra cost to you.Support the showBecome a sustaining member! Like what you hear? Follow us on LinkedIn and TwitterInterested in reaching a qualified audience of microelectronics industry decision-makers? Invest in host-read advertisements, and promote your company in upcoming episodes. Contact Françoise von Trapp to learn more. Interested in becoming a sponsor of the 3D InCites Podcast? Check out our 2024 Media Kit. Learn more about the 3D InCites Community and how you can become more involved.

Send us a textArizona is transforming into the "Silicon Oasis" of America through an unprecedented collaboration that's reshaping semiconductor education from high school through graduate studies. At the heart of this revolution is a groundbreaking partnership between the University of Arizona and Chandler Unified School District, launching the nation's first high school career and technical education program focused on semiconductor manufacturing.Starting July 2025, forty students will begin a two-year journey learning on industry-grade equipment—not "glorified children's toys" but actual mechatronic systems, universal robots, and PCB printing technology. What makes this program revolutionary is its design for multiple pathways; graduates can either enter the workforce immediately as technicians or continue to higher education with college credits already earned.Meanwhile, Arizona State University is building the advanced end of this educational pipeline through CHIPS Act-funded initiatives like the Southwest Advanced Prototyping Hub and the SHIELD project. Graduate courses in semiconductor packaging have exploded in popularity, growing from just 27 students to over 175 in two years. The university is getting creative with outreach too, developing a "Packaging on Wheels" mobile facility to bring semiconductor education to schools nationwide.The strength of Arizona's approach lies in its extensive industry involvement. Fifteen major companies form the steering committee for the high school program, providing real-world problems and case studies. Students from diverse backgrounds—electrical, mechanical, materials science, and chemical engineering—all find pathways into this multidisciplinary field.As one industry expert notes, students with hands-on, industry-specific training demonstrate markedly better performance both during interviews and on the job. This educational ecosystem is creating not just the chips of tomorrow, but the workforce that will design, build, and innovate them. Contact Our Guests on LinkedIn: Scott Hayes, NXPLiesl Folks, University of ArizonaJanet Hartkopf, Chandler Unified School DistrictChris Bailey, ASUPallavi Praful, ASU Rohit Gandhi, ASU IMAPS Device Packaging ConferenceInterconnects for Tomorrow's Applications Disclaimer: This post contains affiliate links. If you make a purchase, I may receive a commission at no extra cost to you.Support the showBecome a sustaining member! Like what you hear? Follow us on LinkedIn and TwitterInterested in reaching a qualified audience of microelectronics industry decision-makers? Invest in host-read advertisements, and promote your company in upcoming episodes. Contact Françoise von Trapp to learn more. Interested in becoming a sponsor of the 3D InCites Podcast? Check out our 2024 Media Kit. Learn more about the 3D InCites Community and how you can become more involved.

Send us a textWhat happens when AI diagnoses patients better than doctors? Where does artificial intelligence truly stand on the hype cycle? Is all this computational power actually benefiting society? These critical questions frame our fascinating discussion recorded live at IMAPS Device Packaging Conference in Phoenix, Arizona. Join our expert panel featuring Hemanth Jagannathan (IBM Research), Mark Kumerle (Marvell), and Kimon Michaels (PDF Solutions) as they tackle AI's most pressing challenges and opportunities. Their collective expertise reveals surprising insights about how AI is transforming industries while raising important considerations about its implementation.The conversation explores AI's evolution from specialized technical applications in semiconductors to today's consumer-facing generative tools. Our experts draw fascinating parallels between AI and previous technological breakthroughs like laser technology, suggesting we've only scratched the surface of potential applications. They provide compelling examples from healthcare where AI systems demonstrate superior diagnostic capabilities by processing complex datasets beyond human capacity.While acknowledging concerns around data accuracy, power consumption, and appropriate boundaries, the panel remains optimistic about AI's future. They emphasize that today's implementations represent merely the beginning of a transformative technology whose full impact remains largely unanticipated. Yet they also agree on applications where human judgment should remain primary – including, amusingly, matchmaking.Dive into this thought-provoking conversation to understand why organizations must either leverage AI effectively or risk being outpaced by competitors who do. Subscribe to 3D IncItes Podcast for more cutting-edge discussions on technologies shaping our future.IMAPS Device Packaging ConferenceInterconnects for Tomorrow's Applications Disclaimer: This post contains affiliate links. If you make a purchase, I may receive a commission at no extra cost to you.Support the showBecome a sustaining member! Like what you hear? Follow us on LinkedIn and TwitterInterested in reaching a qualified audience of microelectronics industry decision-makers? Invest in host-read advertisements, and promote your company in upcoming episodes. Contact Françoise von Trapp to learn more. Interested in becoming a sponsor of the 3D InCites Podcast? Check out our 2024 Media Kit. Learn more about the 3D InCites Community and how you can become more involved.

Send us a textExplore the transformative world of microelectronics packaging with industry visionaries Amy Lujan, Tim Olson, and Jan Vardaman as they share their journey at the IMAPS Annual Device Packaging Conference (DPC). With the conference relocating to the vast Wild Horse Pass, expect an enriched experience with expanded technical tracks and exhibitor opportunities reflecting the rising interest in this field. Get ready to embrace the future of packaging with insights that redefine its significance in the semiconductor industry.Uncover the critical challenges facing AI infrastructure in a thought-provoking panel discussion with experts from IBM Research, Intel, and leading OSATs. We'll tackle whether today's infrastructure can keep pace with AI's explosive growth, especially concerning energy-efficient chip designs and packaging solutions. Learn about groundbreaking advancements and the potential to alleviate data center power consumption concerns through innovative packaging techniques. Beyond the tech talk, we'll highlight the vibrant networking scene at the conference, featuring events like the Backyard Olympics and a charity golf tournament, ensuring a perfect blend of professional growth and community building. Join us for a chance to network, learn, and potentially reshape the future of microelectronics packaging.IMAPS Device Packaging ConferenceInterconnects for Tomorrow's Applications Disclaimer: This post contains affiliate links. If you make a purchase, I may receive a commission at no extra cost to you.Support the showBecome a sustaining member! Like what you hear? Follow us on LinkedIn and TwitterInterested in reaching a qualified audience of microelectronics industry decision-makers? Invest in host-read advertisements, and promote your company in upcoming episodes. Contact Françoise von Trapp to learn more. Interested in becoming a sponsor of the 3D InCites Podcast? Check out our 2024 Media Kit. Learn more about the 3D InCites Community and how you can become more involved.

Send us a textThe episode explores the key insights from the recent SEMI ISS event, focusing on the semiconductor industry's journey toward a trillion-dollar market by 2030. It discusses the significant themes of uncertainty and the transformative impact of AI, while also addressing industry challenges and emerging trends.Additionally, SEMI's Market Intelligence team dive into the revised 2024 equipment forecast and World Fab Forecast, discussing trends influenced by AI technology and geopolitical factors, especially those linked to China. As we detail the upswing in equipment sales, driven by Chinese investments and AI progress, we also spotlight the trends shaping both front and back-end equipment markets. From the resurgence of advanced packaging to the anticipated rebound in test equipment, this episode provides a thorough look at the semiconductor industry's current state and its promising future, including insights into the world fab forecast and its implications for the automotive and power sectors.Highlights:• Overview of SEMI ISS and its significance in the semiconductor industry • Highlights on this year's theme: Ready, Set Ramp! and its implications • Insights on overcoming market uncertainties and challenges • AI's transformative role in driving semiconductor innovation • Discussion of upcoming semi events and their importance for networking • Market intelligence updates on forecasts and growth opportunitiesContact Our Guests on LinkedIn: Joe Stockunas, President, SEMI AmericasChristian Dieseldorf, Senior Analyst, SEMI MITInna Skvortsova, Market Analyst, SEMI MIT SEMIA global association, SEMI represents the entire electronics manufacturing and design supply chain. Disclaimer: This post contains affiliate links. If you make a purchase, I may receive a commission at no extra cost to you.Support the showBecome a sustaining member! Like what you hear? Follow us on LinkedIn and TwitterInterested in reaching a qualified audience of microelectronics industry decision-makers? Invest in host-read advertisements, and promote your company in upcoming episodes. Contact Françoise von Trapp to learn more. Interested in becoming a sponsor of the 3D InCites Podcast? Check out our 2024 Media Kit. Learn more about the 3D InCites Community and how you can become more involved.

Send us a textUnlock the secrets of semiconductor packaging materials with insights from industry experts Dariush Tari and Rose Guino of Henkel's Semiconductor Packaging Materials Division. This episode promises a deep dive into the processes behind developing materials that are both reliable and high-performing, crucial for the ever-evolving demands of AI, machine learning, and quantum technologies. Dariush and Rose share their wealth of knowledge on material characterization, modeling, and application engineering, and discuss how Henkel maintains its pivotal role within the semiconductor ecosystem. From underfills to thermal interface materials, discover how comprehensive material offerings are shaping the future of high-performance computing.Explore the fascinating advancements in material modeling for semiconductors, where physics-based simulations are transforming reliability testing and development cycles. Gain a clearer understanding of capillary underfill materials and their vital role in enhancing solder joint reliability under thermal stress. This episode delves into the collaboration between material developers and modeling experts, underscoring the importance of early customer engagement to tailor innovative solutions. If you are interested in learning how cutting-edge materials are propelling the semiconductor industry forward, this conversation is a must-listen.Contact the Speakers on LinkedInDariush Tari, Henkel Semiconductor Packaging MaterialsRose Guino, Semiconductor Packaging Materials Henkel Semiconductor Packaging MaterialsHenke's advanced materials elevate semiconductor packaging to meet power, performance, area and costDisclaimer: This post contains affiliate links. If you make a purchase, I may receive a commission at no extra cost to you.Support the showBecome a sustaining member! Like what you hear? Follow us on LinkedIn and TwitterInterested in reaching a qualified audience of microelectronics industry decision-makers? Invest in host-read advertisements, and promote your company in upcoming episodes. Contact Françoise von Trapp to learn more. Interested in becoming a sponsor of the 3D InCites Podcast? Check out our 2024 Media Kit. Learn more about the 3D InCites Community and how you can become more involved.

Send us a textThis episode was recorded live at SEMICON Europa. Michael Zahn from Koh Young talks to Françoise von Trapp about the growing significance of metrology in semiconductor manufacturing and the need for advanced measurement technologies.  They discuss the transition from 2D to 3D measurements in semiconductor manufacturing.  Zahn explains why  non-destructive, optical 3D measurements offer precise height and position data with sub-micron resolution. You'll learn how these measurements are crucial for early defect detection, improving efficiency, and reducing waste. You'll also gain an understanding about the importance of real-time, in-line measurements for quality assurance and process optimization. Zahn also highlights Koh Young's AI integration for process control and the future potential of sub-micron resolution systems. Contact Michael Zahn on LinkedInKoh Young EuropeKoh Young paves the way for smart factory solutions with 3D measurement-based inspection solutions.Disclaimer: This post contains affiliate links. If you make a purchase, I may receive a commission at no extra cost to you.Support the showBecome a sustaining member! Like what you hear? Follow us on LinkedIn and TwitterInterested in reaching a qualified audience of microelectronics industry decision-makers? Invest in host-read advertisements, and promote your company in upcoming episodes. Contact Françoise von Trapp to learn more. Interested in becoming a sponsor of the 3D InCites Podcast? Check out our 2024 Media Kit. Learn more about the 3D InCites Community and how you can become more involved.

Send us a textThis episode was recorded live at SEMICON Europa. It features interviews with four of the 20 under 30 Recognition Award recipients from Cadence, ERS Electronic, KLA, and Semilab.  It also features updates from Comet Yxlon, Trymax Semiconductor, and DSV-IMS. SEMI Europe's 20 Under 30 program recognizes future leaders in the microelectronics industry. James McGrath from KLA discussed his role as a PE CBD Process Engineer and his unexpected entry into the semiconductor industry. Augustin Detruit from ERS Electronics highlighted his growth from a master's thesis to Head of Production, overseeing a significant increase in production capacity. Luca Sinkó from Semilab shared her journey from physics to R&D Team Leader and her recent promotion to Product Manager. Charis Kalantzi from Cadence detailed her role in supporting digital design tools and her involvement in community volunteering. All four talk about what brought them into the semiconductor industry, what made them stand out to the judges, and the honor of receiving such an award. From Dionys van de Ven, we hear about the announced the launch of Comet Yxlon's new 3D X-ray system for fab-level yield improvement, Peter Dijkstra from Trymax, discussed what is driving the company's growth and it's expansion into the U.S. market.Spencer Wall talks about DSV's acquisition of Schenker, and shares the progress so far. Michael Murray talks about DSV-IMS foray into using AI and machine learning to improve supply chain efficiencies. Support the showBecome a sustaining member! Like what you hear? Follow us on LinkedIn and TwitterInterested in reaching a qualified audience of microelectronics industry decision-makers? Invest in host-read advertisements, and promote your company in upcoming episodes. Contact Françoise von Trapp to learn more. Interested in becoming a sponsor of the 3D InCites Podcast? Check out our 2024 Media Kit. Learn more about the 3D InCites Community and how you can become more involved.

Send us a textIn this episode, recorded live at SEMICON Europa in Munich, Françoise von Trapp continues her conversations with the keynote speakers on helping to build Europe's technical sovereignty, and how implementing digital twins can help achieve this goal. John Behnke, of Inficon, discussed the evolution of smart manufacturing in the semiconductor industry. He highlighted how smart software can increase factory productivity by 5-15% by making autonomous decisions based on digital twins. You'll learn about Behnke's vision for the Smart Control Room. Catherine Le Lan, Synopsys, emphasized the need for collaboration between academia and industry to address the talent shortage, suggesting cross-disciplinary education and early branding of microelectronics. Katharina Westrich, Siemens, explained how digital twins optimize factory planning, reduce emissions, and train workforce remotely, envisioning a future where virtual and real-world operations are seamlessly integrated. SEMIA global association, SEMI represents the entire electronics manufacturing and design supply chain. Disclaimer: This post contains affiliate links. If you make a purchase, I may receive a commission at no extra cost to you.Support the showBecome a sustaining member! Like what you hear? Follow us on LinkedIn and TwitterInterested in reaching a qualified audience of microelectronics industry decision-makers? Invest in host-read advertisements, and promote your company in upcoming episodes. Contact Françoise von Trapp to learn more. Interested in becoming a sponsor of the 3D InCites Podcast? Check out our 2024 Media Kit. Learn more about the 3D InCites Community and how you can become more involved.

Send us a textThis episode was recorded live at SEMICON Europa in Munich. This year's theme of this year's conference is "Innovation and Collaboration: Powering Sustainable Exponential Growth". In other words, how the semiconductor industry can work together to sustainably reach the trillion dollar goal by 2030 without compromising its Net Zero goals. It's going to be tricky, for sure.Frederic Godemel of Schneider Electric talks about what he calls the “energy trilemma” that is causing the energy supply challenges. These are security, affordability, and the impact on the planet. He explains how electricity generated from renewable sources will help address these issues and implores the industry to focus on growing responsibly so it can meet its goals. The conversation continues with Comet CEO, Stephan Haferl, who discusses the importance of developing power-efficient semiconductors. He talks about the power advantages of 3D stacking and heterogeneous integration and explains how 3D X-ray technologies helps bring these technologies to market.  Lastly, you'll hear from Bart Placklé of imec, who talked about next generation vehicle architectures enabled by sensing and chiplets. You'll learn what's driving the need for chiplets in today's software-defined vehicles, and how chiplet architectures can take us to the next level of autonomous vehicles.SEMIA global association, SEMI represents the entire electronics manufacturing and design supply chain. Disclaimer: This post contains affiliate links. If you make a purchase, I may receive a commission at no extra cost to you.Support the showBecome a sustaining member! Like what you hear? Follow us on LinkedIn and TwitterInterested in reaching a qualified audience of microelectronics industry decision-makers? Invest in host-read advertisements, and promote your company in upcoming episodes. Contact Françoise von Trapp to learn more. Interested in becoming a sponsor of the 3D InCites Podcast? Check out our 2024 Media Kit. Learn more about the 3D InCites Community and how you can become more involved.

Send us a textIt's been quite an exciting year for the U.S. Chips for America as the funding starts rolling out. All year long, Françoise von Trapp has interviewed various government dignitaries about various elements of the CHIPS Act. This episode brings these episodes together in order of appearance, to give you a timeline of the year's progress. First up is Dan Berger,  National Advanced Packaging Manufacturing Program (NAPMP), who explains how CHIPS Acts monies are being used to address gaps like advanced packaging and substrate manufacturing, to help revitalize the US semiconductor industry. The focus is on developing domestic manufacturing teams for U.S. leadership in microelectronics, with global collaboration and security in mind. He discusses the importance of advanced packaging roadmaps aimed at scaling down feature sizes, eliminating interposers and integrating chiplets directly onto substrates.  Next, we hear from the Honoroable Laurie Locascio, Director of NIST, and Undersecretary of Commerce for Standards and Technology. She explains importance of public-private collaboration, addressing research gaps, strategic investments, and global collaboration to ensure the industry's success and address economic and national security concerns.Lastly, Dev Palmer explains Chips Act's funding distribution and its impact on the semiconductor ecosystem. He emphasizes the importance of bridging research and industry and describes some of the programs key initiatives. Palmer highlights the need for collaboration across large and small businesses, academia, and nonprofits to achieve the Chips Act's ambitious goals, and shares the details of the recently announced Small Business Innovation Research (SBIR) program under the Biden Harris administration.  Contact the Panelists on LinkedInDan Berger, Associate Director, NAPMPDr. Laurie Locascio, NISTDev Palmer, NAPMPSupport the showBecome a sustaining member! Like what you hear? Follow us on LinkedIn and TwitterInterested in reaching a qualified audience of microelectronics industry decision-makers? Invest in host-read advertisements, and promote your company in upcoming episodes. Contact Françoise von Trapp to learn more. Interested in becoming a sponsor of the 3D InCites Podcast? Check out our 2024 Media Kit. Learn more about the 3D InCites Community and how you can become more involved.

Send us a textOn September 30, 2024, Onto Innovation held the grand opening of its Packaging Applications Center of Excellence - or as it's being called, PACE. Françoise von Trapp attended the grand opening to learn why the company has partnered with like-minded suppliers of the panel-level packaging ecosystem to accelerate the development of PLP technologies for both organic and glass substrates. These include 3D InCites Members: LPKF Laser & Electronics, Evatec, MKS-Atotech and Lam Research; as well as Resonac, Corning, and others.This episode starts off with a conversation with Onto Innovation CEO, Mike Plisinski, who explains how PACE came to be, its business model, and why AI is driving growth in panel-level packaging. The story continues with a tour of PACE conducted by Keith Best, Director of PACE.  Best gives a step-by-step description of the processes as panels move from the photoresist coater, to the lithography stepper, to the developer, and then to the inspection system. He also talks about the role advanced lithography tools play in developing down-stream panel level processes. Lastly, you'll hear from PACE collaboration partners:Ralph Zoberbier, CMO, EvatecKuldip Johal, MKS-AtotechKazuyuki Mitsukura, ResonacJunro Yoon, Corning Advanced OpticsRichard Noack, LPKF Laser & Electronics Read the full story on 3D InCitesOnto Innovation Your partner for innovative solutions that improve time to market, yield, and product reliability.Disclaimer: This post contains affiliate links. If you make a purchase, I may receive a commission at no extra cost to you.Support the showBecome a sustaining member! Like what you hear? Follow us on LinkedIn and TwitterInterested in reaching a qualified audience of microelectronics industry decision-makers? Invest in host-read advertisements, and promote your company in upcoming episodes. Contact Françoise von Trapp to learn more. Interested in becoming a sponsor of the 3D InCites Podcast? Check out our 2024 Media Kit. Learn more about the 3D InCites Community and how you can become more involved.

Send us a textRecorded live at the IMAPS Symposium 2024 in Boston MA, where 3D InCites member companies presented their latest technologies and showcased their products. This episode features conversations with nine of our member companies. Brendan Wells, Amkor Technologies, Inc., explains the difference between laminate and strip-based substrates for advanced packaging and when to use each. He also discusses how chiplet integration is impacting the assembly processes.  Evan Griffith and Sze Pe Lim, Indium Corporation, talk about how changing advanced packaging requirements for AI chip sets are changing the game for materials development.  John Lannon, general manager of Micross AIT talks about progress with the company's 300mm capacity expansion and what it means to win the William T. Ashman and John A. Wagnon Technical Achievement Award.  LPKF's Richard Noack talks about the difference between glass interposers and glass core technology, and what's driving development of these materials. Sally Ann Henry, ACM Research, talks about the company's decision to invest in equipment platforms to support panel level packaging. Casey Krawiec, StratEdge Corporation, talks about what it means to receive the IMAPS Society Award for Corporate Sponsorship, and why he thinks it's important to support these activities. Habib Hichri, Ajinomoto Fine Techno, talks about his work with IMAPS Academy, and Ajinomoto's new developments beyond ABF dielectric film to address advanced packaging substrate material needs. Adeia's Guilian Gao talks about what OSATS need to do to support die to wafer hybrid bonding processes. Scott Sikorski, IBM, explains how the Northeast Corridor from New York up into Canada is becoming one of the U.S.'s hot spots in advanced packaging. Peter Cronin, MRSI Micronic, introduces the company's latest die bonders system, and talks about a new application center in LivermoIMAPS InternationalIMAPS is the largest society dedicated to microelectronics and electronics packaging advancement.Disclaimer: This post contains affiliate links. If you make a purchase, I may receive a commission at no extra cost to you.Support the showBecome a sustaining member! Like what you hear? Follow us on LinkedIn and TwitterInterested in reaching a qualified audience of microelectronics industry decision-makers? Invest in host-read advertisements, and promote your company in upcoming episodes. Contact Françoise von Trapp to learn more. Interested in becoming a sponsor of the 3D InCites Podcast? Check out our 2024 Media Kit. Learn more about the 3D InCites Community and how you can become more involved.

Send us a textAt IMAPS Symposium 2024, the annual IMAPS Society Awards were presented. These awards recognize IMAPS members who stand out for their efforts. They are peer-nominated awards and selected by a panel of previous winners, so it's very special to receive one, as it means many members have noticed their efforts. In this episode, Françoise sits down with three of the award winners to talk about their IMAPS experience, at different stages of their careers.Emma P Pawliczak was awarded the Steve Adamson Student Award. She is currently getting her Ph.D. at Binghampton University. Brandon Hamilton won the Emerging Leader Award, is a program manager at BAE Systems in Cedar Rapids IowaDr. Phil Garrou won the Lifetime Achievement Award. He is an Advanced Packaging subject matter expert for DARPA and the DoD through his consulting company Microelectronic Consultants of NC (MCNC).  You'll learn about the history of IMAPS and its origins from PhilYou'll learn how Emma benefits from student opportunities at IMAPSYou'll learn about how IMAPS helped Brandon make connections in the industryAll three talk about mentorship opportunities and how IMAPS provides a supportive community throughout a microelectronics career. Contact the Speakers on LinkedIn:Dr. Phil Garrou, MCNCEmma Pawliczak, Binghamton University Brandon Hamilton, BAE SystemsIMAPS InternationalIMAPS is the largest society dedicated to microelectronics and electronics packaging advancement.Disclaimer: This post contains affiliate links. If you make a purchase, I may receive a commission at no extra cost to you.Support the showBecome a sustaining member! Like what you hear? Follow us on LinkedIn and TwitterInterested in reaching a qualified audience of microelectronics industry decision-makers? Invest in host-read advertisements, and promote your company in upcoming episodes. Contact Françoise von Trapp to learn more. Interested in becoming a sponsor of the 3D InCites Podcast? Check out our 2024 Media Kit. Learn more about the 3D InCites Community and how you can become more involved.

Send us a textThis episode was recorded live at the IMAPS International Symposium in Boston MA.  Françoise von Trapp speaks with Dev Palmer, director of the National Advanced Packaging Manufacturing Program; Sandeep Sane of Lightmatter; Craig Bishop, Deca and Brett Wilkerson, AMD. Dev Palmer explains Chips Act's funding distribution and its impact on the semiconductor ecosystem. He emphasizes the importance of bridging research and industry and describes some of the programs key initiatives. Palmer highlights the need for collaboration across large and small businesses, academia, and nonprofits to achieve the Chips Act's ambitious goals, and shares the details of the recently announced Small Business Innovation Research (SBIR) program under the Biden Harris administration. Sandeep Sane, Head of Packaging at LightMatter, discusses the role of 3D optical integration in extreme compute scaling. He highlights the challenges in integrating silicon photonics into chip designs to provide high bandwidth at lower power, essential for AI and data centers. You'll learn how 3D stacking addresses memory and logic competition on chips; and how chiplet-based architectures improve performance but increase power consumption. Craig Bishop of DECA and Brett Wilkerson of AMD discuss the evolution and applications of Redistribution Layer (RDL) packaging, particularly in high-performance computing and AI. They also highlightthe role of AI in enhancing packaging design and the future of AI applications, emphasizing the need for both centralized and edge computing to balance performance and power consumption.Contact The Speakers on LInkedInDev Palmer, NAPMPSandeep Sane, LightmatterCraig Bishop, Deca Brett Wilkerson, AMD ResourcesFor General Inquiries about CHIPS for America askchips@chips.govFor CHIPS Incentives Program inquiries apply@chips.govFor Congressional inquiries about CHIPS for America legislativeaffairs@chips.govIMAPS InternationalIMAPS is the largest society dedicated to microelectronics and electronics packaging advancement.Disclaimer: This post contains affiliate links. If you make a purchase, I may receive a commission at no extra cost to you.Support the showBecome a sustaining member! Like what you hear? Follow us on LinkedIn and TwitterInterested in reaching a qualified audience of microelectronics industry decision-makers? Invest in host-read advertisements, and promote your company in upcoming episodes. Contact Françoise von Trapp to learn more. Interested in becoming a sponsor of the 3D InCites Podcast? Check out our 2024 Media Kit. Learn more about the 3D InCites Community and how you can become more involved.

Send us a textIn this episode, Françoise von Trapp speaks with Chee Ping Lee, of Lam Research, about the critical role of high bandwidth memory (HBM) in generative AI, emphasizing its high bandwidth and compact design.  HBM memory has received a lot of attention as one of the first technologies to implement 2.5D and 3D stacking. Lee explains how HBM uses advanced packaging technologies like TSV and microbumps to achieve high memory capacity and performance. Lam Research's solutions are key to HBM's success.Listen to learn details about: The importance of HBM for AI chip manufacturing  The relationship between advancedpackaging and HBMThe differences between different HBM generations The future of microbumps and hybrid bonding Lam Research's advanced packaging solutions Contact Chee Ping Lee on LinkedIN Learn more about why HBM Is a critical enabler for generative AI in this blog post. Lam Research Lam Research equipment and services allow chipmakers to build smaller and better performing devicesDisclaimer: This post contains affiliate links. If you make a purchase, I may receive a commission at no extra cost to you.Support the showBecome a sustaining member! Like what you hear? Follow us on LinkedIn and TwitterInterested in reaching a qualified audience of microelectronics industry decision-makers? Invest in host-read advertisements, and promote your company in upcoming episodes. Contact Françoise von Trapp to learn more. Interested in becoming a sponsor of the 3D InCites Podcast? Check out our 2024 Media Kit. Learn more about the 3D InCites Community and how you can become more involved.

Send us a textIn this episode, Francoise von Trapp speaks with Isabella Drolz from Comet about how AI is revolutionizing semiconductor inspection strategies, particularly in 3D X-ray systems. They discuss how AI is being used to find structural defects in advanced chip packages, and also how 3D inspection is being used to develop advanced AI technologies themselves. von Trapp and Drolz explore the evolution of inspection methods in advanced packaging, noting the complexity of 3D ICs and the limitations of traditional optical inspections. Drolz emphasizes the importance of AI in accelerating yield curves and improving inspection efficiency. She also mentions the need for an enterprise solution to integrate various inspection tools.You'll learn:About the difference between 2D and 3D X-ray technologiesHow 3D X-ray evolved over the past decade so that it can be used effectively in volume production How Comet Yxlon's CA 20 tool, integrated with the AI software Dragonfly, enhances defect detection by using deep learning to analyze X-ray imagesContact Isabella Drolz on LinkedInComet Xylon Comet Yxlon delivers high-end X-ray and CT system solutions for advanced packaging inspecton needs. Disclaimer: This post contains affiliate links. If you make a purchase, I may receive a commission at no extra cost to you.Support the showBecome a sustaining member! Like what you hear? Follow us on LinkedIn and TwitterInterested in reaching a qualified audience of microelectronics industry decision-makers? Invest in host-read advertisements, and promote your company in upcoming episodes. Contact Françoise von Trapp to learn more. Interested in becoming a sponsor of the 3D InCites Podcast? Check out our 2024 Media Kit. Learn more about the 3D InCites Community and how you can become more involved.

Send us a textIn this episode, Francoise speaks with Simon McElrea, an interconnectologist, about his career in and the evolution of interconnectology, emphasizing its importance in semiconductor packaging.McElrea discusses his roles at semiconductor start-ups like Vertical Circuits and Invensas;  his foray into wireless charging at Energous and FreePower; and his return to the semiconductor industry due to its current inflection point. He talks about how the Chips Act favors large companies over startups and stressed the need for government support to attract young talent and foster innovation. Lastly, McElrea explained how to better support startups and disruptive technologies in the semiconductor industry through policies and funding. Listen and learn: ·      How adopting the term "interconnectology" will change the narrative around advanced packaging·      Why we need to inspire young talent to pursue careers in interconnect-focused fields like packaging through initiatives at universities·      The role of consortia and joint ventures can play Contact Simon McElrea on LinkedInLQDXLQDX is setting a new metal deposition standard with its breakthrough family of Liquid Metal Inks®.Disclaimer: This post contains affiliate links. If you make a purchase, I may receive a commission at no extra cost to you.Support the showBecome a sustaining member! Like what you hear? Follow us on LinkedIn and TwitterInterested in reaching a qualified audience of microelectronics industry decision-makers? Invest in host-read advertisements, and promote your company in upcoming episodes. Contact Françoise von Trapp to learn more. Interested in becoming a sponsor of the 3D InCites Podcast? Check out our 2024 Media Kit. Learn more about the 3D InCites Community and how you can become more involved.

Send us a textIn this episode, Françoise von Trapp talks with Onto Innovation's Monita Pau and Jiangtao Hu about metrology for advanced packaging – why do we need it? What are the challenges, and how do we solve them?   In semiconductor manufacturing front-end processes, metrology has always been a critical step to ensure consistency of very fine features. It's only recently become important to back-end advanced packaging processes – especially for heterogeneous integration. As chips are designed with smaller features, advanced packaging processes are becoming more front-end like. You'll learn about how metrology designed for front-end manufacturing is being reimagined for wafer-level and assembly applications such as:Hybrid bonding3D stacking with micro bumpsRDL applications for interposersTSV applicationsThe speakers discuss the challenges, gaps, and solutions for each. You'll also learn what makes Onto Innovation uniquely qualified to support this. Contact Our Guests on LinkedIn ·       Monita Pau·       Jiangtao HuOnto Innovation Your partner for innovative solutions that improve time to market, yield, and product reliability.Disclaimer: This post contains affiliate links. If you make a purchase, I may receive a commission at no extra cost to you.Support the showBecome a sustaining member! Like what you hear? Follow us on LinkedIn and TwitterInterested in reaching a qualified audience of microelectronics industry decision-makers? Invest in host-read advertisements, and promote your company in upcoming episodes. Contact Françoise von Trapp to learn more. Interested in becoming a sponsor of the 3D InCites Podcast? Check out our 2024 Media Kit. Learn more about the 3D InCites Community and how you can become more involved.

Send us a textIn this episode, Tarak Railkar and Benson Chan join Françoise von Trapp for a preview of  The IMAPS International Symposium 2024, which takes place in Boston from September 30 to October 3, 2024. This year's symposium focuses on heterogeneous integration for paradigm-shifting microelectronics and photonics. It will feature a five-track technical program, special interactive sessions on onshoring, keynote speakers by industry leaders, and much more.  The symposium will also host a Bingo networking event to promote DEI, a career fair, student poster sessions, and off-site tours to MIT and MRSI Systems. Listen in to learn about: The benefits of volunteering for IMAPS Networking and career opportunities The speaker and panel line-up Register for this year's IMAPS Symposium here. Contact the Speakers on LinkedInTarak Railkar, General ChairBenson Chan, General Chair-ElectIMAPS InternationalIMAPS is the largest society dedicated to microelectronics and electronics packaging advancement.Disclaimer: This post contains affiliate links. If you make a purchase, I may receive a commission at no extra cost to you.Support the showBecome a sustaining member! Like what you hear? Follow us on LinkedIn and TwitterInterested in reaching a qualified audience of microelectronics industry decision-makers? Invest in host-read advertisements, and promote your company in upcoming episodes. Contact Françoise von Trapp to learn more. Interested in becoming a sponsor of the 3D InCites Podcast? Check out our 2024 Media Kit. Learn more about the 3D InCites Community and how you can become more involved.

Send us a textIn this episode, Françoise von Trapp speaks with Bruce Kim, of SurplusGLOBAL, for an update on the semiconductor secondary equipment market, and how the US. and European Chips Acts are impacting it. They also discuss the trend of top-tier OEMS prioritizing the development of innovative technology rather than investing in legacy tools that are still very much in need, and the impact this is having on device manufacturers that rely on legacy tools, but have trouble finding repair parts. This was part of an interview with Bruce by WorldFolio. Find the complete article here.   You'll learn how SurplusGLOBAL is building a global parts platform that helps legacy tool owners find parts, and also manufactures replacement parts for those that have become obsolete. You'll also learn how AI is helping to optimize this business. You'll also hear about the 2030 Big Cluster Project, the company's global expansion in semiconductor manufacturing hot spots around the globe, and more. Contact Bruce Kim on LinkedInSurplusGLOBALSurplusGLOBAL is one of the largest one-stop platforms for pre-owned semiconductor equipment. Disclaimer: This post contains affiliate links. If you make a purchase, I may receive a commission at no extra cost to you.Support the Show.Become a sustaining member! Like what you hear? Follow us on LinkedIn and TwitterInterested in reaching a qualified audience of microelectronics industry decision-makers? Invest in host-read advertisements, and promote your company in upcoming episodes. Contact Françoise von Trapp to learn more. Interested in becoming a sponsor of the 3D InCites Podcast? Check out our 2024 Media Kit. Learn more about the 3D InCites Community and how you can become more involved.

Send us a Text Message.In this episode, Françoise von Trapp and underfill materials expert, Dick Jensen, NAMICS corporation explore the societal and technological challenges that impact microelectronic materials development. The conversation focuses on the evolution of underfill materials development over the past 30 years. They discuss the importance of underfill materials in semiconductor manufacturing, focusing on their compatibility, environmental impact, and properties. You'll learn about:The development of specialized underfill materials for advanced packaging technologies, including AI chips, and the challenges arising from material changes in electronics manufacturingHistorical examples of working with restricted substances and how that created a need for alternative materials The current need for collaboration and innovation to address the issue of PFAS chemicals in productsWhy and how much testing is important to ensure material compatibility and performanceNAMICS NAMICS Corporation provides advanced materials and solutions for the semiconductor industry.Disclaimer: This post contains affiliate links. If you make a purchase, I may receive a commission at no extra cost to you.Support the Show.Become a sustaining member! Like what you hear? Follow us on LinkedIn and TwitterInterested in reaching a qualified audience of microelectronics industry decision-makers? Invest in host-read advertisements, and promote your company in upcoming episodes. Contact Françoise von Trapp to learn more. Interested in becoming a sponsor of the 3D InCites Podcast? Check out our 2024 Media Kit. Learn more about the 3D InCites Community and how you can become more involved.

Send us a Text Message.This episode was recorded live at SEMICON West 2024 – SEMI's flagship tradeshow where the global industry gathers to showcase its latest products and technologies; and discuss topics critical to the industry's growth. Two of these continue to be Sustainability and Workforce Development.  Today's guests will address both these topics. Paul Kelly, Vice President of Strategies, Partnerships, & New Ventures and Chief Operating Officer of NY CREATES, and Dr. Mousumi Bhat, SEMI Vice President of Sustainability Programs join Françoise von Trapp to discuss an environmental sustainability partnership between NY CREATES and the SEMI Climate Consortium (SCC). You'll learn: What the SCC is all about and why it's a crucial step forward for the semiconductor industry New York's leadership role in addressing environmental sustainability for the semiconductor industry What the agreement between SEMI and NY CREATES covers How the climate agreement dovetails with the CHIPS Act and it's goalsand more. Our second guest is Shari Liss, Director of SEMI Foundation. She updates Françoise on the initiatives her team launched in the U.S. to address the semiconductor talent shortage, and how they are being rolled out in other parts of the globe. Connect with our guests on LinkedIn: Paul Kelly, NY CREATESMousumi Bhat, SEMI Shari Liss, SEMI Foundation  SEMIA global association, SEMI represents the entire electronics manufacturing and design supply chain. Disclaimer: This post contains affiliate links. If you make a purchase, I may receive a commission at no extra cost to you.Support the Show.Become a sustaining member! Like what you hear? Follow us on LinkedIn and TwitterInterested in reaching a qualified audience of microelectronics industry decision-makers? Invest in host-read advertisements, and promote your company in upcoming episodes. Contact Françoise von Trapp to learn more. Interested in becoming a sponsor of the 3D InCites Podcast? Check out our 2024 Media Kit. Learn more about the 3D InCites Community and how you can become more involved.

Send us a Text Message.For this 3D InCites Podcast Extra, Françoise von Trapp traveled to Morrisville, North Carolina, to witness Foundry 2.0 in action at NHanced Semiconductors. She speaks with founder and CEO Bob Patti about his vision for the company, which is based on implementing the Foundry 2.0 business model he conceptualized.  It involves sourcing dies and chiplets from traditional foundries and applying semiconductor foundry processes and advanced packaging and assembly technologies. You'll learn:What's driving the transition to advanced packaging from traditional scalingWhy the traditional foundry model may not be the way going forwardHow Foundry 2.0 is different Françoise also takes you on an audio tour of the facility, led by Operations Director, Carl Petteway. It gets a bit noisy - but you'll feel like you're right there, and you'll learn about the tools used to perform processes like chemical mechanical polishing (CMP), photolithography, hybrid bonding, and through silicon vias. Contact Our Guests on LinkedIn:Bob Patti, CEO and Founder, NHanced SemiconductorsCarl Petteway, Operations Director, NHanced SemiconductorsLearn More: Read the story and see the photos from the tour on the 3D InCites Website.NHanced SemiconductorsThe USA's First Pure-Play Advanced Packaging Foundry - Where Innovation Meets PrecisionDisclaimer: This post contains affiliate links. If you make a purchase, I may receive a commission at no extra cost to you.Support the Show.Become a sustaining member! Like what you hear? Follow us on LinkedIn and TwitterInterested in reaching a qualified audience of microelectronics industry decision-makers? Invest in host-read advertisements, and promote your company in upcoming episodes. Contact Françoise von Trapp to learn more. Interested in becoming a sponsor of the 3D InCites Podcast? Check out our 2024 Media Kit. Learn more about the 3D InCites Community and how you can become more involved.

Send us a Text Message.The semiconductor industry supply chain continues to capture attention as general awareness about the importance of semiconductors in our everyday lives grows.The news of global expansion and ongoing delays of new fabs coming online is constant. But have you ever stopped to think how complicated it is to outfit a fab with its highly calibrated, sensitive equipment? There are many moving parts to consider – both figuratively and literally. In this episode, Françoise von Trapp leads a conversation with Barry O'Dowd of Kuehne+Nagel; Kevin Mille, of KLA, and Emerald Grieg, of  PTW Group to discuss what it takes to successfully move a piece of semiconductor equipment from the supplier to the manufacturer. The speakers discuss trade compliance and logistics challenges, the proper approach to packing and crating sensitive equipment, and how to ensure safe transportation. They discuss the differences between moving new equipment from an OEM, and secondary equipment from a broker. They also share stories of when things didn't go exactly to plan, and what they learned from the experience.  Listen in and learn: What you should consider when you're ready to move a toolWhat you need to know about trade compliance issuesWhat to do if the customer is not ready to receive the tool The importance of communication and collaboration throughout the processThe importance of using specialists who understand the complexities of semiconductor equipment and partsAnd more…    Contact Our Panel on LinkedIn:  Barry O'Dowd, Kuehne+Nagel Emerald Grieg, PTW Group Kevin Mille, KLA Kuehne+NagelTrust Semicon Logistics by Kuehne+Nagel to navigate even the most demanding supply chain challenges.Disclaimer: This post contains affiliate links. If you make a purchase, I may receive a commission at no extra cost to you.Support the Show.Become a sustaining member! Like what you hear? Follow us on LinkedIn and TwitterInterested in reaching a qualified audience of microelectronics industry decision-makers? Invest in host-read advertisements, and promote your company in upcoming episodes. Contact Françoise von Trapp to learn more. Interested in becoming a sponsor of the 3D InCites Podcast? Check out our 2024 Media Kit. Learn more about the 3D InCites Community and how you can become more involved.

Send us a Text Message.This week's episode was recorded live at SEMICON West where 10 of our community members have news to share. The conversation focused on the latest advancements in semiconductor technology, including lithography, packaging, and materials. Speakers discussed the need to reduce power consumption in AI chips, the potential of using interposers to connect dies without pads, and the ongoing talent crisis in the industry. They also highlighted the importance of sustainability and the potential for the industry to reach a trillion-dollar goal by 2030. Additionally, speakers discussed the expansion of companies in North America, the significance of UV laser debonding, and the investment in electric vehicles and carbon initiatives.Speakers include: Ken McWilliams, of Multibeam Corporation, and Brad Ferguson of Skywater Technology Ram Trichur, Henkel Technologies Alan Weber, PDF SolutionsNirmalya Maity and Zia Karim, Yield Engineering Systems (YES) Martin Elzingre and Jeremy Sanner of Edwards  Dave Kirsch and Thomas Uhrmann of EV Group  Spencer Wall and Robert Green of DSV–IMS Chuck Byers, of Monozukuri (MZ Technologies) Meg Conkling, of VeecoBernd Krafthofer of ERS Electronic GmbH The Brandon T. Adams Audio ExperienceWelcome to The Brandon T. Adams Audio Experience, hosted by entrepreneur, investor,...Listen on: Apple Podcasts SpotifySEMIA global association, SEMI represents the entire electronics manufacturing and design supply chain. Disclaimer: This post contains affiliate links. If you make a purchase, I may receive a commission at no extra cost to you.Support the Show.Become a sustaining member! Like what you hear? Follow us on LinkedIn and TwitterInterested in reaching a qualified audience of microelectronics industry decision-makers? Invest in host-read advertisements, and promote your company in upcoming episodes. Contact Françoise von Trapp to learn more. Interested in becoming a sponsor of the 3D InCites Podcast? Check out our 2024 Media Kit. Learn more about the 3D InCites Community and how you can become more involved.

Send us a Text Message.Recorded live at SEMICON West 2024, SEMI's flagship tradeshow where the global semiconductor industry gathers to discuss important matters and showcase new products and technology.  This episode features Françoise von Trapp's conversation with Jose Fernandez, Under Secretary of Economic Growth, Energy, and The Environment for the Department of State, to talk about securing critical supply chains for the 21st century.   Fernandez discussed the importance of addressing geopolitical issues and ensuring supply chain resilience, particularly in the aftermath of the pandemic. He highlighted the importance of establishing global semiconductor supply chains that meet clean energy goals to galvanize a clean energy future. He also emphasized the need to prioritize security over efficiency and highlighted the issue of semiconductors seeping into Russia despite sanctions. You'll also learn:How the U.S. Department of State International Technology Security and Innovation Fund (ITSI) supports workforce development and is helping to secure critical minerals. About the impact of sanctions on Russia's semiconductor industry, and how companies are working together to improve due diligence and prevent the flow of semiconductors into RussiaSEMIA global association, SEMI represents the entire electronics manufacturing and design supply chain. Disclaimer: This post contains affiliate links. If you make a purchase, I may receive a commission at no extra cost to you.Support the Show.Become a sustaining member! Like what you hear? Follow us on LinkedIn and TwitterInterested in reaching a qualified audience of microelectronics industry decision-makers? Invest in host-read advertisements, and promote your company in upcoming episodes. Contact Françoise von Trapp to learn more. Interested in becoming a sponsor of the 3D InCites Podcast? Check out our 2024 Media Kit. Learn more about the 3D InCites Community and how you can become more involved.

Send us a Text Message.Recorded live at SEMICON West 2024, the flagship tradeshow for SEMI, where the entire industry gathers to showcase their latest products and technologies.  Françoise von Trapp interviews Laurie Locascio, Director of NIST and the Under Secretary of Commerce for Standards and Technology to learn more about the US CHIPS and Science Act, implementation updates, and government investments in semiconductor manufacturing and supply chain. Key takeaways included the importance of public-private collaboration, addressing research gaps, strategic investments, and global collaboration to ensure the industry's success and address economic and national security concerns.You'll learn about:Strategic partnerships with industry to ensure Chips Act investments achieve long-term goals.Advanced packaging R&D funding opportunities.Global semiconductor industry collaboration and government support.SEMIA global association, SEMI represents the entire electronics manufacturing and design supply chain. Disclaimer: This post contains affiliate links. If you make a purchase, I may receive a commission at no extra cost to you.Support the Show.Become a sustaining member! Like what you hear? Follow us on LinkedIn and TwitterInterested in reaching a qualified audience of microelectronics industry decision-makers? Invest in host-read advertisements, and promote your company in upcoming episodes. Contact Françoise von Trapp to learn more. Interested in becoming a sponsor of the 3D InCites Podcast? Check out our 2024 Media Kit. Learn more about the 3D InCites Community and how you can become more involved.

Send us a Text Message.Françoise von Trapp and AJ Incorvaia discuss the evolution of EDA tools for 3D integration and design tools for 3D ICs and packaging. They talk about the need for real-time 3D visualization and automation capabilities to enable the design and manufacturing of complex 3D ICs. They also highlighted the growing importance of digital twin technology in the semiconductor industry and the challenges of designing and optimizing 3D ICs, including the need for concurrent design across multiple disciplines.You'll learn about: Evolution of semiconductor packaging from wire bond to heterogeneous integration and 3D stacking3D IC design tools and their evolutionDigital twins, chiplet architectures, and 3D integration processes in semiconductor designInnovator 3D IC - a new product " for faster, more predictable chip designSiemens' new 3D IC design platform for concurrent design and optimization.How design teams can take advantage of the digital twin and predictive analysis capabilities in Innovator 3D IC.Learn more about Innovator 3D ICContact AJ Incorvaia on LinkedInSiemens EDA Siemens' EDA software helps you turn today's ideas into the sustainable products of the future.Disclaimer: This post contains affiliate links. If you make a purchase, I may receive a commission at no extra cost to you.Support the Show.Become a sustaining member! Like what you hear? Follow us on LinkedIn and TwitterInterested in reaching a qualified audience of microelectronics industry decision-makers? Invest in host-read advertisements, and promote your company in upcoming episodes. Contact Françoise von Trapp to learn more. Interested in becoming a sponsor of the 3D InCites Podcast? Check out our 2024 Media Kit. Learn more about the 3D InCites Community and how you can become more involved.

Send us a Text Message.In this episode, Françoise von Trapp speaks with Christine King, the world's first woman CEO of a semiconductor company, about her journey from near destitution to success in a male-dominated industry. Christine recently published a memoir about her journey, called Breaking Through the Silicon Ceiling, which details her journey and provides insights on work-life balance at IBM and beyond. Christine talks about how she overcame adversity and stumbled into engineering and entrepreneurship. She shares stories of how she made her way up the IBM corporate ladder, overcoming challenges such as gender bias and roadblocks from male colleagues. You'll learn about her 12 lessons for success, the importance of mentorship, networking, and sponsorship, and the need for individuals to advocate for themselves and support each other in their careers. Christine King's book, Breaking Through the Silicon Ceiling, is available here on Amazon and Barnes and Noble. Connect with Christine King on LinkedIn. Correction: the interview states that the book was released on July 4, 2024. But its actual release date was June 28, 2024.  Support the Show.Become a sustaining member! Like what you hear? Follow us on LinkedIn and TwitterInterested in reaching a qualified audience of microelectronics industry decision-makers? Invest in host-read advertisements, and promote your company in upcoming episodes. Contact Françoise von Trapp to learn more. Interested in becoming a sponsor of the 3D InCites Podcast? Check out our 2024 Media Kit. Learn more about the 3D InCites Community and how you can become more involved.

Send us a Text Message.Saxony, Germany, has a strong potential to become a global semiconductor location due to its long history in traditional industries, technological base, vast talent pool, strategic location, and investment in education and new talent. In this episode, Françoise von Trapp speaks with Andreas Lippert, of Saxony Trade and Invest, and  Jan Klinger, of Fabmatics, about the region's unique ecosystem for microelectronics, government co-funding, and innovation. You'll learn about:Saxony's history in innovation and competitiveness, and its impact on developing strong industrial sectors.Saxony's microelectronics cluster and its growth potentialGermany's commitment to sustainability in the semiconductor industry,  and how automating legacy fabs provides environmental benefits.How Saxony is attracting skilled workers and employees, particularly women, by offering affordable housing, childcare, and education.  Saxony's strengths in microelectronics and automation make it a promising location for the semiconductor industry.Contact Our Guests on LinkedInAndreas Lippert, Saxony Trade and InvestJan Klinger, FabmaticsSaxony Trade and InvestSaxony Trade & Invest is the public economic development agency of the Free State of Saxony, GermanyDisclaimer: This post contains affiliate links. If you make a purchase, I may receive a commission at no extra cost to you.Support the Show.Become a sustaining member! Like what you hear? Follow us on LinkedIn and TwitterInterested in reaching a qualified audience of microelectronics industry decision-makers? Invest in host-read advertisements, and promote your company in upcoming episodes. Contact Françoise von Trapp to learn more. Interested in becoming a sponsor of the 3D InCites Podcast? Check out our 2024 Media Kit. Learn more about the 3D InCites Community and how you can become more involved.

Send us a Text Message.Françoise von Trapp talks with ECTC 2024 General Chair, Karlheinz Bock and Program Chair, Michael Mayer about highlights and key takeaways from the 2024 IEEE Electronic Component Technology Conference. (ECTC 2024). Bock and Mayer discussed the growth of ECTC 2024, and how focusing on strategic decisions such as changing the format and increasing the exhibition space helped organizers achieve record attendance. They also describe the volunteering opportunities and the pathway to leadership it provides. They shared their own experiences and the impact ECTC has had on their careers. From the event itself, you'll learn about the importance of packaging technology and collaboration between chip and packaging communities to meet the high bandwidth requirements of AI applications. You'll also learn about advancements in hybrid bonding, metrology, and the impact of geopolitics in electronics packaging.How to Start a Podcast Guide: The Complete GuideLearn how to plan, record, and launch your podcast with this illustrated guide.Support the Show.Become a sustaining member! Like what you hear? Follow us on LinkedIn and TwitterInterested in reaching a qualified audience of microelectronics industry decision-makers? Invest in host-read advertisements, and promote your company in upcoming episodes. Contact Françoise von Trapp to learn more. Interested in becoming a sponsor of the 3D InCites Podcast? Check out our 2024 Media Kit. Learn more about the 3D InCites Community and how you can become more involved.

Send us a Text Message.This episode features conversations at ECTC 2024 with 11 of 3D InCites community members. You'll learn about their perspectives on the hottest topics of the times such as thermal management and power issues for AI devices, and glass core substrates versus organic substrates. You'll also learn about their latest technology advancements key takeaways from ECTC 2024.  Guests includeVikas Gupta and Mark Gerber of ASE Group  Rao Bonda and Nathan Whitchurch of Amkor TechnologiesEelco Bergman and Bart Deprospo of Saras Micro Devices Simon McElrea of LQDX Rama Pulligada and Alex Smith, of Brewer ScienceBob Patti of NHanced Semiconductors John Lannon of Micross Bob Chylak of Kulicke & Soffa  Tony Gueli and Venkata Mokkapati of AT&S Kuldip Johal, MKS-Atotech Joel Scutchfield, Koh Young AHow to Start a Podcast Guide: The Complete GuideLearn how to plan, record, and launch your podcast with this illustrated guide. What If? So What?We discover what's possible with digital and make it real in your businessListen on: Apple Podcasts Spotify Climate ConfidentWith a new episode every Wed morning, the Climate Confident podcast is weekly podcast...Listen on: Apple Podcasts SpotifySupport the Show.Become a sustaining member! Like what you hear? Follow us on LinkedIn and TwitterInterested in reaching a qualified audience of microelectronics industry decision-makers? Invest in host-read advertisements, and promote your company in upcoming episodes. Contact Françoise von Trapp to learn more. Interested in becoming a sponsor of the 3D InCites Podcast? Check out our 2024 Media Kit. Learn more about the 3D InCites Community and how you can become more involved.

Send us a Text Message.Recorded live at the 2024 Electronic Component Technology Conference, this episode features conversations Francoise von Trapp has with Keynote Speaker Keren Bergman, Columbia University and co-founder of Xscape Photonics,  and Chet Lennox, of KLA.  Bergman explains the potential of photonics in AI applications to improve energy efficiency and bandwidth.  You'll learn about the limitations of current photonics technology in data centers and proposes a new generation of integrated photonics and silicon to overcome these limitations. You'll also learn about the development of unique laser technologies for energy efficiency and the latest advancements in optical communication technologies, including full-wafer fabrication and wafer-scale probe technology.Learn more about Xscape Photonics.Chet Lenox talks about the growing importance of metrology and inspection in advanced packaging processes. He shares highlights of an ECTC special session, such as the importance of including process control in the Heterogeneous Integration Roadmap, and a technology track on metrology and inspection in future ECTC programs. You'll learn why In-line metrology is crucial for controlling processes, ensuring defect-free surfaces, and reducing variability. Quality and yield are key concerns, and more inspection and metrology are needed in the early stages of R&D to ensure success. Contact Our Speakers on Linkedin: ·      Keren Bergman, Ph.D, Professor at Columbia University·      Chet Lenox, Fellow, KLAHow to Start a Podcast Guide: The Complete GuideLearn how to plan, record, and launch your podcast with this illustrated guide.Support the Show.Become a sustaining member! Like what you hear? Follow us on LinkedIn and TwitterInterested in reaching a qualified audience of microelectronics industry decision-makers? Invest in host-read advertisements, and promote your company in upcoming episodes. Contact Françoise von Trapp to learn more. Interested in becoming a sponsor of the 3D InCites Podcast? Check out our 2024 Media Kit. Learn more about the 3D InCites Community and how you can become more involved.

In this preview episode for SEMICON West 2024, Françoise von Trapp and SEMI America's President Joe Stokunas talk about SEMICON West's Past, Present, and Future. The discussion emphasizes the need for collaboration in the semiconductor industry and the important role SEMI plays in supporting the interests of its global members.  Joe updates listeners on semiconductor industry growth and challenges, including sustainability, workforce development, and supply chain risks. He also shares updates on investment opportunities in the US industry, particularly opportunities in New York and Arizona.  You'll learn about the speaker line-up for the two-day CEO Summit during SEMICON West, which focuses on investment in the U.S. semiconductor industry on day one, and global opportunities on Wednesday. You'll also hear about the special features and numerous networking opportunities scattered throughout the week. The episode concludes with a sneak preview of SEMICON West 2025 in Phoenix, highlighting its key features and networking opportunities. You'll also learn about the importance of community, industry, and government collaboration to make the move to Phoenix successful.To learn more and register for SEMICON West, visit the website.   How to Start a Podcast Guide: The Complete GuideLearn how to plan, record, and launch your podcast with this illustrated guide.SEMIA global association, SEMI represents the entire electronics manufacturing and design supply chain. Disclaimer: This post contains affiliate links. If you make a purchase, I may receive a commission at no extra cost to you.Support the Show.Become a sustaining member! Like what you hear? Follow us on LinkedIn and TwitterInterested in reaching a qualified audience of microelectronics industry decision-makers? Invest in host-read advertisements, and promote your company in upcoming episodes. Contact Françoise von Trapp to learn more. Interested in becoming a sponsor of the 3D InCites Podcast? Check out our 2024 Media Kit. Learn more about the 3D InCites Community and how you can become more involved.

Glass has long been explored as an alternative substrate material to organic laminates and silicon. As high-performance computing and chiplets HPC push the boundaries of existing technology, they are demanding innovative packaging solutions, beginning with innovative substrate materials.  This is paving the way for glass. In this episode, Françoise von Trapp and Richard Noack discuss the highlights and takeaways from the recent webinar, Evolving HPC and Chiplet Packaging with Glass, and dive deeper into the motivation and trends that are bringing glass to the forefront. They talk about the need for collaboration across the glass ecosystem and issue a call to action for downstream metrology companies to collaborate on developing solutions for measuring through transparent materials. You'll learn about the challenges of integrating glass into semiconductor production, such as the lack of reliability data, metrology processes, aspect ratio issues, metallization, and standardization. You'll also learn about the benefits of LPKF's semiconductor manufacturing process, including adaptability, low to high-volume sampling, and a flexible process that can be tuned to meet industry needs.Catch the replay of the webinar hereFind Richard Noack on Linked In hereLPKF Laser & Electronics A leading provider of laser manufacturing solutions for advanced semiconductor packaging and more. Disclaimer: This post contains affiliate links. If you make a purchase, I may receive a commission at no extra cost to you.Support the Show.Become a sustaining member! Like what you hear? Follow us on LinkedIn and TwitterInterested in reaching a qualified audience of microelectronics industry decision-makers? Invest in host-read advertisements, and promote your company in upcoming episodes. Contact Françoise von Trapp to learn more. Interested in becoming a sponsor of the 3D InCites Podcast? Check out our 2024 Media Kit. Learn more about the 3D InCites Community and how you can become more involved.

This episode features the winners of this year's 3D InCites Awards. These included five technology enablement awards, one sustainability award, the Adele Hars Award for DEI, and an award for Best Place to Work. Nils Anspach, of LPKF & Laser Electronics, explains the company's laser-based deep etching technology for glass substrates in heterogeneous integration, and how it solves the challenges of forming interconnects through glass substrates. Dave Taraci, of Carl Zeiss Microscopy, explains how advanced microscopy techniques address the challenge of analyzing mixed material devices such as chiplets and heterogeneous integration packages in microelectronics. Ken MacWilliams, of Multibeam, addresses the challenges of chiplet communication with large interposers and high-density interconnects. He explains how Multibeam's multi-E beam lithography is improving the productivity of a lab tool by over 100x, allowing for faster prototyping and development.Debbie Claire Sanchez of ERS Electronic, GmbH, talks about the company's culture steeped in diversity, equity, inclusion and belonging. She shares her personal journey into senior leadership at the company and explains the global internship program and family-like environment that makes ERS such a great place to work. Charles Woychik, of NHanced Semiconductors, describes how Bob Patti's leadership and culture of caring at NHanced Technology has created a positive work environment and successful company. He also shares news of NHanced's new advanced packaging facility which is the first of its kind in the US, focusing on high-mix, low-volume leading-edge technologies like chiplet integration and 3D heterogeneous integration.Craig Bishop of Deca talks about the latest chapter of the Adaptive Patterning story. Adaptive Pad Stacks are a continuation of Adaptive Patterning, addressing misalignment issues in large-scale interposers. He explains how it can address AI scaling, by solving die-shift issues in bridge technologies. Vikram Turkani, of PulseForge, discusses how ever-thinning wafers used in 3D stacking called for new solutions for temporary bond/debond processes. The company's photonic debonding provideClimate ConfidentWith a new episode every Wed morning, the Climate Confident podcast is weekly podcast...Listen on: Apple Podcasts SpotifySupport the showBecome a sustaining member! Like what you hear? Follow us on LinkedIn and TwitterInterested in reaching a qualified audience of microelectronics industry decision-makers? Invest in host-read advertisements, and promote your company in upcoming episodes. Contact Françoise von Trapp to learn more. Interested in becoming a sponsor of the 3D InCites Podcast? Check out our 2023 Media Kit. Learn more about the 3D InCites Community and how you can become more involved.

This episode was recorded live at the IMAPS Device Packaging Conference – helping celebrate the event's 20th year. The record turnout included many of our 3D InCites Community members. Françoise von Trapp spoke with several of them who were exhibiting and presenting, and in some cases, simply attending.  Alex Ospina of ACM Research discussed the latest technologies in wafer-level packaging, and the company's focus on developing novel IP technologies to address industry challenges. You'll hear about the company's new vacuum cleaning tool designed to remove flux from bonds in smaller chiplets. You'll also learn about the company's approach to reducing its environmental impact. Tim Olson, of Deca, shares big news about the company's collaboration with ASU to create an open lab for innovation for innovation, licensing its M-Series and Adaptive Patterning technology, and working with ASU to outfit a fab with unique equipment.Laura Mirkarimi and Oliver Zhao, of Adeia, explain the important role optical interferometry plays in atomic-level hybrid bonding. Zhao explains how they are using AI-powered neural networks to identify defects in the hybrid bonding process, with a focus on categorizing defects based on their relevance to certain process steps.Manuela Junghähnel, of Fraunhofer IZM-ASSID,  explains her new role taking over the leadership of IZM-ASSID, from Jürgen Wolf.  She talks about learning the pilot scale to the production line created by Wolf. She also explains the relationship from the parent IZM and IZM ASSID.Brian Riley, of QP Technologies, shares a history of advanced packaging technologies, and the company. He describes QPs' proprietary process for flip chip packages, the use of open mold plastic packages, and overmold QFNs.Justin Locke, of Siemens EDA discusses innovations in functional verification of 3D Heterogeneous integration connectivity. He explains about the importance of formal verification in the design process, highlighting its ability to catch errors early on and prevent physical implementation issues. Peter Cronin, of MRSI Mycronic talks about new technologies and interconnects in optical packaging, highlighting the need for active alignment tools. He introduces the Active AClimate ConfidentWith a new episode every Wed morning, the Climate Confident podcast is weekly podcast...Listen on: Apple Podcasts SpotifySupport the showBecome a sustaining member! Like what you hear? Follow us on LinkedIn and TwitterInterested in reaching a qualified audience of microelectronics industry decision-makers? Invest in host-read advertisements, and promote your company in upcoming episodes. Contact Françoise von Trapp to learn more. Interested in becoming a sponsor of the 3D InCites Podcast? Check out our 2023 Media Kit. Learn more about the 3D InCites Community and how you can become more involved.

This episode was recorded live at IMAPS DPC, where the Spring version of the Global Business Council focused on Geopolitics Fueling the Repatriation of the Semiconductor Ecosystem. To get the complete picture of the collaboration happening, Françoise von Trapp speaks with representatives of the government, industry, and academia.  Dan Berger,  National Advanced Packaging Manufacturing Program (NAPMP), explains how CHIPS Acts monies are being used to address gaps like advanced packaging and substrate manufacturing, to help revitalize the US semiconductor industry. The focus is on developing domestic manufacturing teams for U.S. leadership in microelectronics, with global collaboration and security in mind. He discusses the importance of advanced packaging roadmaps aimed at scaling down feature sizes, eliminating interposers and integrating chiplets directly onto substrates.  Zachary Holman, of Arizona State University, discusses how ASU's Fulton School of Engineering is working to advance the college's research impact in areas such as health, climate, and national security through partnerships with government and industry investments. He highlights ASU's focus on extending the advanced packaging capabilities of its MacrotTechnology Works (MTW) fab, which allows for larger-scale packaging tools and pilot-to-fab gap closure.  Holman emphasized the importance of providing hands-on experience with state-of-the-art tools and materials for students. This will help provide a skilled workforce that can operate and maintain the latest equipment.  Holman also discussed how ASU is building a platform to democratize innovation by providing access to R&D capabilities for startups and small businesses. Mark Litecky, of Skywater, highlights the need for secure supply chain management and proprietary technology management in the U.S. semiconductor industry. He also stressed the importance of having global capabilities and secure supply chain management in the US, while avoiding duplication in different regions. Litecky also highlighted workforce development, emphasizing the need for more people to understand the value of the field and the various career paths available.  Contact the Panelists on LinkedInDan Berger, Associate Director, NAPMPZachary Holman, Vice Dean, Arizona State University Mark Litecky, Chief Revenue Officer, SkywaterSupport the showBecome a sustaining member! Like what you hear? Follow us on LinkedIn and TwitterInterested in reaching a qualified audience of microelectronics industry decision-makers? Invest in host-read advertisements, and promote your company in upcoming episodes. Contact Françoise von Trapp to learn more. Interested in becoming a sponsor of the 3D InCites Podcast? Check out our 2023 Media Kit. Learn more about the 3D InCites Community and how you can become more involved.

This episode was recorded live at the IMAPS Device Packaging Conference in Fountain Hill AZ, where several of the keynote talks focused on chiplet architectures and heterogeneous integration for semiconductor device manufacturing, assembly, test, and packaging.  Françoise von Trapp talks with Arvind Kumar, of 3D InCites member company,  IBM and Hemanth Dhavaleswarapu of AMD, about chiplet application drivers, such as artificial intelligence. She then talks to Pooya Tadeyon, of Intel, to find out why we are moving to advanced packaging, and particularly chiplet architectures, to enable the future of Moore's law. You'll learn about: Chiplets architectures for high-performance applications How chiplets can enable foundational AI models that can be applied to various business use cases Challenges in chiplet design and test The importance of open interface standards Contact our guests on LinkedIn: Arvind Kumar, IBM Hemanth Dhavaleswarapu, AMD Pooya Tadeyon, Intel  Next week, our coverage of IMAPS continues, as we bring you conversations from the Global Business Council, which focused on repatriating the US microelectronics industry. You'll get perspectives from academia, the government, and industry. IMAPS International IMAPS is the largest society dedicated to microelectronics and electronics packaging advancement.Disclaimer: This post contains affiliate links. If you make a purchase, I may receive a commission at no extra cost to you.Support the showBecome a sustaining member! Like what you hear? Follow us on LinkedIn and TwitterInterested in reaching a qualified audience of microelectronics industry decision-makers? Invest in host-read advertisements, and promote your company in upcoming episodes. Contact Françoise von Trapp to learn more. Interested in becoming a sponsor of the 3D InCites Podcast? Check out our 2023 Media Kit. Learn more about the 3D InCites Community and how you can become more involved.

In this episode, recorded live at SEMI ISS Europe, Françoise von Trapp hands over the mic to SEMI Europe President, Laith Altimime, who leads a discussion on the European chip industry's growth and challenges, and whether the European Chips Act will strengthen Europe towards its 20% vision goal.   Panelists include: Manfred Horstmann, GM and SVP GlobalFoundries DresdenThomas Richter, Senior Vice President & Managing Director, Infineon Technologies DresdenJuergen Schmidt, VP Semiconductor Manufacturing Frontend, Robert Bosch GmbHAndreas Lippert, Head of Department (Vice President) Acquisition, Inward Investment, Saxony Economic Development Corporation The discussion broadened to include the chip industry's role in sustainability and talent development. Reducing Scope 3 emissions and addressing supply chain challenges are key topics.    From this conversation, you'll discover: Lessons learned from COVID for creating a resilient supply chainEurope's value proposition for investment in the semiconductor industryGermany's strengths and unique selling points How to address the talent crisis  Cost management in the semiconductor industry   SEMI A global association, SEMI represents the entire electronics manufacturing and design supply chain. Disclaimer: This post contains affiliate links. If you make a purchase, I may receive a commission at no extra cost to you.Support the showBecome a sustaining member! Like what you hear? Follow us on LinkedIn and TwitterInterested in reaching a qualified audience of microelectronics industry decision-makers? Invest in host-read advertisements, and promote your company in upcoming episodes. Contact Françoise von Trapp to learn more. Interested in becoming a sponsor of the 3D InCites Podcast? Check out our 2023 Media Kit. Learn more about the 3D InCites Community and how you can become more involved.

This week's episode was recorded at ISS Europe, in Vienna, where the European semiconductor industries key strategists gathered to plan the path forward and forge a sustainable path to securing 20% of the global semiconductor market. One of the main topics continues to be building a resilient semiconductor supply chain. In the first segment of the episode, Françoise speaks with Sandrine Bronner, VP of supply chain, in the semiconductor division of Edwards Vacuum. They discuss her approach to creating end-to-end semiconductor supply chain resilience.    You'll learn how to adapt to a changing environment through a positive approach that emphasizes risk management and supplier assessment.  You'll also learn about the benefits of diversifying suppliers of critical components, and how designing in multiple sources can help create resilience in your supply chain. In the second segment of the episode, Françoise hands over the mic to Michael Alexander, of Roland Berger, who led the Panel discussion: Powering Europe's Future - The Impact of Geopolitics on Energy.  Panelists include:  Katharina Westrich, Global Head of Vertical Management Semiconductor, Digital Industries, Siemens AGYvonne Keil, Director Global Procurement, GlobalFoundriesNicolas Leterrier, Semiconductor Sustainability Business Leader, Schneider Electric The group discusses the energy industry's supply shortage and geopolitical effects, particularly its impact on the European sector of the semiconductor supply chain. You'll learn about the shift from centralized to distributed energy systems and the potential for AI to improve energy efficiency and sustainability. You'll also learn about the need for green energy in the semiconductor industry, and the impact it may have on cost.  The conversation shifts to the need to invest in sustainability improvement and upgrades to legacy fabs, and the importance of being willing to pay a premium for green products. The Code of Entry PodcastThe Code of Entry Podcast, hosted by the insightful Greg Bew, delves deep into the...Listen on: Apple Podcasts SpotifySEMI A global association, SEMI represents the entire electronics manufacturing and design supply chain. Disclaimer: This post contains affiliate links. If you make a purchase, I may receive a commission at no extra cost to you.Support the showBecome a sustaining member! Like what you hear? Follow us on LinkedIn and TwitterInterested in reaching a qualified audience of microelectronics industry decision-makers? Invest in host-read advertisements, and promote your company in upcoming episodes. Contact Françoise von Trapp to learn more. Interested in becoming a sponsor of the 3D InCites Podcast? Check out our 2023 Media Kit. Learn more about the 3D InCites Community and how you can become more involved.