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Mike Stephen learns how bricks tell the history of Chicagoland with Will Quam, author of the new book Fire and Clay: How Bricks Reveal the Hidden History of Chicago, and then chats with Akele Spencer, a resident of the South Side and member of Southside Together, about his opposition to a new microelectronics park being built in his community.
Send us Fan MailOn this episode of Embedded Insiders, we're talking about connectivity within the IoT ecosystem with Transatel's Cédric Jarkovsky, Director, Product Development & IoT Business, specifically regarding next-generation eSIMs and Private 5G networks, end-to-end monitoring and AI anomaly detection, and unified IoT management.Next, Rich is joined by Aptiv's Senior VP and Chief Product Officer, Deepali Trehan, to discuss the clear distinction between "intelligent mobility" and "autonomous drive," and how Aptiv is applying the former to many platforms that are not automobiles.But first, Ken is back from Microelectronics US in Austin, Texas, giving a recap of the sessions he moderated and the overall turnout of the event.For more information, visit embeddedcomputing.com
Send us Fan MailOn this episode of Embedded Insiders, Bruno Damien, Ecosystem & Partners Marketing Director at e-peas, joins the podcast to discuss sustainable IoT. The company develops effective solutions for harvesting ambient energy with Ambient Energy Managers (AEMs) and an extensive portfolio of Power Management Integrated Circuits (PMICs). Next, Rich and Marc Serughetti, the Vice President of Product Line Management for the Synopsys Systems Design Group, dive into how digital twins can simplify your development process.But first, Ken talks about his upcoming trip to Austin, Texas for Microelectronics US 2026.For more information, visit embeddedcomputing.com
Over the past decade, microelectronics and semiconductors have become a cornerstone of U.S. national security and supply chain resilience, moving beyond a purely technical issue to a central focus of economic and defense policy in Washington. In this episode, host Dr. Arun Seraphin sits down with Grant Meyer, chair of the National Defense Industrial Association Electronics Division, to discuss the evolving role of the electronics industrial base in supporting U.S. defense capabilities and securing critical supply chains. The conversation explores how rising geopolitical competition and legislation such as the CHIPS and Science Act have accelerated federal attention on semiconductor manufacturing, microelectronics innovation, and resilient supply chains. Seraphin and Meyer also dive into the challenges of building a coherent national electronics strategy, including fragmented priorities across the industrial base and commercial technology sector, and the difficulty of aligning long-term defense acquisition timelines with fast-moving commercial cycles. Meyer draws on his extensive experience in defense electronics to explain why microelectronics and semiconductors are foundational to modern military systems and national security infrastructure. Check out Meyer's NDIA division here: https://www.ndia.org/divisions/electronics NDIA ETI Report – “Modernizing Defense Microelectronics: Challenges and Opportunities”: https://www.emergingtechnologiesinstitute.org/publications/research-papers/modernizing-defense-microelectronics ETH Podcast on Report: https://www.youtube.com/@EmergingTechETI/search?query=electronics ETH Podcast CHIPS Act and Microelectronics - https://www.youtube.com/watch?v=36rGE0yjw1Y&t=5s Tech 101 Webinar: Microelectronics - https://www.youtube.com/watch?v=p6sxrq3PiwI&list=PL5oQnv75FK5bwT5tk6qgPa3FhLWm1vgAv&index=37&t=3066s&pp=iAQB Be sure to follow us on social media for updates, early access to upcoming events, inside scoops, & more: LinkedIn: https://bit.ly/4htROo0 Twitter: https://bit.ly/48LHAx3 Facebook: https://bit.ly/47vlht8 And for more podcasts, articles, & publications all things emerging tech, check out our website at: ndiaeti.org #ETI #EmergingTech #SupplyChains #Microelectronics #Semiconductors
Microelectronics and semiconductor technologies are no longer commodities—they are central to national security and defense innovation. James Chew, President and General Manager of Government Technologies at Intel, explains why this shift is redefining how the semiconductor industry supports defense platforms. Chew joins Dr. Arun Seraphin to explore how microelectronics has evolved from interchangeable components to mission-critical systems, driving a fundamental change in procurement and supply chain strategy. He highlights how past commercial off-the-shelf reforms created sustainment gaps as suppliers exited the market, leaving critical defense systems waiting on parts. The discussion also examines Intel's Secure Enclave, designed to provide reliable access to advanced semiconductor manufacturing through dedicated capacity at its Arizona facility. Chew further outlines how government investment can strengthen the microelectronics and semiconductor industrial base, align long-term priorities, and enable Intel to operate more like a defense prime contractor in an increasingly competitive global landscape. NDIA ETI Report – “Modernizing Defense Microelectronics: Challenges and Opportunities”: https://www.emergingtechnologiesinstitute.org/publications/research-papers/modernizing-defense-microelectronics ETH Podcast on Report: https://www.youtube.com/@EmergingTechETI/search?query=electronics ETH Podcast CHIPS Act and Microelectronics - https://www.youtube.com/watch?v=36rGE0yjw1Y&t=5s Tech 101 Webinar: Microelectronics - https://www.youtube.com/watch?v=p6sxrq3PiwI&list=PL5oQnv75FK5bwT5tk6qgPa3FhLWm1vgAv&index=37&t=3066s&pp=iAQBe sure to follow us on social media for updates, early access to upcoming events, inside scoops, & more: LinkedIn: https://bit.ly/4htROo0 Twitter: https://bit.ly/48LHAx3 Facebook: https://bit.ly/47vlht8 And for more podcasts, articles, & publications all things emerging tech, check out our website at: ndiaeti.org #ETI #EmergingTech #Microelectronics #Semiconductor
我们真的挖到一位“手搓芯片”的博士！当大家都在聊“卡脖子”时，他从微电子一线带来最硬核的解读：真正的卡脖子，可能和你想象的不太一样。从本科满课的牛马节奏，到直博五年产学研三位一体的实战经历，再到如今一边做产业、一边冲学术的双线。他用热爱把最难的专业走成了最燃的人生。如果你也对“芯片”这个热词背后的真实世界好奇，或者正在犹豫要不要踏入这个领域，这期节目就是你的第一步。听他聊聊从零手搓芯片的成就感，聊聊23人专业里唯一留下的故事，也聊聊如何在高压节奏里，靠打麻将、陪老婆、和兄弟夜谈，守住生活的平衡。本期嘉宾Rio，带你走进芯片设计的世界，也走进一个“专业圣体”的真实日常。时间码:00:58 真正的“卡脖子”不是比谁最先进，而是谁能让80%的人用上05:58 AI芯片本质上是一根“多功能水管”？09:20 “预备牛马训练营”：满载/超负荷的本科四年，每一门都重要！12:33 产学研三位一体：一边在公司干活，一边把科研做了14:30 公司里的研究岗，而不是研究院里的工程师16:35对物理的热爱，源自初高中老师，也使我成为了最后的1/2318:50 从智能小车到手搓芯片，这种成就感让人上瘾21:29朝阳行业的博士毕业生，是选择工业界还是留在学术界？25:25想要继续深造：还得吃得苦中苦，这可是一年就68分的专业28:12工作不可能三角：钱多轻松正反馈29:37读博五年，每一年都在和专业一起蓬勃发展31:40 周周DDL、月月里程碑：这才是工程世界的时间观34:05高强度工作：偶尔的连续熬大夜，但也能做到早九晚六37:30 读博最重要的收获：不是paper，是那几个一直在的人本期节目提到的专业：微电子学与固体电子学（Microelectronics and Solid-State Electronics）BGM: Airae - All Parts Equal
What if one of the most critical components in modern technology — from fighter jets to smartphones — is also one of the most overlooked? In this episode of The China Desk Podcast, host Steve Yates sits down with David Schild, Executive Director of the Printed Circuit Board Association of America (PCBAA), to break down the strategic importance of printed circuit boards (PCBs) and why they have become a major vulnerability in the U.S.–China competition. Schild explains that while policymakers have focused heavily on semiconductors and rare earths, the United States has largely ignored the “middle layer” of the electronics stack — printed circuit boards — which connect and enable every advanced system in modern life. From defense systems and AI data centers to power grids and consumer electronics, virtually everything relies on PCBs. The conversation details how China came to dominate global PCB production through long-term industrial policy, subsidies, and strategic investment, while U.S. production collapsed from roughly 30% of global supply to just 4% today. This shift has created serious national security concerns, including supply chain dependence, risks to trusted and secure systems, and the loss of domestic research and development. The discussion also explores: • Why PCB dependency poses risks to defense systems and critical infrastructure • How “dual-use” and commercial off-the-shelf components create loopholes in defense procurement • What happens to U.S. supply chains in a Taiwan crisis or major disruption in Asia • The lack of surge manufacturing capacity in the United States • Policy solutions including the PCBS Act, tax incentives, and Buy America requirements • The role of tariffs, industrial policy, and strategic investment in rebuilding domestic production • Why industrial policy and national security are now inseparable Schild argues that rebuilding U.S. PCB manufacturing is not just an economic issue — it is essential to maintaining technological leadership, securing supply chains, and ensuring that the United States can compete in an era of great power competition. Watch Full-Length Interviews: https://www.youtube.com/@ChinaDeskFNW
2026-03-13 | UPDATES #144 | This is big. Earlier this week Ukraine just struck one of the nerve centres of Russia's missile-industrial machine. Why Ukraine hit Kremniy EL now, and why it matters.This is not just another oil depot or barracks. Not another ammo dump or drone cache. A microelectronics plant. It is the very definition of hitting the archer, not just the arrows. The target was Kremniy EL in Bryansk, a major Russian manufacturer of military-use microelectronics near the Ukrainian border. On March 10, Ukraine's military said it hit the facility with Storm Shadow air-launched cruise missiles, and President Volodymyr Zelensky said the plant produced electronics and components for Russian missiles — the same missiles, as he put it, that hit Ukrainian cities, villages and civilians. (Reuters)Reuters reports that Ukraine described Kremniy EL as “a critically important link in the chain of production of Russian high precision weapons,” while the General Staff said “significant damage” to production facilities had been recorded, with the full extent still being assessed. This was not opportunistic, but industrial warfare, targeted and deliberate. (Reuters)----------SUPPORT THE CHANNEL:https://www.buymeacoffee.com/siliconcurtainhttps://www.patreon.com/siliconcurtainhttps://www.gofundme.com/f/scaling-up-campaign-to-fight-authoritarian-disinformation----------A REQUEST FOR HELP!I'm heading back to Kyiv this week, to film, do research and conduct interviews. The logistics and need for equipment and clothing are a little higher than for my previous trips. It will be cold, and may be dark also. If you can, please assist to ensure I can make this trip a success. My commitment to the audience of the channel, will be to bring back compelling interviews conducted in Ukraine, and to use the experience to improve the quality of the channel, it's insights and impact. Let Ukraine and democracy prevail! https://buymeacoffee.com/siliconcurtain/extrashttps://www.patreon.com/siliconcurtainhttps://www.gofundme.com/f/scaling-up-campaign-to-fight-authoritarian-disinformationNONE OF THIS CAN HAPPEN WITHOUT YOU!So what's next? We're going to Kyiv in January 2026 to film on the ground, and will record interviews with some huge guests. We'll be creating opportunities for new interviews, and to connect you with the reality of a European city under escalating winter attack, from an imperialist, genocidal power. PLEASE HELP ME ME TO GROW SILICON CURTAINWe are planning our events for 2026, and to do more and have a greater impact. After achieving more than 12 events in 2025, we will aim to double that! 24 events and interviews on the ground in Ukraine, to push back against weaponized information, toxic propaganda and corrosive disinformation. Please help us make it happen!----------SOURCES: Reuters, “Zelenskiy says Ukraine's military hit key Russian missile plant in Bryansk region” — March 10, 2026. Reuters, “Ukrainian missile strike on Russia's Bryansk causes casualties, local governor says” — March 10, 2026. The Kyiv Independent, “Ukraine strikes missile control systems plant in Russia's Bryansk Oblast, Zelensky says” — March 10, 2026. Ukrainska Pravda, “Ukraine's General Staff releases footage of Storm Shadow strike on Bryansk plant in Russia” — March 10, 2026. Meduza, “ВСУ нанесли удар ракетами Storm Shadow по заводу микроэлектроники ‘Кремний Эл' в Брянске” — March 10, 2026. Deutsche Welle Russian, “ВСУ нанесли ракетный удар по производителю военной продукции в Брянске” — March 10, 2026. ----------
Milano chiude in rialzo oltre il 2%, avvicinandosi ai 47.000 punti, mentre il DAX cresce dell'1% e il CAC 40 dello 0,5%. ST Microelectronics e Unicredit brillano, mentre Brunello Cucinelli segna un lieve calo. Learn more about your ad choices. Visit megaphone.fm/adchoices
Le borse europee chiudono in ribasso, con Milano che registra perdite contenute grazie a ST Microelectronics. Settori come il lusso e le banche mostrano segnali di difficoltà, mentre i rendimenti restano stabili. Learn more about your ad choices. Visit megaphone.fm/adchoices
Send us a textA nationwide talent engine for chips is taking shape—and it's built to scale. Recorded live at SEMICON West in Phoenix, we sit down with SEMI Foundation leaders to unpack the National Network for Microelectronics Education, a hub-and-node model designed to align schools, employers, and workforce systems. Backed by CHIPS Act funding through the National Science Foundation, NNME will fund multi-state regional nodes that modernize curricula, streamline upskilling, and share proven playbooks across the country. We also unveil the refreshed Chip Path portal, which maps your skills and interests to real jobs in fabs, equipment, and materials, and we highlight SEMI-Quest, a hands-on STEM experience designed to spark early curiosity about microelectronics.Then we turn to sustainability where momentum is accelerating. The Semiconductor Climate Consortium has grown past 100 members and is shifting from baselines to projects that deliver measurable impact. We explore how the Energy Collaborative pushes for policy that opens affordable renewable power, while SCC advances user-side strategies—better emissions accounting, renewable procurement models, and fab energy efficiency. A core challenge emerges: hyperscalers often target net zero by 2030, while many chipmakers point to 2050. We dig into how coordinated innovation, shared standards, and advocacy can close that 20-year gap.AI's energy appetite raises the stakes, so we tackle both sides of the equation: adding clean capacity where it matters most and designing for lower power at the chip and fab level. From global cooperation across APAC, EU, and the U.S. to practical ways individuals and companies can act now, the throughline is collaboration with urgency. Ready to find your role in the future of chips—whether building skills, hiring smarter, or decarbonizing faster? Subscribe, share this episode with your team, and leave a review to help more people find these insights.SEMIA global association, SEMI represents the entire electronics manufacturing and design supply chain. Disclaimer: This post contains affiliate links. If you make a purchase, I may receive a commission at no extra cost to you.Support the showBecome a sustaining member! Like what you hear? Follow us on LinkedIn and TwitterInterested in reaching a qualified audience of microelectronics industry decision-makers? Invest in host-read advertisements, and promote your company in upcoming episodes. Contact Françoise von Trapp to learn more. Interested in becoming a sponsor of the 3D InCites Podcast? Check out our 2024 Media Kit. Learn more about the 3D InCites Community and how you can become more involved.
Send us a textWe record live at IMAPS to follow a first-time attendee's leap into advanced packaging and a trio of high school students discovering semiconductors, robotics, and career paths that bridge disciplines. Along the way, we unpack speed-to-market, standards, hybrid vs TCB, and why AI skills matter.• why a self-funded first conference can reset a career• key takeaways from PDCs and technical talks• time-to-market pressure across packaging workflows• standards tension between front-end and packaging• hybrid bonding promise versus TCB workhorse reality• how to network with intent and follow through• volunteering with IMAPS to build early-career hubs• robotics as an on-ramp to semiconductors• interdisciplinary routes into microelectronics• student goals, mentors, and university paths• practical questions to ask on the expo floorIMAPS InternationalIMAPS is the largest society dedicated to microelectronics and electronics packaging advancement.Disclaimer: This post contains affiliate links. If you make a purchase, I may receive a commission at no extra cost to you.Support the showBecome a sustaining member! Like what you hear? Follow us on LinkedIn and TwitterInterested in reaching a qualified audience of microelectronics industry decision-makers? Invest in host-read advertisements, and promote your company in upcoming episodes. Contact Françoise von Trapp to learn more. Interested in becoming a sponsor of the 3D InCites Podcast? Check out our 2024 Media Kit. Learn more about the 3D InCites Community and how you can become more involved.
Send us a textThe IMAPS International Symposium returns to the Town & Country Resort in San Diego from September 29-October 2, 2024, featuring restructured technical tracks, new Monday panel discussions, and exciting networking events including a special reception aboard the USS Midway aircraft carrier. General Chair Benson Chan and outgoing IMAPS President Erica Folk share what attendees can expect at this premier microelectronics packaging event.• Expanded program with six focused technical tracks for better attendee experience• New Monday afternoon panels on thermal challenges, HIR roadmap, and co-packaged optics• Co-location with the new Thermal Management Conference (Wednesday-Friday)• Special reception on the USS Midway aircraft carrier (requires RSVP during registration)• Student engagement through high school tours, university booths, and the Posters & Pizza session• Leadership transition as Erica Folk hands the presidency to Dan Kruger• Multiple networking opportunities throughout the week including the Exhibitor Happy Hour• Volunteer opportunities that provide valuable professional development and career connectionsRegister now at imaps.org to secure your spot at the symposium and don't forget to RSVP for the special Midway reception.Support the showBecome a sustaining member! Like what you hear? Follow us on LinkedIn and TwitterInterested in reaching a qualified audience of microelectronics industry decision-makers? Invest in host-read advertisements, and promote your company in upcoming episodes. Contact Françoise von Trapp to learn more. Interested in becoming a sponsor of the 3D InCites Podcast? Check out our 2024 Media Kit. Learn more about the 3D InCites Community and how you can become more involved.
Preeti Chalsani, Chief Quantum Officer at Intersect Illinois, and Harley Johnson, CEO of the Illinois Quantum and Microelectronics Park, are interviewed by Yuval Boger. Preeti and Harley discuss the rapid creation and ambitious goals of the IQMP, a state-backed initiative to support the scale-up of quantum computing and microelectronics. They talk about the park's public-private structure, a $500M infrastructure investment by the state, early tenants like PsiQuantum and and Diraq, and its emphasis on workforce development and cross-sector collaboration. They also explore Illinois' unique advantages as well as the challenges of infrastructure timelines, community impact, managing expectations in a fast-moving field, and much more.
My special guests this week are Angelo Dragone and Paul McIntyre from the SLAC National Accelerator Laboratory. Angelo, Paul and I chat about the mission of the SLAC National Accelerator Laboratory and how SLAC is advancing the development of next generation microelectronics. We also chat about the details of their new Microelectronics Energy Efficiency Research Center for Advanced Technologies (MEERCAT) and why the reduction of power consumption and the discovery of new materials is a driving force behind this new endeavor.
Send us a textAndrew Mathers, Principal Product Line Manager at Nordson Test and Inspection, discusses the revolutionary advancements in 3D x-ray inspection technology and how they're improving semiconductor manufacturing quality.• X-ray inspection requires high resolution, speed, and cost-effectiveness to drive better product quality• Traditional 2D radiographic imaging is being replaced by 3D imaging for more stringent manufacturing requirements• Planar CT imaging suffers from artifacts when inspecting flat electronic components like circuit boards and wafers• Dynamic Planar CT takes more images from different angles with a wider field of view, reducing artifacts• New technology operates twice as fast as traditional methods while reducing x-ray dose to sensitive components• Automated inspection systems integrate directly into manufacturing lines with no human interaction required• Common applications include detecting voids in ball grid arrays and micro bumps in flip chip devices• The technology supports Quality 4.0 initiatives by providing feedback to improve manufacturing processes• Nordson's systems are in use worldwide with an install base exceeding 2000 automated x-ray inspection systemsLearn more about Dynamic Planar CT and Nordson's x-ray inspection solutions at nordson.com or on their YouTube channel.Nordson Test and Inspection Delivering best-in-class test, inspection, and metrology solutions for semiconductor applications. Disclaimer: This post contains affiliate links. If you make a purchase, I may receive a commission at no extra cost to you.Support the showBecome a sustaining member! Like what you hear? Follow us on LinkedIn and TwitterInterested in reaching a qualified audience of microelectronics industry decision-makers? Invest in host-read advertisements, and promote your company in upcoming episodes. Contact Françoise von Trapp to learn more. Interested in becoming a sponsor of the 3D InCites Podcast? Check out our 2024 Media Kit. Learn more about the 3D InCites Community and how you can become more involved.
Microelectronics are the foundation of technology today, but what about tomorrow? Ten years from now? Twenty?Real breakthroughs don't come from simply refining what already exists—they come from reimagining what's possible. In this episode, Dr. Whitney Mason, Director of DARPA's Microsystems Technology Office (MTO), takes us inside the research that is pushing microelectronics beyond conventional thinking. She explores the potential of organic circuits to revolutionize computing, not by replacing existing technology, but by opening entirely new frontiers in electronics design. From assessing the potential of quantum computing to novel material innovations that could redefine performance and efficiency, MTO is driving advancements that go far beyond conventional chipmaking.Dr. Mason also shares her perspective on how DARPA's risk-taking culture enables groundbreaking discoveries, and why the speed of innovation is critical to maintaining U.S. technological advantage. She discusses MTO's focus on next-generation manufacturing approaches that integrate best-of-breed materials to achieve disruptive performance leaps. By moving beyond traditional microelectronics and embracing unconventional ideas, MTO is working to create the future of technology—one where microelectronics aren't just smaller and faster, but smarter, more resilient, and capable of things we have yet to fully envision.Show notes and links:Dr. Whitney MasonMicrosystems Technology OfficeVoices from DARPA Episode 42: The Infrared VisionaryVoices from DARPA Episode 72: The Quantum MechanicQBI: Quantum Benchmarking Initiative AMME: Additive Manufacturing of MicrosystEmsNGMM: Next-Generation Microelectronics Manufacturing Episode 85 posting date: January 31, 2025
Steve Grzanich has the business news of the day with the Wintrust Business Minute. The State of Illinois is reportedly trying to land chip maker Nvidia. Bloomberg reports the company made a site visit to the Illinois Quantum and Microelectronics Park in Chicago at the former U.S. Steele site on the south side. Nvidia makes […]
Dr. William Lazonick is an economist who studies innovation and competition in the global economy, who has recently been focusing on the corrosive role of stock buybacks. We invited him on to explain why this widespread financial practice is such a bad idea in his eyes, and in return were provided with a comprehensive model of what makes a successful economy. In short, Lazonick believes that no economic system can survive without "the firm," the kind of old school corporate organization that maintained a stable a social contract with its workers, sometimes over the course of an entire lifetime. In Lazonick's view, all economic growth and progress comes down to the ability of the firm to honor that social contract, which means he traces the slump we're in to the death of this tradition. But the question is, what caused us to become eternally itinerant workers in search of global opportunties, hopping from job to job every few years? Lazonick's got that answer, too. He points to a radical transformation of our financial and economic system that came to a head in the 1970s. PATREON: get episodes early + join our weekly Patron Chat https://bit.ly/3lcAasB MERCH: Rock some DemystifySci gear : https://demystifysci.myspreadshop.com/ AMAZON: Do your shopping through this link: https://amzn.to/3YyoT98 SUBSTACK: https://substack.com/@UCqV4_7i9h1_V7hY48eZZSLw@demystifysci FURTHER READING Eric Williams: Capitalism and Slavery (https://amzn.to/4gvd0rW) Alfred Marshall: Principles of Economics (https://amzn.to/49AnpR9) John Kenneth Galbraith: The Great Crash (https://amzn.to/4iuykQp) Edwin Black: IBM and the Holocaust (https://amzn.to/4gwFce8) Milton Friedman: The Social Responsibility of a Business is to Increase Profits (https://www.nytimes.com/1970/09/13/archives/a-friedman-doctrine-the-social-responsibility-of-business-is-to.html) (00:00) Go!(00:09:21) The Study of Economics: Integrating History and Theory(00:15:21) Capitalism, Innovation, and Economic Growth(00:29:27) Shift from Feudalism to Corporate Structures(00:37:00) Global Capital and Industrial Revolution(00:41:28) Transition to Large Firms in America(00:49:12) Evolution of U.S. Steel and Stock Market's Role(00:52:05) Venture Capital and Initial Public Offerings(00:59:12) Corporate Financial Strategies Pre-Depression(01:03:00) Stock Buybacks and Modern Corporate Strategies(01:09:40) Rise of Mass Unionization(01:20:14) Stock Market Roles and Corporate Control(01:31:10) Managerial Strategy Shifts(01:41:06) Technological Shifts and Corporate Adaptation(01:51:13) Rise of Silicon Valley and Corporate Strategy(01:56:23) Evolution of the Tech Industry(02:02:47) Shareholder Value Ideology(02:18:40) Shift in Investment Strategies(02:26:02) Corporate Focus on Stock Buybacks(02:32:00) Mechanics of Stock Buybacks(02:37:14) Financialization and Market Effects #CorporateHistory, #StockBuybacks, #ShareholderValue, #StockMarket, #Innovation, #EconomicGrowth, #IndustrialRevolution, #TechnologyTrends, #MiddleClassDecline, #SiliconValley, #ShareholderValue, #CorporateCulture, #Unionization, #EconomicInequality, #ModernEconomy, #USEconomy, #LaborMarket, #HumanCapital, #EconomicDecline, #1970sEconomy, #CorporateCollapse,#WealthInequality, #1980sEconomy, #FinancializationCrisis, #StockMarketImpact, #SiliconValleyStory, #VentureCapital, #StartupCulture, #TechInnovation, #Microelectronics, #TechHistory, #CorporateAdaptation, #ShareholderValue, #CorporateStrategy, #MiltonFriedman, #EconomicPolicy, #FinancialMarkets, #CorporateFinance, #StockBuybackDebate, #EconomicAnalysis, #sciencepodcast, #longformpodcast
Send us a textThis episode was recorded live at SEMICON Europa. It features interviews with four of the 20 under 30 Recognition Award recipients from Cadence, ERS Electronic, KLA, and Semilab. It also features updates from Comet Yxlon, Trymax Semiconductor, and DSV-IMS. SEMI Europe's 20 Under 30 program recognizes future leaders in the microelectronics industry. James McGrath from KLA discussed his role as a PE CBD Process Engineer and his unexpected entry into the semiconductor industry. Augustin Detruit from ERS Electronics highlighted his growth from a master's thesis to Head of Production, overseeing a significant increase in production capacity. Luca Sinkó from Semilab shared her journey from physics to R&D Team Leader and her recent promotion to Product Manager. Charis Kalantzi from Cadence detailed her role in supporting digital design tools and her involvement in community volunteering. All four talk about what brought them into the semiconductor industry, what made them stand out to the judges, and the honor of receiving such an award. From Dionys van de Ven, we hear about the announced the launch of Comet Yxlon's new 3D X-ray system for fab-level yield improvement, Peter Dijkstra from Trymax, discussed what is driving the company's growth and it's expansion into the U.S. market.Spencer Wall talks about DSV's acquisition of Schenker, and shares the progress so far. Michael Murray talks about DSV-IMS foray into using AI and machine learning to improve supply chain efficiencies. Support the showBecome a sustaining member! Like what you hear? Follow us on LinkedIn and TwitterInterested in reaching a qualified audience of microelectronics industry decision-makers? Invest in host-read advertisements, and promote your company in upcoming episodes. Contact Françoise von Trapp to learn more. Interested in becoming a sponsor of the 3D InCites Podcast? Check out our 2024 Media Kit. Learn more about the 3D InCites Community and how you can become more involved.
Send us a textIt's been quite an exciting year for the U.S. Chips for America as the funding starts rolling out. All year long, Françoise von Trapp has interviewed various government dignitaries about various elements of the CHIPS Act. This episode brings these episodes together in order of appearance, to give you a timeline of the year's progress. First up is Dan Berger, National Advanced Packaging Manufacturing Program (NAPMP), who explains how CHIPS Acts monies are being used to address gaps like advanced packaging and substrate manufacturing, to help revitalize the US semiconductor industry. The focus is on developing domestic manufacturing teams for U.S. leadership in microelectronics, with global collaboration and security in mind. He discusses the importance of advanced packaging roadmaps aimed at scaling down feature sizes, eliminating interposers and integrating chiplets directly onto substrates. Next, we hear from the Honoroable Laurie Locascio, Director of NIST, and Undersecretary of Commerce for Standards and Technology. She explains importance of public-private collaboration, addressing research gaps, strategic investments, and global collaboration to ensure the industry's success and address economic and national security concerns.Lastly, Dev Palmer explains Chips Act's funding distribution and its impact on the semiconductor ecosystem. He emphasizes the importance of bridging research and industry and describes some of the programs key initiatives. Palmer highlights the need for collaboration across large and small businesses, academia, and nonprofits to achieve the Chips Act's ambitious goals, and shares the details of the recently announced Small Business Innovation Research (SBIR) program under the Biden Harris administration. Contact the Panelists on LinkedInDan Berger, Associate Director, NAPMPDr. Laurie Locascio, NISTDev Palmer, NAPMPSupport the showBecome a sustaining member! Like what you hear? Follow us on LinkedIn and TwitterInterested in reaching a qualified audience of microelectronics industry decision-makers? Invest in host-read advertisements, and promote your company in upcoming episodes. Contact Françoise von Trapp to learn more. Interested in becoming a sponsor of the 3D InCites Podcast? Check out our 2024 Media Kit. Learn more about the 3D InCites Community and how you can become more involved.
Send us a textAt IMAPS Symposium 2024, the annual IMAPS Society Awards were presented. These awards recognize IMAPS members who stand out for their efforts. They are peer-nominated awards and selected by a panel of previous winners, so it's very special to receive one, as it means many members have noticed their efforts. In this episode, Françoise sits down with three of the award winners to talk about their IMAPS experience, at different stages of their careers.Emma P Pawliczak was awarded the Steve Adamson Student Award. She is currently getting her Ph.D. at Binghampton University. Brandon Hamilton won the Emerging Leader Award, is a program manager at BAE Systems in Cedar Rapids IowaDr. Phil Garrou won the Lifetime Achievement Award. He is an Advanced Packaging subject matter expert for DARPA and the DoD through his consulting company Microelectronic Consultants of NC (MCNC). You'll learn about the history of IMAPS and its origins from PhilYou'll learn how Emma benefits from student opportunities at IMAPSYou'll learn about how IMAPS helped Brandon make connections in the industryAll three talk about mentorship opportunities and how IMAPS provides a supportive community throughout a microelectronics career. Contact the Speakers on LinkedIn:Dr. Phil Garrou, MCNCEmma Pawliczak, Binghamton University Brandon Hamilton, BAE SystemsIMAPS InternationalIMAPS is the largest society dedicated to microelectronics and electronics packaging advancement.Disclaimer: This post contains affiliate links. If you make a purchase, I may receive a commission at no extra cost to you.Support the showBecome a sustaining member! Like what you hear? Follow us on LinkedIn and TwitterInterested in reaching a qualified audience of microelectronics industry decision-makers? Invest in host-read advertisements, and promote your company in upcoming episodes. Contact Françoise von Trapp to learn more. Interested in becoming a sponsor of the 3D InCites Podcast? Check out our 2024 Media Kit. Learn more about the 3D InCites Community and how you can become more involved.
Send us a textIn this episode, Francoise von Trapp speaks with Isabella Drolz from Comet about how AI is revolutionizing semiconductor inspection strategies, particularly in 3D X-ray systems. They discuss how AI is being used to find structural defects in advanced chip packages, and also how 3D inspection is being used to develop advanced AI technologies themselves. von Trapp and Drolz explore the evolution of inspection methods in advanced packaging, noting the complexity of 3D ICs and the limitations of traditional optical inspections. Drolz emphasizes the importance of AI in accelerating yield curves and improving inspection efficiency. She also mentions the need for an enterprise solution to integrate various inspection tools.You'll learn:About the difference between 2D and 3D X-ray technologiesHow 3D X-ray evolved over the past decade so that it can be used effectively in volume production How Comet Yxlon's CA 20 tool, integrated with the AI software Dragonfly, enhances defect detection by using deep learning to analyze X-ray imagesContact Isabella Drolz on LinkedInComet Xylon Comet Yxlon delivers high-end X-ray and CT system solutions for advanced packaging inspecton needs. Disclaimer: This post contains affiliate links. If you make a purchase, I may receive a commission at no extra cost to you.Support the showBecome a sustaining member! Like what you hear? Follow us on LinkedIn and TwitterInterested in reaching a qualified audience of microelectronics industry decision-makers? Invest in host-read advertisements, and promote your company in upcoming episodes. Contact Françoise von Trapp to learn more. Interested in becoming a sponsor of the 3D InCites Podcast? Check out our 2024 Media Kit. Learn more about the 3D InCites Community and how you can become more involved.
The U.S. once had a missile gap. Now it has a semiconductor gap. An insufficient supply of domestically-made advanced integrated circuits. Congress passed the Chips and Science Act back in 2022. My next guest says DoD should do more to take advantage of it. She's an electrical engineer professor at the University of Arizona and part of a recent National Academies study, Liesl Folks. Learn more about your ad choices. Visit podcastchoices.com/adchoices
The U.S. once had a missile gap. Now it has a semiconductor gap. An insufficient supply of domestically-made advanced integrated circuits. Congress passed the Chips and Science Act back in 2022. My next guest says DoD should do more to take advantage of it. She's an electrical engineer professor at the University of Arizona and part of a recent National Academies study, Liesl Folks. Learn more about your ad choices. Visit podcastchoices.com/adchoicesSee Privacy Policy at https://art19.com/privacy and California Privacy Notice at https://art19.com/privacy#do-not-sell-my-info.
Send us a textIn this episode, Francoise speaks with Simon McElrea, an interconnectologist, about his career in and the evolution of interconnectology, emphasizing its importance in semiconductor packaging.McElrea discusses his roles at semiconductor start-ups like Vertical Circuits and Invensas; his foray into wireless charging at Energous and FreePower; and his return to the semiconductor industry due to its current inflection point. He talks about how the Chips Act favors large companies over startups and stressed the need for government support to attract young talent and foster innovation. Lastly, McElrea explained how to better support startups and disruptive technologies in the semiconductor industry through policies and funding. Listen and learn: · How adopting the term "interconnectology" will change the narrative around advanced packaging· Why we need to inspire young talent to pursue careers in interconnect-focused fields like packaging through initiatives at universities· The role of consortia and joint ventures can play Contact Simon McElrea on LinkedInLQDXLQDX is setting a new metal deposition standard with its breakthrough family of Liquid Metal Inks®.Disclaimer: This post contains affiliate links. If you make a purchase, I may receive a commission at no extra cost to you.Support the showBecome a sustaining member! Like what you hear? Follow us on LinkedIn and TwitterInterested in reaching a qualified audience of microelectronics industry decision-makers? Invest in host-read advertisements, and promote your company in upcoming episodes. Contact Françoise von Trapp to learn more. Interested in becoming a sponsor of the 3D InCites Podcast? Check out our 2024 Media Kit. Learn more about the 3D InCites Community and how you can become more involved.
Send us a Text Message.In this episode, Françoise von Trapp and underfill materials expert, Dick Jensen, NAMICS corporation explore the societal and technological challenges that impact microelectronic materials development. The conversation focuses on the evolution of underfill materials development over the past 30 years. They discuss the importance of underfill materials in semiconductor manufacturing, focusing on their compatibility, environmental impact, and properties. You'll learn about:The development of specialized underfill materials for advanced packaging technologies, including AI chips, and the challenges arising from material changes in electronics manufacturingHistorical examples of working with restricted substances and how that created a need for alternative materials The current need for collaboration and innovation to address the issue of PFAS chemicals in productsWhy and how much testing is important to ensure material compatibility and performanceNAMICS NAMICS Corporation provides advanced materials and solutions for the semiconductor industry.Disclaimer: This post contains affiliate links. If you make a purchase, I may receive a commission at no extra cost to you.Support the Show.Become a sustaining member! Like what you hear? Follow us on LinkedIn and TwitterInterested in reaching a qualified audience of microelectronics industry decision-makers? Invest in host-read advertisements, and promote your company in upcoming episodes. Contact Françoise von Trapp to learn more. Interested in becoming a sponsor of the 3D InCites Podcast? Check out our 2024 Media Kit. Learn more about the 3D InCites Community and how you can become more involved.
(0:50) - To Heal Skin, Scientists Invent Living Bioelectronics Become a founding reader of our newsletter: http://read.thenextbyte.com/ As always, you can find these and other interesting & impactful engineering articles on Wevolver.com.
Send us a Text Message.Françoise von Trapp talks with ECTC 2024 General Chair, Karlheinz Bock and Program Chair, Michael Mayer about highlights and key takeaways from the 2024 IEEE Electronic Component Technology Conference. (ECTC 2024). Bock and Mayer discussed the growth of ECTC 2024, and how focusing on strategic decisions such as changing the format and increasing the exhibition space helped organizers achieve record attendance. They also describe the volunteering opportunities and the pathway to leadership it provides. They shared their own experiences and the impact ECTC has had on their careers. From the event itself, you'll learn about the importance of packaging technology and collaboration between chip and packaging communities to meet the high bandwidth requirements of AI applications. You'll also learn about advancements in hybrid bonding, metrology, and the impact of geopolitics in electronics packaging.How to Start a Podcast Guide: The Complete GuideLearn how to plan, record, and launch your podcast with this illustrated guide.Support the Show.Become a sustaining member! Like what you hear? Follow us on LinkedIn and TwitterInterested in reaching a qualified audience of microelectronics industry decision-makers? Invest in host-read advertisements, and promote your company in upcoming episodes. Contact Françoise von Trapp to learn more. Interested in becoming a sponsor of the 3D InCites Podcast? Check out our 2024 Media Kit. Learn more about the 3D InCites Community and how you can become more involved.
Send us a Text Message.Recorded live at the 2024 Electronic Component Technology Conference, this episode features conversations Francoise von Trapp has with Keynote Speaker Keren Bergman, Columbia University and co-founder of Xscape Photonics, and Chet Lennox, of KLA. Bergman explains the potential of photonics in AI applications to improve energy efficiency and bandwidth. You'll learn about the limitations of current photonics technology in data centers and proposes a new generation of integrated photonics and silicon to overcome these limitations. You'll also learn about the development of unique laser technologies for energy efficiency and the latest advancements in optical communication technologies, including full-wafer fabrication and wafer-scale probe technology.Learn more about Xscape Photonics.Chet Lenox talks about the growing importance of metrology and inspection in advanced packaging processes. He shares highlights of an ECTC special session, such as the importance of including process control in the Heterogeneous Integration Roadmap, and a technology track on metrology and inspection in future ECTC programs. You'll learn why In-line metrology is crucial for controlling processes, ensuring defect-free surfaces, and reducing variability. Quality and yield are key concerns, and more inspection and metrology are needed in the early stages of R&D to ensure success. Contact Our Speakers on Linkedin: · Keren Bergman, Ph.D, Professor at Columbia University· Chet Lenox, Fellow, KLAHow to Start a Podcast Guide: The Complete GuideLearn how to plan, record, and launch your podcast with this illustrated guide.Support the Show.Become a sustaining member! Like what you hear? Follow us on LinkedIn and TwitterInterested in reaching a qualified audience of microelectronics industry decision-makers? Invest in host-read advertisements, and promote your company in upcoming episodes. Contact Françoise von Trapp to learn more. Interested in becoming a sponsor of the 3D InCites Podcast? Check out our 2024 Media Kit. Learn more about the 3D InCites Community and how you can become more involved.
Join Dr. Tony Lewis, BrainChip's Chief Technology Officer, for this expansive conversation about SpaceTech with Laurent Hili, Microelectronics and Data Handling Engineer of the European Space Agency and Luis Mansilla, AI expert in the software technology section at the European Space Research and Technology Center. In this episode, the trio talks about why space technology matters, how far it has come and how neuromorphic AI plays a major and pivotal role in the future of SpaceTech. Learn how the European Space Agency is investing in and driving forward the growth and just where BrainChip's Akida fits in.
This episode was recorded live at the IMAPS Device Packaging Conference – helping celebrate the event's 20th year. The record turnout included many of our 3D InCites Community members. Françoise von Trapp spoke with several of them who were exhibiting and presenting, and in some cases, simply attending. Alex Ospina of ACM Research discussed the latest technologies in wafer-level packaging, and the company's focus on developing novel IP technologies to address industry challenges. You'll hear about the company's new vacuum cleaning tool designed to remove flux from bonds in smaller chiplets. You'll also learn about the company's approach to reducing its environmental impact. Tim Olson, of Deca, shares big news about the company's collaboration with ASU to create an open lab for innovation for innovation, licensing its M-Series and Adaptive Patterning technology, and working with ASU to outfit a fab with unique equipment.Laura Mirkarimi and Oliver Zhao, of Adeia, explain the important role optical interferometry plays in atomic-level hybrid bonding. Zhao explains how they are using AI-powered neural networks to identify defects in the hybrid bonding process, with a focus on categorizing defects based on their relevance to certain process steps.Manuela Junghähnel, of Fraunhofer IZM-ASSID, explains her new role taking over the leadership of IZM-ASSID, from Jürgen Wolf. She talks about learning the pilot scale to the production line created by Wolf. She also explains the relationship from the parent IZM and IZM ASSID.Brian Riley, of QP Technologies, shares a history of advanced packaging technologies, and the company. He describes QPs' proprietary process for flip chip packages, the use of open mold plastic packages, and overmold QFNs.Justin Locke, of Siemens EDA discusses innovations in functional verification of 3D Heterogeneous integration connectivity. He explains about the importance of formal verification in the design process, highlighting its ability to catch errors early on and prevent physical implementation issues. Peter Cronin, of MRSI Mycronic talks about new technologies and interconnects in optical packaging, highlighting the need for active alignment tools. He introduces the Active AClimate ConfidentWith a new episode every Wed morning, the Climate Confident podcast is weekly podcast...Listen on: Apple Podcasts SpotifySupport the showBecome a sustaining member! Like what you hear? Follow us on LinkedIn and TwitterInterested in reaching a qualified audience of microelectronics industry decision-makers? Invest in host-read advertisements, and promote your company in upcoming episodes. Contact Françoise von Trapp to learn more. Interested in becoming a sponsor of the 3D InCites Podcast? Check out our 2023 Media Kit. Learn more about the 3D InCites Community and how you can become more involved.
This episode was recorded live at IMAPS DPC, where the Spring version of the Global Business Council focused on Geopolitics Fueling the Repatriation of the Semiconductor Ecosystem. To get the complete picture of the collaboration happening, Françoise von Trapp speaks with representatives of the government, industry, and academia. Dan Berger, National Advanced Packaging Manufacturing Program (NAPMP), explains how CHIPS Acts monies are being used to address gaps like advanced packaging and substrate manufacturing, to help revitalize the US semiconductor industry. The focus is on developing domestic manufacturing teams for U.S. leadership in microelectronics, with global collaboration and security in mind. He discusses the importance of advanced packaging roadmaps aimed at scaling down feature sizes, eliminating interposers and integrating chiplets directly onto substrates. Zachary Holman, of Arizona State University, discusses how ASU's Fulton School of Engineering is working to advance the college's research impact in areas such as health, climate, and national security through partnerships with government and industry investments. He highlights ASU's focus on extending the advanced packaging capabilities of its MacrotTechnology Works (MTW) fab, which allows for larger-scale packaging tools and pilot-to-fab gap closure. Holman emphasized the importance of providing hands-on experience with state-of-the-art tools and materials for students. This will help provide a skilled workforce that can operate and maintain the latest equipment. Holman also discussed how ASU is building a platform to democratize innovation by providing access to R&D capabilities for startups and small businesses. Mark Litecky, of Skywater, highlights the need for secure supply chain management and proprietary technology management in the U.S. semiconductor industry. He also stressed the importance of having global capabilities and secure supply chain management in the US, while avoiding duplication in different regions. Litecky also highlighted workforce development, emphasizing the need for more people to understand the value of the field and the various career paths available. Contact the Panelists on LinkedInDan Berger, Associate Director, NAPMPZachary Holman, Vice Dean, Arizona State University Mark Litecky, Chief Revenue Officer, SkywaterSupport the showBecome a sustaining member! Like what you hear? Follow us on LinkedIn and TwitterInterested in reaching a qualified audience of microelectronics industry decision-makers? Invest in host-read advertisements, and promote your company in upcoming episodes. Contact Françoise von Trapp to learn more. Interested in becoming a sponsor of the 3D InCites Podcast? Check out our 2023 Media Kit. Learn more about the 3D InCites Community and how you can become more involved.
Dive into the heart of the AI race between the US and China with Craig Smith in episode #179 of Eye on AI. This discussion features Ylli Bajraktari, the President and CEO of the Special Competitive Studies Project, as he unveils the strategic maneuvers and policies shaping the future of artificial intelligence on a global scale. In this episode, Ylli provides an in-depth analysis of the current state of AI development and competition, illuminating the actions taken by both superpowers to secure their position at the forefront of technological advancement. From the pivotal CHIPS Act to the formation of national AI champions, learn how these initiatives are influencing the global AI landscape. Uncover the essence of the Special Competitive Studies Project and its mission to ensure the US retains its edge in AI through a comprehensive, nation-wide approach. Ylli discusses the critical importance of AI in national security, the transformative potential of the OffsetX strategy, and the implications of the National Plan for Microelectronics. Whether you're fascinated by the strategic dynamics of international technology competition or passionate about the impact of AI on society and security, this episode offers invaluable insights into the challenges and opportunities ahead. Don't forget to rate us on Apple Podcast and Spotify if you're inspired by the strategic discourse on AI's role in shaping the future. This episode is sponsored by Shopify. Shopify is a commerce platform that allows anyone to set up an online store and sell their products. Whether you're selling online, on social media, or in person, Shopify has you covered on every base. With Shopify you can sell physical and digital products. You can sell services, memberships, ticketed events, rentals and even classes and lessons. Sign up for a $1 per month trial period at http://shopify.com/eyeonai Stay Updated: Craig Smith Twitter: https://twitter.com/craigss Eye on A.I. Twitter: https://twitter.com/EyeOn_AI (00:00) Preview (00:46) Introducing Ylli Bajraktari (04:21) Origins of the Special Competitive Studies Project (09:14) Influence of National Security Commission on AI (14:05) What is the OffsetX Strategy (15:42) US vs. China: The AI Competition Landscape (19:00) Post-Gen AI Period and Its Impact (21:03) The Future of AI Research (24:41) Reorganizing Government Institutions for the AI Era (32:48) Understanding Lethal Autonomous Weapon Systems (35:05) The Concept of Counter-Autonomy (39:04) Addressing the Threat from China's Semiconductor Strategy (44:54) Preview of the Special Competitive Studies Project's AI Expo
This episode was recorded live at the IMAPS Device Packaging Conference in Fountain Hill AZ, where several of the keynote talks focused on chiplet architectures and heterogeneous integration for semiconductor device manufacturing, assembly, test, and packaging. Françoise von Trapp talks with Arvind Kumar, of 3D InCites member company, IBM and Hemanth Dhavaleswarapu of AMD, about chiplet application drivers, such as artificial intelligence. She then talks to Pooya Tadeyon, of Intel, to find out why we are moving to advanced packaging, and particularly chiplet architectures, to enable the future of Moore's law. You'll learn about: Chiplets architectures for high-performance applications How chiplets can enable foundational AI models that can be applied to various business use cases Challenges in chiplet design and test The importance of open interface standards Contact our guests on LinkedIn: Arvind Kumar, IBM Hemanth Dhavaleswarapu, AMD Pooya Tadeyon, Intel Next week, our coverage of IMAPS continues, as we bring you conversations from the Global Business Council, which focused on repatriating the US microelectronics industry. You'll get perspectives from academia, the government, and industry. IMAPS International IMAPS is the largest society dedicated to microelectronics and electronics packaging advancement.Disclaimer: This post contains affiliate links. If you make a purchase, I may receive a commission at no extra cost to you.Support the showBecome a sustaining member! Like what you hear? Follow us on LinkedIn and TwitterInterested in reaching a qualified audience of microelectronics industry decision-makers? Invest in host-read advertisements, and promote your company in upcoming episodes. Contact Françoise von Trapp to learn more. Interested in becoming a sponsor of the 3D InCites Podcast? Check out our 2023 Media Kit. Learn more about the 3D InCites Community and how you can become more involved.
The International Microelectronics and Packaging Society's Device Packaging Conference (IMAPS DPC) celebrates its 20th year this year. The conference takes place March 19-21, in Fountain Hills, AZ. In this episode, Françoise von Trapp speaks with Scott Hayes, General Chair, IMAPS DPC, and Amy Lujan, General Chair-Elect of IMAPS DPC about the history of this event, and what sets it apart from IMAPS annual Symposium. This year's event will focus on heterogeneous integration and growth drivers for packaging, with speakers from companies like AMD, Intel, Facebook Reality Labs, and more. The General Business Council session will focus on Chips for America funding, doing business in China, and the significant growth of the U.S. semiconductor supply chain, particularly in Phoenix, AZ. You'll learn about the key applications driving technology advancements in autonomous vehicles, radar, and high-performance computing. During the panel discussion, you'll learn about the next killer app and its potential impact of the semiconductor industry. Hayes and Lujan also discuss all the networking opportunities and fund raising activities that you can take part in. Contact our Guests on LinkedInScott Hayes, Technical Director, NXP Semiconductors Amy Lujan, Vice President, SavanSysRegistration for IMAPS DPC can be found here. You can also register for the Golf Tournament and Hike for DEI at the same time. If you'd like to participate in the 3D InCites Member and Guest Event – the Backyard Olympics, sign up here. There is no charge to participate, and space is limited. International Women's Day is March 8th, and to celebrate, we're partnering with SEMI to bring you an episode on how companies are fostering and implementing DEIB and allyship in their corporate culture. We're looking for a few mentor/mentee pairs who are interested in sharing there story, as part of the episode. If you'd like to participate, drop me a line at francoise@3DinCites.com. Interviews must take place by February 23 to be included. Create Your New Podcast StrategyGet the free PodCentral Strategy KitListen on: Apple Podcasts SpotifyIMAPS Device Packaging Conference Interconnects for Tomorrow's Applications Disclaimer: This post contains affiliate links. If you make a purchase, I may receive a commission at no extra cost to you.Support the showBecome a sustaining member! Like what you hear? Follow us on LinkedIn and TwitterInterested in reaching a qualified audience of microelectronics industry decision-makers? Invest in host-read advertisements, and promote your company in upcoming episodes. Contact Françoise von Trapp to learn more. Interested in becoming a sponsor of the 3D InCites Podcast? Check out our 2023 Media Kit. Learn more about the 3D InCites Community and how you can become more involved.
Brace yourself for an exhilarating deep-dive into the labyrinth of semiconductor technology and yield management in this fascinating episode with John O'Donnell and Carl Moore from yieldHUB. John has a degree in Microelectronics from UCC (University College Cork) and spent more than 17 years at a leading semiconductor company before starting yieldHUB (formerly MFG Vision). Fast forward to today and he's running a company with a platform that's used by over a thousand of product users around the world. yieldHUB exists to help semiconductor customers maximize their yield. John loves what he does and enjoys traveling the world to meet new prospects and customers. Carl is a semiconductor and yield management expert with a career spanning 40+ years. During his dynamic career, Carl's held technical management positions across product and test engineering, assembly, manufacturing, and design at established semiconductor companies. Carl is passionate about data analytics and has a reputation for building strong customer relationships.In this episode we'll pry open the Pandora's box of big data and data analytics in the semiconductor industry, unravelling yieldHUB's distinctive strategies in propelling yield improvements. We'll underscore the crucial role of real-time data analysis and collaboration, and how these components are reshaping the landscape of yield management.Data is the lifeblood of the semiconductor industry, yet managing new data sources and formats is a colossal task. With our guests, we'll explore how yieldHUB's platform streamlines data integration, and how artificial intelligence (AI) and machine learning are shaking up production testing. We'll also discuss the merger of human expertise and AI to achieve optimal results and the global scalability of data analytics through cloud-based solutions. You'll be awestruck by the sheer potential and power of these technologies. John and Carl will share their insights about the unique features of yieldHUB, including its ability to facilitate specific product threads and its innovative audio feature. We'll end the conversation by looking at the future of yield and data analytics, offering valuable advice for the industry's next steps. Plus, we'll explore the integration of data from various sources through API, discussing the impact on sustainability and innovation in the industry. Get ready to be inundated with a wealth of insights into the realm of semiconductor yield management. Thanks for tuning in to "Advantest Talks Semi"! If you enjoyed this episode, we'd love to hear from you! Please take a moment to leave a rating on Apple Podcast. Your feedback helps us improve and reach new listeners. Don't forget to subscribe and share with your friends. We appreciate your support!
Pat Hindle talks with Matt Tyhach, Mission Area Director for Next Gen Sensors and Microelectronics in Advanced Technology at Raytheon, about recently awarded a four-year, $15 million contract from DARPA to increase the electronic capability of RF sensors with high-power-density GaN transistors with 16X output power compared to traditional devices. This will enable future "smart" systems that can meet the needs for radar, EW and communications with one system.
In this episode, Françoise von Trapp talks with AT&S's Markus Leitgeb and Tony Gueli, about the complex world of IC substrates for advanced microelectronics. The conversation focuses on technical and commercial challenges, and how they can be overcome when you work with the right substrate partners.You'll learn about the driving applications for advanced IC substrates, including data storage, data speed, and the automotive industry. You'll hear about the challenges of keeping up with advanced node technology and the need for reliable interconnects in the assembly industry.Other topics include the oversupply situation in the substrate industry, the importance of maintaining R&D activities, the lack of substrate manufacturing in the US, and the impact of geopolitics on the supply chain. Connect with our speakers on LinkedIn: Markus Leitgeb, R&D ManagerTony Gueli, Key Account Director Support the showBecome a sustaining member! Like what you hear? Follow us on LinkedIn and TwitterInterested in reaching a qualified audience of microelectronics industry decision-makers? Invest in host-read advertisements, and promote your company in upcoming episodes. Contact Françoise von Trapp to learn more. Interested in becoming a sponsor of the 3D InCites Podcast? Check out our 2023 Media Kit. Learn more about the 3D InCites Community and how you can become more involved.
Join us on this episode of the Altium OnTrack Podcast as we sit down with David Schild, Executive Director of the Printed Circuit Board Association of America (PCBAA). In this insightful conversation, David shares the mission of PCBAA, its role in advocating for domestic printed circuit board manufacturers, and the unique challenges and opportunities in the industry. Discover the fascinating world of printed circuit boards and substrates as David talks about the diverse members of PCBAA, ranging from woven glass producers to drilling equipment manufacturers. Get a glimpse into the innovative world of PCBAA through David's discussion of the association's impactful business cards and the importance of physical materials in conveying industry priorities. Explore the conversation about the state of the industry, workforce challenges, and the need for sustainable growth. David sheds light on the role of automation in manufacturing facilities and the vital connection between education, advocacy, and legislation in shaping the future of the electronics industry. Whether you're a seasoned professional or just curious about the world of printed circuit boards, this podcast provides valuable insights into the heartbeat of modern electronics. Tune in to learn more about the industry's past, present, and the exciting possibilities that lie ahead. Don't miss out on this engaging discussion that brings the world of electronics to life. Watch the video on YouTube to see the impressive business cards and gain a visual understanding of the technology driving innovation in the electronics manufacturing sector. If you're passionate about technology, manufacturing, or simply intrigued by the inner workings of the devices we use every day, this podcast is a must-watch! Watch this episode here Show Highlights: Intro What David Does for PCBAA David's Background What Should the US Market Share in Microelectronics Manufacturing Be? Government Subsidies & a Race to the Bottom What Role Does Automation Play in Price Competition? Encouraging Young People to Get Into the Industry Electronics & Popular Awareness Is the Messaging Getting Through? How to Educate the Masses about Microelectronics PCB-7? It's Going to Take Time Impressions about PCB West Increased Visibility at Trade Shows Learn More about PCEA & PCBAA
Join Jacob Winn, NDIA ETI Associate Research Fellow, and Dr. Michael Fritze, an independent consultant, to discuss their new paper, "Modernizing Defense Microelectronics: Challenges and Opportunities." The pair discuss the findings of their research and lay out recommendations on how DoD can integrate more advanced microelectronics into their systems. To read the report, click here: www.emergingtechnologiesinstitute.org/publications/research-papers/modernizing-defense-microelectronics ______________________________________________________________________ This episode is sponsored by Raytheon. https://www.rtx.com/raytheon ______________________________________________________________________
Join Jacob Winn, NDIA ETI Associate Research Fellow, and Dr. Michael Fritze, an independent consultant, to discuss their new paper, "Modernizing Defense Microelectronics: Challenges and Opportunities." The pair discuss the findings of their research and lay out recommendations on how DoD can integrate more advanced microelectronics into their systems. To read the report, click here: www.emergingtechnologiesinstitute.org/publications/research-papers/modernizing-defense-microelectronics __________________________________________________________ This episode is sponsored by Raytheon. https://www.rtx.com/raytheon __________________________________________________________
This Member Spotlight episode was recorded live at the IMAPS International Symposium. Françoise von Trapp speaks with community members who attended and exhibited about what they were showcasing, and what they learned. They shared their opinions on everything from the possibility of the U.S. onshoring advanced packaging technology in high volumes, to the impact of germanium and gallium restrictions on the compound semiconductor development, to the recent announcement by Intel on the introduction of glass core substrates for next-generation advanced packaging, and much more. John Lannon and Rex Anderson, Micross Components, helped demystify the multiple government funding efforts to onshore advanced packaging, and how Micross is being impacted by these efforts. Casey Krawiec of StratEdge Corporation talks about the company's role in delivering packaging technology for high-frequency applications, the growth in high-reliability sectors, and why 2023 will go down as a good year for StratEdge. Brian Schmaltz, Namics Corporation, talks about the company's efforts to eliminate harmful PFAS chemicals from their portfolio of products and explains the reporting process now required by the Environmental Protection Agency (EPA).Vahid Akhavan, PulseForge explains how the company's core competency — high-powered photonic-based pulsed light technology — is being used for temporary bond/debond processes for everything from fan-out, interposer, and chiplet integration, to LEDs and high-power applications. Ajinomoto Fine Techno's Habib Hichri talked about developments beyond its core ABF (Ajinomoto Buil-up Film) to meet the needs of next-generation thin and large packages. QP Technologies' CEO Dick Otte, explains why QP has decided to NOT pursue CHIPS for America Act funding. Paul Ballentine, the co-founder of Mosaic Microsystems, talked about his involvement with the U.S. Government iSecurity UnfilteredCyber Security can be a difficult field to not only understand but to also navigate....Listen on: Apple Podcasts Spotify The Gaming BlenderHave you ever wanted to design your own video game?Listen on: Apple Podcasts SpotifySupport the showBecome a sustaining member! Like what you hear? Follow us on LinkedIn and TwitterInterested in reaching a qualified audience of microelectronics industry decision-makers? Invest in host-read advertisements, and promote your company in upcoming episodes. Contact Françoise von Trapp to learn more. Interested in becoming a sponsor of the 3D InCites Podcast? Check out our 2023 Media Kit. Learn more about the 3D InCites Community and how you can become more involved.
In this panel discussion, recorded live at the International Microelectronics and Packaging Society International Symposium, Françoise hands over the mike to Dan Krueger, Honeywell, as he moderates a panel on Diversity in Packaging, Past, Present, and Future. Don't miss this lively town hall discussion on many important topics in today's challenging work environment, including the important differences between equity and equality in the workplace. You'll hear representatives of different generations of IMAPS leadership discuss their experiences as women making careers in the microelectronics industry, the diverse perspectives that each generation experienced, the progress they see in the industry, and suggestions for work left to be done and how to achieve it. They also provide tips on how to improve DEI at companies going forward, the importance of mentorship, and how to be better allies to your peers. Moderated by Daniel Krueger, Panelists include: · Beth Keser, Zero ASIC · Erica Folk, Northrop Grumman· Robin Davis, Deca· Amy Lujan, Savansys· Susan Trulli, Retired from Raytheon Next week, we wrap up our coverage of the IMAPS Symposium with our Member Spotlight episode, interviewing 3D InCites Community Members about what they showcased and what they learned at the event. The Gaming BlenderHave you ever wanted to design your own video game?Listen on: Apple Podcasts SpotifySupport the showBecome a sustaining member! Like what you hear? Follow us on LinkedIn and TwitterInterested in reaching a qualified audience of microelectronics industry decision-makers? Invest in host-read advertisements, and promote your company in upcoming episodes. Contact Françoise von Trapp to learn more. Interested in becoming a sponsor of the 3D InCites Podcast? Check out our 2023 Media Kit. Learn more about the 3D InCites Community and how you can become more involved.
In a time when unprecedented industry growth is expected, the microelectronics industry is in the midst of a workforce shortage. To address this, the International Microelectronics and Packaging Society – IMAPS – is increasing its efforts to raise awareness about this rewarding industry through partnerships with universities and high schools. Simultaneously, companies that serve the microelectronics industry are ramping up internship programs and coming up with new approaches to recruitment to help attract and retain young talent. In this episode, recorded live at the IMAPS International Symposium on October 4, 2023, Françoise sits down with three high school students from the Carlsbad Highschool Robotics Clubs, Demetrios Dresios, Vaselios Dresios, and Kendra Ammon, who attended the event to learn more about the industry. They talk about what got them interested in robotics, how it has shaped their ideas about careers, and what they want to study. They also talk about what they learned at the symposium. Next, Françoise interviews Roberta Foster-Smith and Gabriela Philips, of Nordson Electronics Solutions, about Gabriela's experience in Nordson's Commercial Leadership Development program. Next week, on the 3D InCites podcast, Françoise hands over the mike to Dan Krueger, Honeywell, as he moderates a panel on Diversity in Packaging, Past, Present and Future. Don't miss this lively town hall discussion on many important topics in today's challenging work environment, including the important differences between equity and equality in the workplace. Support the showBecome a sustaining member! Like what you hear? Follow us on LinkedIn and TwitterInterested in reaching a qualified audience of microelectronics industry decision-makers? Invest in host-read advertisements, and promote your company in upcoming episodes. Contact Françoise von Trapp to learn more. Interested in becoming a sponsor of the 3D InCites Podcast? Check out our 2023 Media Kit. Learn more about the 3D InCites Community and how you can become more involved.
This episode was recorded live at the 2023 IMAPS International Symposium, where the week's keynote talks focused on different aspects of heterogeneous integration, packaging technology for high-performance computing, and what's driving these technologies. Françoise von Trapp speaks with three of the keynote speakers who addressed attendees including Kevin Anderson, of Qorvo; Jeffrey Burns, of IBM Research; and C.P. Hung of ASE Group. From Kevin Anderson, you'll hear about Qorvo's involvement in DARPA's SHIP Program, and its Advanced State-of-the-Art RF Semiconductor Packaging Center that won them the 2023 3D InCites Award for Device Manufacturer of the Year. You'll get Qorvo's back story in being a supplier of wireless products and its focus on compound semiconductors. You'll also learn about the difference between the SHIP Program and the CHIPS for America Act, and the role Qorvo plays. From Jeff Burns, you'll get detailed education on AI, and Deep Learning. Using the development of image recognition as an example of how AI can surpass human capabilities, he explains the advantages of AI accelerators, and how IBM's work in foundation models is democratizing AI applications. He also explains the role 3D heterogeneous integration and chiplet architectures in making this happen. From CP Hung, you'll get a history lesson on the different types of advanced packages that are available to solve different challenges presented by today's applications. Specifically, you'll learn about the needs of Electric Vehicles, and how heterogeneous integration is addressing these needs. You'll also learn about ASE's launch of its Integrated Design Ecosystem (IDE) a collaborative design toolset optimized to systematically boost advanced package architecture across the VIPack™ platform. Contact Our Guests on Linkedin Kevin Anderson, Director, Integration Technology Research at Qorvo, Inc.Jeffrey Burns, Director, IBM Research AI Hardware Center at IBM CP Hung, VP of Corporate R&D, ASE Global Next week, on the 3D InCites Podcast, Françoise interviews some special guests of IMAPS, members of Carlsbad Highschool's Robotics Club. Listen and learn what is inspiring the next generation of microelectronics experts. IMAPS International IMAPS is the largest society dedicated to microelectronics and electronics packaging advancement.Disclaimer: This post contains affiliate links. If you make a purchase, I may receive a commission at no extra cost to you.Support the showBecome a sustaining member! Like what you hear? Follow us on LinkedIn and TwitterInterested in reaching a qualified audience of microelectronics industry decision-makers? Invest in host-read advertisements, and promote your company in upcoming episodes. Contact Françoise von Trapp to learn more. Interested in becoming a sponsor of the 3D InCites Podcast? Check out our 2023 Media Kit. Learn more about the 3D InCites Community and how you can become more involved.
Supply chain disruptions stemming from the COVID-19 pandemic, among other issues, shined a bright light on the global reliance on microchips. The nationwide recognition underscored the need to strengthen the domestic microelectronics industry, including on-shore fabrication and next-generation research, development, and capabilities.Back in 2017, already recognizing that the microelectronics demand trajectory was straining both commercial and defense developments, DARPA launched the Electronics Resurgence Initiative (ERI) to address an increasing reliance on advanced electronics, exploding complexity of microsystems, offshore movement of advanced capabilities, and the emergence of hardware security threats. In 2022, the agency kicked off ERI 2.0, expanding the original effort to include reinvention of domestic microelectronics manufacturing.DARPA's 2023 ERI Summit, held Aug. 22-24, in Seattle, brought together more than 1,300 participants converged to discuss the challenges on the horizon. The conference spanned three jam-packed days of presentations, workshops, panel discussions, and networking.In this episode of Voices from DARPA, we've pulled from the more than 10 hours of presentations from leading voices across government, industry, and academia for a primer on the Summit's prevailing theme: what it means to redefine the future of microelectronics manufacturing.For a deeper dive on ERI 2.0 and the ERI Summit, visit:ERI Summit playlist – DARPAtv on YouTubeDARPA's Microsystems Technology OfficeElectronics Resurgence Initiative 2.0ERI Summit
You are now listening to the 100th Episode of the 3D InCites Podcast! To celebrate, Françoise sits down with Erica Folk and Tarak Railkar, both representatives of the International Microelectronics and Packaging Society – also known as IMAPS. 3D InCites is the official Industry Partner of IMAPS and the Official podcast of the IMAPS Symposium. In this episode, you'll get a look behind the scenes of this largely volunteer-led organization, and the opportunities the Society provides its members. Folk, incoming IMAPS president, talks about the work her predecessor, Beth Keser, set in motion, particularly around workforce development, that she intends to keep moving forward during her two-year term. As General Chair-Elect, Railkar leads the technical committee, and provides some insight on the latest drivers that inspire the topics addressed in the Keynote talks and technical program for this year's IMAPS International Symposium, which takes place October 2-5 in San Diego, CA. He explains how attendees contribute to the topic selection through survey participation, what led to this year's focus on Artificial Intelligence, and how it impacts the microelectronics industry. There's a Keynote talk dedicated AI, a professional development course, as well as a panel discussion. Conversation also focuses on the DEI Panel discussion, as well as student participation, the growing popularity of poster sessions, networking opportunities, and how to take advantage of all that is available. You'll also get some valuable tips on how to network effectively!To learn more about the IMAPS Symposium, and register, visit the website. Contact Our GuestsErica Folk, President-elect, IMAPS (Manager, MMIC and RFIC Design, Northrup Grumman)Tarak Railkar, General Chair-elect, IMAPS International Symposium (Engineering Manager, Qorvo)Next week, on the 3D InCites podcast, we'll be bringing you the 3D InCites 411 – Ask me Anything, with me, Françoise von Trapp. I'll be speaking about the changes coming for the 2024 3D InCites Awards, the 2024 Yearbook, and how your company can make the most of them. This will be a recording of a live event taking place on September 19. If you're interested in attending the live event on Zoom, Register Here.IMAPS International IMAPS is the largest society dedicated to microelectronics and electronics packaging advancement.Disclaimer: This post contains affiliate links. If you make a purchase, I may receive a commission at no extra cost to you.Support the showBecome a sustaining member! Like what you hear? Follow us on LinkedIn and TwitterInterested in reaching a qualified audience of microelectronics industry decision-makers? Invest in host-read advertisements, and promote your company in upcoming episodes. Contact Françoise von Trapp to learn more. Interested in becoming a sponsor of the 3D InCites Podcast? Check out our 2023 Media Kit. Learn more about the 3D InCites Community and how you can become more involved.
The semiconductor industry is in an interesting position – on one side, the demand is there for it to become a $1T industry sometime in the next 7-10 years. But headwinds – including a current downturn, has many companies putting the brakes on spending. In this episode, Françoise von Trapp talks with Joe Cestari and Martijn Pierik, of Kiterocket, about why companies should think twice about cutting their marketing budget and what they can do to move up in a downturn. You'll learn about the cyclic nature of the semiconductor industry and the general philosophy behind why companies cut their budgets when facing a lull in revenue. You'll also learn why that's not necessarily the best business decision, and how investing in the health of your brand is critical to position your company for growth. If you don't have a choice and your marketing budget is cut, Pierik and Cestari offer tips on how best to approach prioritizing your marketing and communications activities. Lastly, you'll learn about Kiterocket's PR-forward approach to marketing communications, and what sets the agency apart from others serving the semiconductor and microelectronics industries. To learn more, visit www.kiterocket.comFind Our Guests on LinkedIn Martijn Pierik, Founder and Chair, Kiterocket Joe Cestari, Executive Director, KiterocketComing up Next.... Join us next week for a preview of the International Microelectronics and Packaging Society International Symposium. I'll be speaking with Erica Folk, incoming IMAPS president, and members of the committee about what you can expect from this year's event that takes place October 2nd to 5th in San Diego, CA.Kiterocket A global strategic marketing agency serving the semiconductor and sustainability industries.Disclaimer: This post contains affiliate links. If you make a purchase, I may receive a commission at no extra cost to you.Support the showBecome a sustaining member! Like what you hear? Follow us on LinkedIn and TwitterInterested in reaching a qualified audience of microelectronics industry decision-makers? Invest in host-read advertisements, and promote your company in upcoming episodes. Contact Françoise von Trapp to learn more. Interested in becoming a sponsor of the 3D InCites Podcast? Check out our 2023 Media Kit. Learn more about the 3D InCites Community and how you can become more involved.
Gangland goes to war. Is there a "cyber world war" in progress? Ukraine thinks so. A new North Korean ransomware operation is described, but it's not yet clear if it's a state operation or some moonlighting by Pyongyang's operators. Media organizations remain attractive targets for state actors. NSA releases guidance on characterizing threats and risks to microelectronics. Betsy Carmelite from Booz Allen talks about why now is the time to plan for post-quantum cryptography. Our guest is Cybersecurity and Infrastructure Security Agency (CISA) Director Jen Easterly discussing her time at CISA and the work of her team. For links to all of today's stories check out our CyberWire daily news briefing: https://thecyberwire.com/newsletters/daily-briefing/11/135 Selected reading. Inside The Russian Cybergang Thought To Be Attacking Ukraine—The Trickbot Leaks (Forbes) Who is Trickbot? (Cyjax) Who is Trickbot? (Cyjax) NATO and the European Union work together to counter cyber threats (NATO) The Man at the Center of the New Cyber World War (POLITICO) Russian cyber threat to Canada worse than previously reported: CSE (National Post) North Korean threat actor targets small and midsize businesses with H0lyGh0st ransomware (Microsoft Security) Above the Fold and in Your Inbox: Tracing State-Aligned Activity Targeting Journalists, Media (Proofpoint) NSA Publishes Guidance on Characterizing Threats, Risks to DoD Microelectronics (National Security Agency/Central Security Service)
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