Podcasts about smta

On this episode, we'll dive into the world of electronics testing with an expert within the electronics testing industry, Robert Boguski,  President and Owner of Datest. Robert brings 44 years of experience in the design, fabrication, assembly, and testing of printed circuit boards (PCBs) and electronic systems. Under his leadership, Datest has become a premier provider of advanced, integrated PCBA testing and inspection services, serving both contract manufacturers and original equipment manufacturers since its founding in 1984. Robert's extensive background includes active participation in industry associations such as APICS, SMTA, and IPC, reflecting his commitment to advancing the field. He is also a columnist for Circuits Assembly Magazine, where he shares his insights on industry trends and challenges.  In this episode, we'll explore Robert's journey in the electronics manufacturing industry, the evolution of testing technologies, and his perspectives on the future of electronics testing. Join us as we gain valuable insights from a leader whose career has been dedicated to excellence in electronic testing and manufacturing.Robert's Info:Robert Boguskirboguski@datest.comDatesthttp://www.datest.com

Explore the revolutionary advancements of Ultra HDI in PCB design and manufacturing. In this episode of the Altium OnTrack Podcast, Zach Peterson sits down with Tara Dunn, Director of Training and Education at SMTA, to discuss how UHDI is reshaping the PCB industry.  Gain insights into its impact on design, fabrication, and assembly, and learn how to stay ahead in this rapidly evolving field.   **Highlights**:   - The future of Ultra HDI in PCB manufacturing   - Challenges and opportunities for PCB designers   - SMTA's role in fostering innovation and collaboration    

In this episode, Todd shares his unique career journey from sales in the funeral industry to leading a company specializing in cleaning and testing equipment for the electronics industry. They discuss the importance of customer service, continuous technology advancements, and Todd's strategic decisions during COVID-19 that have positioned the company for growth. The episode also covers the recent acquisition of a competitor, the challenges of merging companies, and Todd's advice for aspiring leaders. Episode Highlights: 04:20 Lessons from the Funeral Industry 05:28 The Importance of Customer Service 07:28 Challenges and Strategies in Leadership 26:14 Acquisition and Future Plans Todd is the President & CEO of Austin American Technology Corporation since 2016. Austin American Technology is a 38-year-old company specializing in cleaning and testing equipment development and manufacturing. Austin American Technology is headquartered in Burnet, Texas.Todd has co-authored papers and articles in the areas of cleaning and microelectronic assembly processes. Todd has a BS in Business Administration from the College of Central Florida. Todd is a member of IPC, SMTA, and the Central Texas Electronics Association. Previous to joining at Austin American Technology, Todd worked in sales and distribution management. Connect with Todd: LinkedIn www.linkedin.com/in/todd-rountree, Company LinkedIn: www.linkedin.com/company/austinamericantechnology Company Website: www.aat-corp.com For more insights: Book a call: https://bit.ly/4cToGDs Follow me on my YouTube Channel: https://bit.ly/47GgMdn Sign up for my Weekly Newsletter: https://bit.ly/3T09kVcSee omnystudio.com/listener for privacy information.

Today's podcast comes from the Surface Mount Technology Association SMTAI trade show.   As the demand for smaller, faster, and more powerful devices grows, the need for innovative solutions in circuit design has never been greater. UHDI's represent a significant leap forward, allowing for more connections in a smaller space, pushing the boundaries of what's possible in electronic assemblies. But what exactly are ultra-high-density interconnects? Essentially, they refer to circuit boards with incredibly fine pitch interconnects, enabling higher functionality and complexity in much smaller form factors.  This breakthrough is transforming industries like consumer electronics, aerospace, automotive, and medical devices, where space, weight, and performance are critical factors. In this episode, we'll explore the advantages UHDI's bring to the table, from increased design flexibility and performance to better thermal management. We'll also discuss how UHDI's are set to impact the assembly process. With tighter tolerances and more intricate layouts, UHDI assemblies will require new approaches to assembly, inspection, and reliability testing. To better explain UHDI technology, we've put together a panel of subject matter experts. Tara Dunn, director of training and education at SMTA, will moderate a panel discussion with other subject matter experts, including Anaya Vardya, CEO, of American Standard Circuits; Chrys Shea from Shea Engineering Services; Michael Sivigny, owner and general manager of CeTaQ Americas; and Oren Manor, Op-Center core program business director at Siemens Digital Industries Software. UHDI is here! And if you haven't seen it on your assembly line yet, it's coming, so stay tuned as we unpack the future of ultra-high-density interconnects and what it means for the next generation of technology.

What if a grassroots event could transform into a major industry powerhouse? Join us as Jaime takes us through SMTA Guadalajara's rise from a small tabletop event in a hotel to a major trade show, showcasing how collaboration among industry professionals, including competitors, can drive innovation and growth. Jaime also shares his firsthand insights on the vibrant automotive sector in northern Mexico, as it show signs of recovery, and the bustling activity around new projects and equipment renewals.In this episode, we also dive into Pemtron's impressive success in the market, led by their groundbreaking dual lane systems and bespoke inspection equipment. Jaime discusses the surging demand for their technology and the award they recently clinched. Tune in to discover why many companies are eager to adopt new solutions and gear up for future recovery, and hear about the promising trends Jaime is witnessing. Don't miss this episode packed with industry updates and inspiring success!Like every episode of EMS@C-Level, this one was sponsored by global inspection leader Koh Young (https://www.kohyoung.com) and Adaptable Automation Specialist Launchpad.build (https://launchpad.build).You can see video versions of all of the EMS@C-Level pods on our YouTube playlist.

If you're part of the electronics landscape, you've likely encountered the role contract manufacturers play — and it's a critical one. These specialized partners bridge the gap between design innovation and full-scale production, bringing efficiency, expertise, and flexibility to the table. As companies seek to meet growing demand for advanced electronic products, contract manufacturers are increasingly relied upon to provide cost-effective, high-quality assembly services. Whether it's managing supply chains, ensuring compliance with industry standards, or accelerating time to market, their contributions have become indispensable. In today's episode, Mike Konrad explores how contract manufacturing works, why it's so vital, and what trends are shaping the future of this essential industry. Adrian Leal serves as USA business development manager for Teltonika EMS and is president of the Houston SMTA Chapter. With over 30 years of experience in the manufacturing industry, he has worked extensively as both an end-user and a service provider. Throughout his career, he has held diverse roles including process engineer, manufacturing engineer, quality engineer, field engineer, and sales engineer. In 2003, Leal became the first engineer from the oil and gas industry to earn the prestigious Process Engineer certification from the SMTA. From 2006 to 2015, he voluntarily took on the role of ESD Subject Matter Expert for SLB, where he developed an internal ESD program that remains in use today. Leal talks about his transition from an OEM to a contract manufacturer and recommendations on how to choose the most appropriate contract manufacturer.

If you're part of the electronics landscape, you've likely encountered the role contract manufacturers play — and it's a critical one. These specialized partners bridge the gap between design innovation and full-scale production, bringing efficiency, expertise, and flexibility to the table.As companies seek to meet growing demand for advanced electronic products, contract manufacturers are increasingly relied upon to provide cost-effective, high-quality assembly services. Whether it's managing supply chains, ensuring compliance with industry standards, or accelerating time to market, their contributions have become indispensable. In today's episode, we'll explore how contract manufacturing works, why it's so vital, and what trends are shaping the future of this essential industry.My guest today is Adrian Leal. Adrian serves as the USA Business Development Manager for Teltonika EMS and is the President of the Houston SMTA Chapter. With over 30 years of experience in the manufacturing industry, he has worked extensively as both an end user and a service provider. Throughout his career, he has held diverse roles including process engineer, manufacturing engineer, quality engineer, field engineer, and sales engineer.In 2003, Adrian became the first engineer from the oil and gas industry to earn the prestigious Process Engineer certification from the SMTA. From 2006 to 2015, he voluntarily took on the role of ESD Subject Matter Expert for SLB, where he developed an internal ESD program that remains in use today.If you're in Texas, you may know Adrian from his involvement in Cup of Joey networking events.I'll talk with Adrian about his transition from an OEM to a contract manufacturer and his recommendations on how to choose the most appropriate contract manufacturer for your needs.Adrian's contact information:Adrian Lealadrian.leal@teltonika-iot.comhttps://teltonika-iot-group.com

Today's guest Adrian Leal says his dad created dad jokes! Live from Gastech 2024, Reena Friedman Watts sits down with Adrian Leal to uncover the inspiring legacy of his father and how it has shaped his own life and career.  Adrian shares heartfelt stories of his father's journey from a high school dropout to a successful career in electronics, emphasizing the importance of authenticity, faith, and humor in building one's personal brand. Adrian reflects on his father's influence, recounting how his dad balanced his career with his role as a Catholic deacon, and how he continued to mentor people even after a debilitating stroke. Adrian's own career in electronics and manufacturing has been deeply inspired by his father's resilience and dedication. He talks about the importance of knowing one's worth, leveraging strengths, and the power of mentoring and paying it forward. This episode also delves into the transformative changes in the manufacturing industry, the rise of automation and AI, and the exciting future of space exploration. Adrian's passion for innovation and his commitment to helping others shine through in every story he shares. Tune in to hear about the lessons learned from a father who was both goofy and wise, and how those lessons continue to guide Adrian in his professional and personal life. - (00:00) Adrian Leal's father was in electronics; he passed away recently - (04:55) Adrian says his dad being a Christian influenced his career choices - (06:36) You recently left your previous company after being laid off - (10:44) Adrian started going to Cup of Joey because he wanted to find customers - (12:36) The biggest changes in electronics manufacturing have been automation and AI - (14:13) What do you think your dad is most proud of you for - (18:07) Adrian says dad and son bond when he cleans his butt - (19:52) There will be colonies on the moon within, probably within my children's lifetime Connect with Adrian Leal: - LinkedIn: Adrian Leal Connect with Reena Friedman Watts: - Website: bettercalldaddy.com - LinkedIn: Reena Friedman Watts - Twitter: @reenareena - Instagram: @reenafriedmanwatts - Instagram Podcast: @bettercalldaddypodcast We love hearing your feedback. Leave us a review, share your thoughts, and spread the word about this enriching episode. Share it with someone who appreciates the wisdom of legacy, authenticity, and innovation. Show notes created by https://headliner.app     Adrian serves as the USA Business Development Manager for Teltonika EMS and is the President of the Houston SMTA Chapter. With over 30 years of experience in the manufacturing industry, he has worked extensively as both an end user and a service provider. Throughout his career, he has held diverse roles including process engineer, manufacturing engineer, quality engineer, field engineer, and sales engineer. In 2003, Adrian became the first engineer from the oil and gas industry to earn the prestigious Process Engineer certification from the SMTA. From 2006 to 2015, he voluntarily took on the role of ESD Subject Matter Expert for SLB, where he developed an internal ESD program that remains in use today. In addition to his professional achievements, Adrian is committed to giving back to his community. He serves as an ambassador for the Cup of JoeY networking group, supports the local Veterans Chamber of Commerce, advocates for STEM programs for underserved youth, such as Tech Fest Live and supports the RED M organization, a group of professionals who raise awareness and funds to combat human trafficking He is widely regarded as a resource for workforce development and a trusted advisor in the manufacturing sector.

Discover the secrets behind SMTA's success in Mexico's booming electronics industry with insights from Tom Forsythe, a former board member of the SMTA, and Vice President of Kyzen Corporation, recoded on location at the SMTA Guadalajara 2024. Explore how SMTA's grassroots spirit has transformed a humble gathering into a powerhouse trade show rivaling international events like APEX and Productronica. Learn about the critical role Mexico plays in global electronics, especially in the face of evolving global trade dynamics, and why proximity and local expertise matter more than ever.Join Tom and I as we uncover the milestones Mexico has achieved, such as becoming the largest importer into the US, and how SMTA events have become a magnet for engineers and experts eager to solve the industry's toughest challenges. Tom talks about the vibrant participation at these events and the association's dedication to fostering collaboration and innovation. This episode is essential listening for anyone interested in the ever-evolving world of electronics manufacturing and the vibrant communities that powers it forward.Like every episode of EMS@C-Level, this one was sponsored by global inspection leader Koh Young (https://www.kohyoung.com) and Adaptable Automation Specialist Launchpad.build (https://launchpad.build).You can see video versions of all of the EMS@C-Level pods on our YouTube playlist.

Just like the famous line from the 1984 film, The Terminator, “I'll be back,” SMTAI is back. Back to the Chicago area. We're back in Rosemont, co-located with the Assembly Show, at the Donald E. Stephens Convention Center, October 20-24.   Between SMTAI and the Assembly Show, there will be thousands of engineers and industry professionals in attendance.  The exhibit floor features hundreds of exhibitors showing off the latest technology. But the topic we're discussing today is the technical conference and other planned events taking place at this year's SMTAI.   This year, there are 11 scheduled professional development courses, about 100 technical presentations across seven technical tracks. Joining Mike Konrad to discuss what's in store for attendees is Jason Keeping, member of the SMTA Board where he is vice president of technical programs for SMTA. Jeff Kennedy, past SMTA president and director of the Manufacturing Excellence track, and Robert Boguski, member of the SMTA board where he is VP of membership and director of the Test and Inspection track.

Just like the famous line from the 1984 film, The Terminator, “I'll be back”, SMTAI is back. Back to the Chicago area.We're back in Rosemont, co-located with the Assembly Show, at the Donald E. Stephens Convention Center, October 20-24.Between SMTAI and the Assembly Show, there will be thousands of engineers and industry professionals in attendance.The exhibit floor features hundreds of exhibitors showing off the latest technology. But the topic we're discussing today is the Technical conference and other planned events taking place at this year's SMTAI.This year, there are 11 scheduled professional development courses, about 100 technical presentations across seven technical tracks.Joining me to discuss what's in store for attendees is Jason Keeping, member of the SMTA Global Board of Directors where he is Vice President of technical programs for SMTA. Jeff Kennedy, past SMTA President and Director of the Manufacturing Excellence Track, and Robert Boguski, member of the SMTA Global Board of Directors where he is VP of membership and Director of the Test and Inspection track.

This episode was recorded at SMTA's Pan Pacific Strategic Electronics Symposium on the big island of Hawaii.My guests on this episode are Dr. Chuck Bower, founder of PanPac, Keith Bryant, and Dr. Ron Lasky.We discussed the history of PanPac, technologies introduced at PanPac, and what makes PanPac so unique. We also discuss Dartmouth College's unique engineering innovations program.

This episode was recorded at SMTA's Pan Pacific Strategic Electronics Symposium on the Big Island of Hawaii. Mike Konrad's guests on this episode are Dr. Chuck Bauer, founder of PanPac, Keith Bryant, and Dr. Ron Lasky. We discussed the history of PanPac, technologies introduced at PanPac, and what makes PanPac so unique. We also discuss Dartmouth College's unique engineering innovations program.   Chapters: 00:00:00 - Introduction to the Reliability Matters Podcast 00:01:35 - Introduction: Dr. Chuck Bower and Keith Bryant 00:03:23 - The Motivation Behind Starting IMAPS and SMTA 00:05:16 - Global Participation in the Event 00:07:25 - High Level Participants and Learning Experience 00:09:23 - The Conference of Interesting Things 00:11:01 - Speaking to the Thought Leaders of the Industry 00:12:40 - Preconceived Notions about the Event 00:14:26 - The Best Event for Networking and Fundamental Research 00:16:05 - Networking at Conferences 00:17:42 - The Advantage of Combining Innovation and Engineering 00:19:17 - Fostering Entrepreneurship among Students 00:20:57 - The Future of Young People 00:22:34 - Challenging Stereotypes about the New Generation 00:24:03 - Advice for Emerging Engineers and Technicians 00:27:17 - The Benefits of a Liberal Arts Education in Engineering 00:28:48 - Bringing Students to the Conference for Experience 00:30:11 - Entrepreneurship and Thinking Outside the Box 00:31:46 - The Value of Thinking like an Entrepreneur 00:33:22 - The Advantages of Ignorance in Starting a Business 00:34:51 - Throw caution to the wind and pursue your passions 00:36:25 - Appreciation and Thanks 00:37:49 - Stay Safe, Stay Happy, Stay Healthy

Traditional printed circuit board (PCB) designs frequently encounter constraints in space optimization and weight reduction, particularly in compact electronic devices. However, by seamlessly integrating rigid and flexible PCB elements into a unified entity, Rigid-Flex PCB design presents a revolutionary solution for electronic system architecture. I'm your host, Steph Chavez, and today, we dive deep into the fascinating realm of Rigid-Flex PCB design. Joining me is Tara Dunn, Director of Training and Education for SMTA. Together, we'll unpack the intricacies, challenges, and opportunities surrounding Rigid-Flex PCB design. In this episode, you will learn about the transformative potential of Rigid-Flex design in optimizing space, reducing weight, and enhancing overall system performance in electronic devices. Additionally, you'll discover key insights into cost considerations, practical implementation strategies, and the importance of continuous learning and networking in mastering Rigid-Flex engineering.  What You'll Learn in this Episode: The challenges and best practices for designing flex and Rigid-Flex PCBs. (3:17) Rigid Flex vs. standard connectors in electronics design. (7:13) The importance of intentional learning for printed circuit engineers to develop their Rigid-Flex design skills. (13:10) The value of building professional networks and connecting with industry experts. (15:47) Connect with Tara Dunn: LinkedIn Connect with Steph Chavez: LinkedIn

In this enlightening episode of the OnTrack Podcast, host Zach Peterson chats with Kunal Shah, PhD., President of liloTree. The two have a detailed conversation about the burgeoning field of Ultra High-Density Interconnects (UHDI) and its impact on the future of electronics. Kunal shares his insights on the latest in UHDI innovation, including its challenges and solutions in electronics manufacturing, especially in high-reliability applications such as defense and medical electronics. With a focus on the upcoming SMTA panel discussion, this episode is a must-watch for anyone interested in the cutting-edge technologies shaping our world. Don't miss out on this deep dive into UHDI!   Key Highlights:  Overview of the various of Developments in UHDI Discussion of "Traditional" Plating Materials Nickel Vs. Copper Overplating Compensation? Can silver be an UHDI Alternative? More resources: Learn More about liloTree Check out this article about Ultra HDI PCB capabilities Exclusive 15 Days Free Altium Designer Access

Baby Boomers are entering retirement in greater numbers. From now until 2030, 10,000 Boomers each day will hit retirement age. Millions will begin to officially retire. This is creating a terrific opportunity for young college graduates to enter our industry. Several years ago, I was a speaker at the SMTA, Pan Pacific Strategic Electronics Symposium in Hawaii. I shared my breakfast table with a longtime colleague, Dr. Ron Lasky, a professor at Dartmouth College. Over the course of breakfast, he asked me how I got into this industry and, more specifically, how I started my company. Dr. Lasky is an engineering professor at Dartmouth's Thayer School of Engineering. He also teaches entrepreneurship to his soon to be engineers. Dr. Lasky invited me to come speak to his students. I was more than happy to take him up on his offer, and I have spoken to his students on the subject of entrepreneurship every year for the past several years. I have been impressed by the emphasis on entrepreneurship within the Thayer School of Engineering. We live in a time of marvelous evolution within the electronics space. So many new and innovative electronic products are being introduced, fueled by IoT (Internet of Things), the electrification of automobiles, advances in communication, and so much more. Education is the bedrock of our industry. It is the foundation for which much of our industry and the products we make are built upon. I've had Dr. Lasky on my show several times, and I thought it would be a great idea to invite his boss, the dean of Dartmouth's Thayer School of Engineering, onto the program. Dr. Alexis Abramson is the 13th dean of the Thayer School. Prior to joining Dartmouth, she was the Milton and Tamar Maltz Professor of Energy Innovation at Case Western Reserve University and served as a director of the university's Great Lakes Energy Institute focused on creating sustainable energy technology solutions. During the Obama administration, Dr. Abramson served as chief scientist and manager of the Emerging Technologies Division at the US Department of Energy's Building Technologies Program. In 2018, she served as technical adviser for Breakthrough Energy Ventures, a $1 billion effort launched by Bill Gates to combat human-driven climate change. Dr. Abramson's research has focused on novel techniques for thermal characterization of nanostructures, the design and synthesis of unique nanomaterials for use in alternative energy applications, virtual energy audits for building energy efficiency, and strategies to accelerate technology commercialization at universities and research institutions. Dr. Abramson earned a bachelor's and master's in mechanical engineering from Tufts University and a Ph.D. in mechanical engineering at the University of California, Berkeley.

Some of you may recall episode 121 where I spoke with Dr. John Mitchell, president and CEO of IPC about his new book “fire your hiring habits”. During that episode, we talked about best practices for hiring the best people. I'd like to travel a little bit up the river to talk about where potential candidates for hiring come from. While most of the people we interview for positions within our companies come from other companies, more and more, we are seeing new people enter our industry. We've talked a lot about the “silver tsunami” affecting our industry.The fact is, baby boomers are entering retirement in greater numbers. From now until 2030, 10,000 Baby Boomers each day will hit retirement age. Millions will begin to officially retire. This is creating a terrific opportunity for young college graduates to enter our industry. Several years ago, I was a speaker at the SMTA, Pan Pacific strategic Electronics symposium in Hawaii. I shared my breakfast table with a longtime colleague, Dr. Ron Lasky, a professor at Dartmouth College. Over the course of breakfast, he asked me how I got into this industry and, more specifically, how I started my company. Dr. Lasky is an engineering professor at Dartmouth's Thayre school of engineering. He also teaches entrepreneurship to his soon to be engineers. Doctor lasky invited me to come to Dartmouth and speak to his students. I was more than happy to take him up on his offer, and I have spoken to his students on the subject of entrepreneurship every year for the past several years.I have been impressed by the emphasis on entrepreneurship within the Thayre school of engineering. We live in a time of marvelous evolution within the Electronics space. So many new and innovative electronic products are being introduced, fueled by IOT (Internet of things), the electrification of automobiles, advances in communication, and so much more.Education is the bedrock of our industry. It is the foundation for which much of our industry and the products we make are built upon. I've had Dr. Lasky on my show several times, and I thought it would be a great idea to invite his boss, the dean of Dartmouth's Thayre school of engineering onto the program.Dr. Alexis Abramson is the 13th dean of Thayer School of Engineering at Dartmouth. Prior to joining Dartmouth, she was the Milton and Tamar Maltz Professor of Energy Innovation at Case Western Reserve University and served as a director of the university's Great Lakes Energy Institute focused on creating sustainable energy technology solutions. During the Obama administration, Dr. Abramson served as chief scientist and manager of the Emerging Technologies Division at the US Department of Energy's Building Technologies Program. In 2018, she served as technical adviser for Breakthrough Energy Ventures, a $1 billion effort launched by Bill Gates to combat human-driven climate change. Abramson's research has focused on novel techniques for thermal characterization of nanostructures, the design and synthesis of unique nanomaterials for use in alternative energy applications, virtual energy audits for building energy efficiency, and strategies to accelerate technology commercialization at universities and research institutions.Dr. Abramson earned a BS and MS in Mechanical Engineering from Tufts University and a PhD in Mechanical Engineering at the University of California, Berkeley.https://engineering.dartmouth.edu

Welcome to another episode of the Reliability Matters podcast. For those of you keeping track, this is episode number 127.In recent episodes, we've covered high-level issues, such as hiring best practices, novel, training, methods, design for manufacturing, highly accelerated, life, testing, and more. On this episode, we're going to go back to the basics. What common problems are assemblers experiencing today? What are the basics of assembly best practices? Which problems seem to live in perpetuity?To answer these and other questions, I've invited two of my favorite experts on to the show. If you've been in the electronic assembly industry for some amount of time, there's little doubt you've heard of Phil Zarrow and Jim Hall. Phil has been involved with PCB fabrication and assembly for more than 36 years. Phil is the President and Principal Consultant of ITM Consulting. Jim Hall has been involved in the electronic assembly industry for the past 27 years. He's a principal consultant and resident Lean Six Sigma Master Black Belt with ITM Consulting. He's also an instructor in the Lean Six Sigma programs offered at Dartmouth College. Together with Dr. Ron Lasky, Phil and Jim designed the SMTA's SMT Processes Certification Course.A couple of years ago, Phil and Jim published a book in titled “troubleshooting electronic assemblies, tales from the board talk crypt”. I'll talk to them more about that book later in this broadcast.Phil and Jim host the popular audio series “Board Talk” a question and answer show hosted on the Circuit-Insight website. On their show, you'll hear serious questions, and often comical but real answers.Phil Zarrow's Contact Info:phil_zarrow@itmconsulting.comJim Hall's Contact Info:jim_hall@itmconsulting.comITM Consulting:https://itmconsulting.com

In recent episodes, we've covered high-level issues, such as hiring best practices, novel, training, methods, design for manufacturing, highly accelerated, life, testing, and more. On this episode, we're going to go back to the basics. What common problems are assemblers experiencing today? What are the basics of assembly best practices? Which problems seem to live in perpetuity? To answer these and other questions, I've invited two of my favorite experts on to the show. If you've been in the electronics assembly industry for some amount of time, there's little doubt you've heard of Phil Zarrow and Jim Hall. Phil has been involved with PCB fabrication and assembly for more than 36 years. He is president and principal consultant of ITM Consulting. Jim Hall has been involved in the electronics assembly industry for the past 27 years. He's a principal consultant and resident Lean Six Sigma Master Black Belt with ITM Consulting. He's also an instructor in the Lean Six Sigma programs offered at Dartmouth College. Together with Dr. Ron Lasky, Phil and Jim designed the SMTA's SMT Processes Certification Course. A couple of years ago, Phil and Jim published a book titled “Troubleshooting Electronic Assemblies, Tales from the Board-Talk Crypt.” Mike Konrad talks to them more about that book later in this broadcast. Phil and Jim host the popular audio series “Board Talk,” a question-and-answer show hosted on the Circuit-Insight website. On their show, you'll hear serious questions, and often comical but real answers.  

As all of you are well aware, this show is all about reliability, specifically reliability of circuit assemblies. One challenge that seems to be persistent within our space is design for manufacturability or DFM. If you're a contract manufacturer, I have no doubt that you've had the experience of being asked to build a product that seems unbuildable. One example that rings true in my world was the introduction of bottom terminated components or BTC's. BTC's are marvelous components.Because all the lead terminations are below the part, they allow for highly dense component placement and highly miniaturized assemblies. They also presented a number of unique challenges in reflow, in many cases voiding, cleaning, and inspection. Like many other industries, we are not immune to the introduction of new technologies that may lack implementation knowledge. We then spend the next several years at technical conferences and symposiums learning us how to implement these new technologies. There are many acronyms in our industry that begin with DF… Design for testability, mechanical assembly, serviceability, reliability, and so many more. So many in fact, that there is a placeholder acronym for all of the various design fours refer to as DFx. Perhaps the holy grail of DFx is DFM, Design for Manufacturability as it encompasses so many aspects of assembly.To help us understand what exactly is DFM, I invited Andrew Williams to be my guest on this episode. Andrew Williams is the Engineering Manager for Electronics Manufacturing at PRIDE Industries. He has more than 30 years of experience in manufacturing and design and holds an SMT Process Engineer certification from SMTA and an IPC Certified Electronics Program Manager. Andrew is a guest lecturer at UC Davis and Cal State University Sacramento for Supply Chain Management, Operations, and TQM courses, and speaks frequently on DFM, DFS, and other DFX topics and today, he's my guest on the Reliability Matters Podcast.Andrew's Contact Information: Pride Industrieshttps://www.prideindustries.comandrew.williams@prideindustries.com

As all of you are well aware, Reliability Matters is all about reliability, specifically reliability of circuit assemblies. One challenge that seems to be persistent within our space is design for manufacturability, or DfM. If you're a contract manufacturer, no doubt you've had the experience of being asked to build a product that seems unbuildable. One example that rings true was the introduction of bottom terminated components or BTCs. BTC's are marvelous components. Because all the lead terminations are below the part, they permit highly dense component placement and highly miniaturized assemblies. They also presented a number of unique challenges in reflow, in many cases voiding, cleaning, and inspection. Like many other industries, we are not immune to the introduction of new technologies that may lack implementation knowledge. We then spend the next several years at technical conferences and symposiums learning us how to implement these new technologies. There are many acronyms in our industry that begin with Df…  Design for testability, mechanical assembly, serviceability, reliability, and so many more. So many in fact, that there is a placeholder acronym for all of the various design fours refer to as DFx. Perhaps the holy grail of DFx is DfM (design for manufacturability) as it encompasses so many aspects of assembly. Today Andrew Williams helps us understand what exactly DFM is. He is engineering manager for electronics manufacturing at PRIDE Industries. He has more than 30 years of experience in manufacturing and design and holds an SMT Process Engineer certification from SMTA and an IPC Certified Electronics Program Manager. He is a guest lecturer at UC Davis and Cal State University Sacramento for Supply Chain Management, Operations, and TQM courses, and speaks frequently on DfM, DfS, and other DfX topics.

SMTA is well known for producing high-quality relevant technical conferences and symposiums. This includes, among others, the technical conference held at SMTAI, the High Reliability Cleaning and Coating Conference, the Symposium on Counterfeit Parts and Materials, the Advanced Electronics Assembly Conference, the Wafer-Level Packaging Symposium, the Electronics in Harsh Environments conference, and the Pan Pacific Microelectronics Symposium, often referred to as Pan Pac. Pan Pac is unique in many ways, beginning with its venue. Pan Pac is held annually at one of the Hawaian islands. This fact alone makes this symposium stand out. But there are many other factors that make this symposium unique. As Pan Pac's steering committee says: "The Pan Pacific Microelectronics Symposium strives to build bridges and nurture relationships across all boundaries, oceans and cultures, industries and technologies, companies and individuals. Its location in Hawaii always provides the requisite isolation from day-to-day distractions necessary to support these goals and enhance personal face to face interactions. The Pan Pacific continues its mission of building the vision and future directions for the electronics industry!" Pan Pac 2023 is scheduled for January 30 - February 2, 2023, at the Sheraton Kauai Resort on the island of Kauai. To talk more about the upcoming Pan Pacific Symposium, Mike Konrad invited two colleagues who are instrumental in curating the technical contact for this symposium. Dr. Chuck Bauer, one of the creators of this symposium, and Keith Bryant join him to discuss the conferences technical tracks and presentations as well as their view on what makes this conference unique.

Welcome back to another episode of the reliability matters podcast. For those who are counting, this is episode number 108. SMTA is well known for producing high-quality relevant technical conferences and symposiums. This includes, among others, the technical conference held at SMTAI, the High reliability cleaning and coating conference, the symposium on counterfeit parts and materials, the Advanced Electronics Assembly Conference, the Wafer-Level Packaging Symposium, the Electronics in harsh environments conference, and, perhaps my favorite, the Pan Pacific microelectronics symposium, often referred to as PanPac.PanPac is unique in many ways beginning with its venue. PanPac is held annually at one of the Hawaiian islands. This fact alone makes this symposium stand out. But there are many other factors that make this symposium unique. Let me quote from PanPac's steering committee:The Pan Pacific Microelectronics Symposium strives to build bridges and nurture relationships across all boundaries; oceans and cultures, industries and technologies, companies and individuals. Its location in Hawaii always provides the requisite isolation from day to day distractions necessary to support these goals and enhance personal face to face interactions. The Pan Pacific continues its mission of building the vision and future directions for the electronics industry! PanPac 2023 is scheduled for January 30 - February 2, 2023At the Sheraton Kauai Resort on the beautiful island of Kauai. While I love attending technical conferences and symposiums just for the educational opportunity, PanPac there's just something special about this conference. While all conferences provide an element of networking, I have forged many new relationships, friendships, and collaborative agreements with fellow attendees and speakers. Perhaps it has something to do with being on a tropical island for a few days with like-minded people. To talk more about the upcoming Pan Pacific microelectronics symposium, I invited to colleagues who are instrumental in curating the technical contact for this symposium. Dr. Chuck Bauer, one of the original creators of this symposium and Keith Bryant join me to discuss the conferences technical tracks andpresentations as well as their view on what makes this conference unique.More Information:https://smta.org/mpage/panpac/

Episode 96: A Conversation with Industry Gurus Phil Zarrow and Jim Hall about their New BookA couple of episodes ago, I talked to Dr. and Professor Ron Lasky about a couple of books he wrote. He also recommended a book he didn't write. That book is titled Troubleshooting Electronic Assembly: Wisdom from the BoardTalk Crypt by industry gurus Phil Zarrow and Jim Hall available on Amazon (both were prior guests on this show). Well today, we'll have a conversation with Phil and Jim about their book. If you've been in the electronic assembly industry for some time, there's little doubt that you haven't heard of Phil Zarrow and Jim Hall. Phil has been involved with PCB fabrication and assembly for more than 35 years. Phil is the President and Principal Consultant of ITM Consulting. Jim Hall has been involved in the electronic assembly industry for the past 26 years. He's a principal consultant and resident Lean Six Sigma Master Black Belt with ITM Consulting. He's also an instructor in the Lean Six Sigma programs offered at Dartmouth College. Together with Dr. Ron Lasky, Phil and Jim designed the SMTA's SMT Processes Certification Course. Phil and Jim host the popular audio series “Board Talk” on Circuit-Insight, available here:https://www.circuitinsight.com/channels/board_talk.htmlHere is a link to Phil and Jim's "Lessons Learned from the Trenches of SMT Assembly and a Decade of Board Talk” technical course:https://tinyurl.com/board-talk Here is a link to Phil and Jim's book:https://tinyurl.com/board-talk-book Contact Phil and Jim:Phil Zarrowphil_zarrow@itmconsulting.comJim Halljim_hall@itmconsulting.comITM Consultinghttps://itmconsulting.com

I spoke with Dr. Ron Lasky and Jim Hall, authors of the SMTA SMT Certification Courses (along with Phil Zarrow) about the content of these courses. I also spoke with two course students, Claire Hotvedt of Indium Corporation and Tom Watson of Kimball Electronics about their experience taking the courses and the value they received.SMTA offers two certification courses:• SMT Processes• Lean Six Sigma Green BeltEach SMTA Certification program is a three-day offering consisting of a 1.5-day workshop on topics in SMT Processes or Lean Six Sigma Green Belt. The program concludes on days two and three with an open and closed book examination (SMT Processes) and open book examination (Lean Six Sigma Green Belt.)This is not an entry-level program. Basic algebra will be used in the workshop and examination. This challenging examination requires both written answers and calculations with the intent to enable the attendee to establish competitive credentials as "Certified" by the SMTA in SMT Processes or Lean Six Sigma Green Belt.More information on the SMTA certification courses is available here:https://smta.org/page/certification

Mike Konrad speaks with Dr. Ron Lasky and Jim Hall, authors of the SMTA SMT Certification Courses (along with Phil Zarrow) about the content of these courses. He also speaks with course students, Claire Hotvedt of Indium Corp. and Tom Watson of Kimball Electronics about their experience taking the courses and the value they received. SMTA offers two certification courses: • SMT Processes • Lean Six Sigma Green Belt Each SMTA Certification program is a three-day offering consisting of a 1.5-day workshop on topics in SMT Processes or Lean Six Sigma Green Belt. The program concludes on days two and three with an open and closed book examination (SMT Processes) and open book examination (Lean Six Sigma Green Belt.) This is not an entry-level program. Basic algebra will be used in the workshop and examination. This challenging examination requires both written answers and calculations with the intent to enable the attendee to establish competitive credentials as "Certified" by the SMTA in SMT Processes or Lean Six Sigma Green Belt. More information on the SMTA certification courses is available here: https://smta.org/page/certification

Dr. Ron Lasky talks about the many books he has authored on SMT processes and production efficiencies. Dr. Ron Lasky is a Senior Technologist at Indium Corporation, as well as a Professor of Engineering at Dartmouth College, where I have twice had the privilege of speaking on the Dartmouth campus to his students. If you're like some people who view the next generation of young adults skeptically and pessimistically, I can assure you your view would quickly change after spending time with his students. Dr. Lasky has more than 30 years of experience in electronics and optoelectronics packaging at IBM, Universal Instruments, and Cookson Electronics. Additionally, he has served as an adjunct professor at several colleges, teaching more than 20 different courses on topics ranging from electronics packaging, materials science, physics, mechanical engineering and science, and religion. Dr. Lasky holds numerous patent disclosures and is the developer of several SMT processing software products relating to cost estimating, line balancing, and process optimization, all subjects of paramount importance in today's hyper-competitive environment. He is the co-creator of engineering certification exams that set standards in the electronics assembly industry worldwide. Dr. Lasky was awarded the Surface Mount Technology Association's (SMTA) Technical Distinction Award in 2021 for his "significant and continuing technical contributions to the SMTA." He was also awarded SMTA's Founder's Award in 2003. Dr. Lasky holds four degrees, including a Ph.D. from Cornell University in materials science, and is a licensed professional engineer. He has authored six books, and contributed to nine more, on science, electronics, and optoelectronics, 

Dr. Ron Lasky talks about the many books he has authored on SMT processes and production efficiencies. Dr. Ron Lasky is a Senior Technologist at Indium Corporation, as well as a Professor of Engineering at Dartmouth College, where I have twice had the privilege of speaking on the Dartmouth campus to his students. If you're like some people who view the next generation of young adults skeptically and pessimistically, I can assure you your view would quickly change after spending time with his students. Dr. Lasky has more than 30 years of experience in electronics and optoelectronics packaging at IBM, Universal Instruments, and Cookson Electronics. Additionally, he has served as an adjunct professor at several colleges, teaching more than 20 different courses on topics ranging from electronics packaging, materials science, physics, mechanical engineering and science, and religion.Dr. Lasky holds numerous patent disclosures and is the developer of several SMT processing software products relating to cost estimating, line balancing, and process optimization, all subjects of paramount importance in today's hyper-competitive environment. He is the co-creator of engineering certification exams that set standards in the electronics assembly industry worldwide. Dr. Lasky was awarded the Surface Mount Technology Association's (SMTA) Technical Distinction Award in 2021 for his "significant and continuing technical contributions to the SMTA." He was also awarded SMTA's Founder's Award in 2003.Dr. Lasky holds four degrees, including a Ph.D. from Cornell University in materials science, and is a licensed professional engineer.He has authored six books, and contributed to nine more, on science, electronics, and optoelectronics, and has authored numerous technical papers and today, I'm going to talk with Ron about some of those books.Here's how to get Dr. Ron's books:Handbook of Electronic Assembly and A Guide to SMTA Certificationhttps://smta.org/store/viewproduct.aspx?id=16304955The Printed Circuit Assembler's Guide to Solder Defectshttp://iconnect007.com/index.php?cID=852Troubleshooting Electronic Assembly: Wisdom from the BoardTalk Crypthttps://www.amazon.com/Troubleshooting-Electronic-Assembly-Wisdom-BoardTalk/dp/1732283680Patty and the Professorhttps://www.mikekonrad.com/patty-and-the-professorDr. Ron's Contact Information:ronald.c.lasky@dartmouth.edu

Tombstoning is a reflow issue causing components to stand up, creating opens. FCT Solder's Tony Lentz discusses the causes and mitigation techniques to illuminate tombstoning. Tony Lentz has worked in the electronics industry since 1994. He entered the industry as a process engineer at a circuit board manufacturer and worked there for 5 years. Since 1999, Tony has worked for FCT Companies as a chemical laboratory manager, production facility manager, and most recently a field application engineer. Since 2013, Tony has focused on field application and R&D for FCT Assembly solder and stencil products. Tony has extensive experience in research and development, quality control, and technical service with materials used to manufacture and assemble printed circuit boards. Tony has published and presented many papers at industry events. Tony is a speaker of distinction with SMTA,and participates in IPC J-STD-004 and J-STD-005 standards development task groups. Tony holds B.S. and M.B.S degree in Chemistry. Tony was a guesy in Episode 32 where he talked about stencil design and void reduction. Tony produced a DoE on the subject of tombstoning. View his presentation here: https://fctsolder.com

Tombstoning is a reflow issue causing components to stand up, creating opens. FCT Solder's Tony Lentz discusses the causes and mitigation techniques to illuminate tombstoning. Tony Lentz has worked in the electronics industry since 1994. He entered the industry as a process engineer at a circuit board manufacturer and worked there for 5 years. Since 1999, Tony has worked for FCT Companies as a chemical laboratory manager, production facility manager, and most recently a field application engineer. Since 2013, Tony has focused on field application and R&D for FCT Assembly solder and stencil products. Tony has extensive experience in research and development, quality control, and technical service with materials used to manufacture and assemble printed circuit boards. Tony has published and presented many papers at industry events. Tony is a speaker of distinction with SMTA, and participates in IPC J-STD-004 and J-STD-005 standards development task groups. Tony holds B.S. and M.B.S degree in Chemistry. Tony was my guess way back in episode 32 (56 episodes ago) where he talked about stencil design and void reduction. Tony produced a DOE on the subject of tombstoning. View his presentation here:https://fctsolder.comTony may be reached here:tlentz@fctassembly.comhttps://fctsolder.com

This week Derren Martin from Cap HPI joins Rebecca and James to judge. Top 10 car makes and models that hold their value best revealed in new data Rivian Automotive sees value top $100bn on New York's Nasdaq stock exchange Elon Musk sells three per cent of his Tesla shares after vowing to sell 10 per cen Major car makers refuse to sign up to Cop26 pledge on zero emissions vehicles Auto Trader returns to growth in revenue and profit as used car boom continues Cazoo's loss deepened to £102.7m in 2020 from £18m the year before Bangers4Ben Danger Mouse replica sells for highest price of £4,200 Insurance companies being left ‘exposed' by sky-high used car prices Cazoo fends off advertising challenge by SMTA over subscription service Used cars sold more quickly in October than in any other month this year, with MPVs flying off forecourts Nissan reports quarterly profit of over £350m despite ongoing supply chain issues --- Send in a voice message: https://anchor.fm/car-dealer-magazine/message

Mike began his career in the electronic assembly equipment industry in 1985. Mike founded Aqueous Technologies in 1992 from his garage in response to the Montreal Protocol and the resulting international treaty banning most popular cleaning/defluxing solvents.Mike is an internationally known speaker on the subject of increasing reliability through contamination removal and cleanliness quantification techniques and procedures. Mike was awarded “Distinguish Speaker Status” with SMTA in 2018 and received the “Rich Freiberger Best of Conference Award” in 2019.
Mike was recently elected to the SMTA Global Board of Directors where he chairs the SMTA Training Committee and is also a member of the SMTA Strategic Development Committee. Mike is also Vice President of Technical Programs for the Los Angeles / Orange County SMTA Chapter.
Mike is the host of the popular Reliability Matters and concept to Creation Podcasts.Mike is a member of the Board of Directors for The Let It Be Foundation, a non-profit 501c3.

Episode Summary -It is essential to take your chances, don't get caught up with all the fears and the comfort zones.
Why get satisfied with the good when you can create something great.
To create an extraordinary life and to achieve success, you need to take the risk.In today's episode, Mike Onrad shares his story of how he created a successful career by taking chances and overcoming all the fears, from beginning as an accidental & reluctant entrepreneur.
“If you know too much, you will never do it, and if you know too little, you will do it wrong.”Snapshot of the Key Points from the Episode:[01:53] Mike shares his success journey.[10:58] Mike talks about the different skills required during starting & growing your business.[19:19] Mike shares how, from becoming insolvent, he turned his business towards success.[21:44] The need to take chances during uncertain times.[24:04] Mike's talks about his most significant accomplishments.[30:54] Mike talks about what can be an important factor for your success.[34:35] What does work from your happy place mean to Mike?[40:46] The importance of having a “beginners mindset” to deal with changes.[43:09] Mike's advice for entrepreneurs who are starting their journey.

How to Connect with Mike Konrad:
Website - https://www.mikekonrad.com/LinkedIn - https://www.linkedin.com/in/mtkonrad/About the Host -Belinda Ellsworth is a Speaker, Trainer, Best-Selling Author, and PodcasterShe has been a professional speaker, mover, and shaker for more than 25 years. Having built three successful companies, she has helped thousands of entrepreneurs make better decisions, create successful systems, and build business strategies using her "Four Pillars of Success" system.Belinda has always had a passion and zest for life with the skill for turning dreams into reality. Over the last 20 years, she has been expertly building her speaking and consulting business, Step Into Success. How to Connect with Belinda:Facebook - https://www.facebook.com/stepintosuccessLinkedIn - https://www.linkedin.com/in/belindaellsworthInstagram - https://www.instagram.com/stepintosuccess/Website - www.workfromyourhappyplace.com

SMTA's Surface Mount Technology International is back as a live event! The team behind the show and conference discuss the various activities taking place at SMTAI including the exhibition floor, professional development courses, technical presentations, special events and more. SMTAI 2021 takes place November 1-4 in Minneapolis, MN. More information and registration is available here:https://smta.org/mpage/smtai/

Dr. Ron Lasky (Professor at Dartmouth College) and three of his students talk about the papers they wrote which were presented at SMTA's Pan Pacific Microelectronics Symposium in Hawaii in 2020 as well as a new paper to be presented at the same conference in 2022.

Dr. Ron Lasky (Professor at Dartmouth College) and three of his students -- Annaka Balch, Nadia Clement, and Raaga Kannan -- talk about the papers they wrote and presented at SMTA's Pan Pacific Microelectronics Symposium in Hawaii in 2020, as well as a new paper to be presented at the same conference in 2022.

On part 2 of this series , we dive into oven profiling best practices. In part one, we looked at void mitigation and how vacuum reflow technology can help reduce or eliminate voiding.  Our guests are Tim O’Neill from AIM Solder and Fred Dimock of BTU. Tim will discuss voiding mitigation from a materials standpoint while Fred will bring cover equipment and profiling strategies. Tim O'Neill is technical marketing manager for AIM Solder. Operating out of AIM’s US headquarters, Tim is responsible for developing and optimizing product and technical information, collaborating with complementary suppliers and equipment manufacturers and ensuring AIM's products exceed expectations and meet market requirements. Tim is also a technical writer and presenter for industry trade publications and events. He has coauthored several papers on PCB assembly subjects. Tim is also an IPC-A-610 Certified IPC Specialist. Fred Dimock is manager of process technology at BTU International and recently started a consulting business, FCD-Global services. Fred holds an associate degree in mechanical design from Wentworth in Boston and a bachelor's degree in ceramic engineering from the State University of New York. He has authored numerous articles on lead-free solder, process control, and the operation of continuous furnaces. His papers have been published in English, Chinese, and German. He has taught numerous SMTA solder reflow classes and participated in the 5-45 Subcommittee for the development of IPC-7801 Reflow Oven Process Control Standard. Additionally, he wrote the chapter on solder reflow for the Handbook of Electronic Assembly and A Guide to SMTA Certification by Dr. Ron Lasky and Jim Hall. He received Distinguished Speaker status at SMTA Guadalajara Mexico and is a key presenter for the SMTA Jump Start program for new engineers.   Timothy O'Neill is the Technical Marketing Manager for AIM Solder. Operating out of AIM’s U.S. Headquarters, Tim is responsible for developing and optimizing product and technical information, collaborating with complimentary suppliers and equipment manufacturers and ensuring AIM's products exceed expectations and meet market requirements. Tim is also a technical writer and presenter for industry trade publications and events. He has co-authored several papers on PCB assembly subjects.   Tim is also an IPC-A-610 Certified IPC Specialist.   Fred Dimock is the Manager of Process Technology at BTU International and recently started a consulting business, FCD-Global services.   Fred holds an Associate Degree in Mechanical Design from Wentworth in Boston and a Bachelors Degree in Ceramic Engineering from the State University of New York.   Fred has authored numerous articles on lead free solder, process control, and the operation of continuous furnaces. His papers have been published in English, Chinese, and German.   He has taught numerous SMTA solder reflow classes and participated in the 5-45 Subcommittee for the development of IPC-7801 Reflow Oven Process Control Standard. Additionally, he wrote the chapter on solder reflow for the Handbook of Electronic Assembly and A Guide to SMTA Certification by Dr Lasky and Jim Hall.   He received Distinguished Speaker status at SMTA Guadalajara Mexico and is a key presenter for the SMTA Jump Start program for new engineers.   Tim O’Neill may be contacted here: toneill@aimsolder.com   Fred Dimock may be contacted here: fdimock@btu.com    

Welcome to episode 65 of the Reliability Matters podcast. This is part 2 of our conservation with Aim Solder's Tim O'Neill and BTU's Fred Dimock. On this episode, we'll dive into oven profiling best practices.Timothy O'Neill is the Technical Marketing Manager for AIM Solder. Operating out of AIM’s U.S. Headquarters, Tim is responsible for developing and optimizing product and technical information, collaborating with complimentary suppliers and equipment manufacturers and ensuring AIM's products exceed expectations and meet market requirements. Tim is also a technical writer and presenter for industry trade publications and events. He has co-authored several papers on PCB assembly subjects.Tim is also an IPC-A-610 Certified IPC Specialist.Fred Dimock is the Manager of Process Technology at BTU International and recently started a consulting business, FCD-Global services. Fred holds an Associate Degree in Mechanical Design from Wentworth in Boston and a Bachelors Degree in Ceramic Engineering from the State University of New York. Fred has authored numerous articles on lead free solder, process control, and the operation of continuous furnaces. His papers have been published in English, Chinese, and German. He has taught numerous SMTA solder reflow classes and participated in the 5-45 Subcommittee for the development of IPC-7801 Reflow Oven Process Control Standard. Additionally, he wrote the chapter on solder reflow for the Handbook of Electronic Assembly and A Guide to SMTA Certification by Dr Lasky and Jim Hall.He received Distinguished Speaker status at SMTA Guadalajara Mexico and is a key presenter for the SMTA Jump Start program for new engineers.Tim O’Neill may be contacted here:toneill@aimsolder.comFred Dimock may be contacted here:fdimock@btu.com

On this episode, we’ll have a conversation with two industry experts on the subject of solder voiding mitigation and oven profiling, two subjects which influence solder voiding. This will be a two part episode. Here, we dive into void mitigation and how vacuum reflow technology can help reduce or eliminate voiding. Part two (episode 65) will discuss profiling best practices. Our guests are Tim O’Neill from AIM Solder and Fred Dimock of BTU. Tim will discuss voiding mitigation from a materials standpoint while Fred will bring cover equipment and profiling strategies. Tim O'Neill is technical marketing manager for AIM Solder. Operating out of AIM’s US headquarters, Tim is responsible for developing and optimizing product and technical information, collaborating with complementary suppliers and equipment manufacturers and ensuring AIM's products exceed expectations and meet market requirements. Tim is also a technical writer and presenter for industry trade publications and events. He has coauthored several papers on PCB assembly subjects. Tim is also an IPC-A-610 Certified IPC Specialist. Fred Dimock is manager of process technology at BTU International and recently started a consulting business, FCD-Global services. Fred holds an associate degree in mechanical design from Wentworth in Boston and a bachelor's degree in ceramic engineering from the State University of New York. He has authored numerous articles on lead-free solder, process control, and the operation of continuous furnaces. His papers have been published in English, Chinese, and German. He has taught numerous SMTA solder reflow classes and participated in the 5-45 Subcommittee for the development of IPC-7801 Reflow Oven Process Control Standard. Additionally, he wrote the chapter on solder reflow for the Handbook of Electronic Assembly and A Guide to SMTA Certification by Dr. Ron Lasky and Jim Hall. He received Distinguished Speaker status at SMTA Guadalajara Mexico and is a key presenter for the SMTA Jump Start program for new engineers.

Welcome to episode 64 of the Reliability Matters podcast. On this episode, we’ll have a conversation with two industry experts on the subject of solder voiding mitigation and oven profiling, two subjects which influence solder voiding. This will be a two part episode. Today, we’ll dive into void mitigation and how vacuum reflow technology can help reduce or eliminate voiding. Part two, on episode 65 (in two weeks), we’ll discuss profiling best practices.My guests today, and one the next episode are Tim O’Neill from AIM Solder and Fred Dimock of BTU. Tim will discuss voiding mitigation from a materials standpoint while Fred will bring cover equipment and profiling stragities.Timothy O'Neill is the Technical Marketing Manager for AIM Solder. Operating out of AIM’s U.S. Headquarters, Tim is responsible for developing and optimizing product and technical information, collaborating with complimentary suppliers and equipment manufacturers and ensuring AIM's products exceed expectations and meet market requirements. Tim is also a technical writer and presenter for industry trade publications and events. He has co-authored several papers on PCB assembly subjects.Tim is also an IPC-A-610 Certified IPC Specialist.Fred Dimock is the Manager of Process Technology at BTU International and recently started a consulting business, FCD-Global services. Fred holds an Associate Degree in Mechanical Design from Wentworth in Boston and a Bachelors Degree in Ceramic Engineering from the State University of New York. Fred has authored numerous articles on lead free solder, process control, and the operation of continuous furnaces. His papers have been published in English, Chinese, and German. He has taught numerous SMTA solder reflow classes and participated in the 5-45 Subcommittee for the development of IPC-7801 Reflow Oven Process Control Standard. Additionally, he wrote the chapter on solder reflow for the Handbook of Electronic Assembly and A Guide to SMTA Certification by Dr Lasky and Jim Hall.He received Distinguished Speaker status at SMTA Guadalajara Mexico and is a key presenter for the SMTA Jump Start program for new engineers.Tim O’Neill may be contacted here:toneill@aimsolder.comFred Dimock may be contacted here:fdimock@btu.com

Dock Brown brings his more than 30 years of electronics reliability experience to clients of Ansys. Prior to joining Ansys, he spent 20 years at Medtronic where he most recently concentrated on cross business unit implementation of reliability initiatives for Class III medical devices. He was also responsible for supplier assessment and approval, on-going supplier audits, failure analysis, corrective actions, MRB, sampling, and ultimately full accountability for quality and reliability of commercial off-the-shelf and custom parts and assemblies from a worldwide supplier base. Earlier in his career, Mr. Brown also spent time at Sundstrand Data Control where he led the implementation of Boeing’s Advanced Quality System program and with Olin Aerospace. As a volunteer, he has been involved with ASQ, IEEE, IPC, and SMTA. He was the keynote speaker at the SMTA Cleaning Conference and won the best paper award at the SMTA Microelectronics Conference. He has taught on the subjects of design for reliability, tin whiskers, statistics, design of experiments, and contributed to standards development. Today’s episode is a little different than others. Dock will be sharing a very interesting presentation on the subject of reliability. If you’re listening to the audio-only version of this episode, you may want to view the video version so you can see Dock’s slide-deck. The video version of this episode, and several others are available on the Reliability Matters YouTube channel.  

Episode 63: A Conversation with and a Presentation by Reliability Expert Dock BrownWelcome to episode 63 of the Reliability Matters Podcast. Today, I’ll be speaking with Dock Brown.Dock Brown brings his more than 30 years of electronics reliability experience to clients of Ansys. Prior to joining Ansys, he spent 20 years at Medtronic where he most recently concentrated on cross business unit implementation of reliability initiatives for Class III medical devices. He was also responsible for supplier assessment and approval, on-going supplier audits, failure analysis, corrective actions, MRB, sampling, and ultimately full accountability for quality and reliability of commercial off-the-shelf and custom parts and assemblies from a worldwide supplier base. Earlier in his career, Mr. Brown also spent time at Sundstrand Data Control where he led the implementation of Boeing’s Advanced Quality System program and with Olin Aerospace. As a volunteer, he has been involved with ASQ, IEEE, IPC, and SMTA. He was the keynote speaker at the SMTA Cleaning Conference and won the best paper award at the SMTA Microelectronics Conference. He has taught on the subjects of design for reliability, tin whiskers, statistics, design of experiments, and contributed to standards development.Today’s episode is a little different than others. Dock will be sharing a very interesting presentation on the subject of reliability. If you’re listening to the audio-only version of this episode, you may want to view the video version so you can see Dock’s slide-deck. The video version of this episode, and several others are available on the Reliability Matters YouTube channel. Dock Brown may be reached here:dock.brown@ansys.com

Solder voiding has been with us longer than we know. Modern x-ray inspection technology has allowed assemblers to see and quantify voiding. Metallurgical expert Dave Hillman from Collins Aerospace explains the causes and possible remedies for solder voiding. Dave Hillman is a metallurgical engineer in the Advanced Operations Engineering Department of Collins Aerospace in Cedar Rapids, Iowa. He serves as a consultant to manufacturing on material and processing problems. He served as a subject matter expert for the Lead-free Manhattan Project in 2009. He has published numerous technical papers and was presented with the 2008 SMTA International Conference on Soldering & Reliability “Best of Conference” award and was the recipient of the SMTA “Member of Technical Distinction” Award. Dave was awarded the Da Vinci medal as a Rockwell Engineer of the Year. He serves as the Chairman of the IPC JSTD-002 Solderability committee. He’s also a member of the SMTA where he serves on the SMTA Journal and Soldering & Surface Mount Technology Journal Technical Paper Review committees. He’s a member of the American Society for Metals, the Minerals, Metals & Materials Society, and IPC. If you’re in the electronics assembly industry, you’ve probably seen Dave at numerous technical conferences, imparting wisdom with a style unique to Dave. Dave Hillman may be reached at david.hillman@collins.com

Episode 60: A Conversation with Rockwell Collins' Dave Hillman about Solder VoidingSolder voiding has been with us longer than we know. Modern X-ray inspection technology has allowed assemblers to see and quantify voiding. Metallurgical expert Dave Hillman from Rockwell Collins explains the causes and possible remedies for solder voiding. Dave Hillman is a Metallurgical Engineer in the Advanced Operations Engineering Department of Collins Aerospace in Cedar Rapids, Iowa. He serves as a consultant to manufacturing on material and processing problems. He served as a Subject Matter Expert for the Lead-free Manhattan Project in 2009. He has published numerous technical papers and was presented with the 2008 SMTA International Conference on Soldering & Reliability “Best of Conference” award and was the recipient of the SMTA “Member of Technical Distinction” Award. Dave was awarded the Da Vinci medal as a Rockwell Engineer of the Year. He serves as the Chairman of the IPC JSTD-002 Solderability committee. He’s also a member of the SMTA where he serves on the SMTA Journal and Soldering & Surface Mount Technology Journal Technical Paper Review committees. He’s a member of the American Society for Metals, the Minerals, Metals & Materials Society, and IPC.If you’re in the electronics assembly industry, you’ve probably seen Dave at numerous technical conferences, imparting wisdom with a style unique to Dave. Dave Hillman may be reached here:david.hillman@collins.com

Dr. Martin Anselm is a professor at Rochester Institute of Technology (RIT) and is also the newly elected president of the Surface Mount Technology Association or SMTA.Martin also worked for Universal Instruments. During his 12-year career at Universal Instruments, Martin was, among other positions, a process research engineer and manager of Failure Analysis Services.Martin completed his Ph.D. in materials science and engineering through Binghamton University. His research topic involved copper-nickel-tin intermetallic formation kinetics on electroless nickel substrates. Martin also has a master's in mechanical engineering from Clarkson and a bachelor's in physics from SUNY Geneseo.  

My guest today is Dr. Martin Anselm. Martin is a professor at Rochester Institute of Technology (RIT) and is also the newly elected President of the Surface Mount Technology Association or SMTA.Martin also worked for Universal Instruments. During his 12 year career at Universal Instruments, Martin was, among other positions, a Process Research Engineer and Manager of Failure Analysis Services.Martin completed his Ph.D. in Materials Science and Engineering through Binghamton University. His research topic involved Copper Nickel Tin intermetallic formation kinetics on electroless Nickel substrates. Martin also completed a Masters of Science in Mechanical Engineering from Clarkson and an undergraduate degree in Physics from SUNY Geneseo.

We hear a lot about the graying of the PCB industry. Charles Hutchins Award Andrew Daya  has been working in the industry fulltime for about six years and has bachelor’s and master’s degrees in engineering from Rochester Institute of Technology. He talks about his jobs to date, which include Garmin, Anaren and Bose, how design and manufacturing can and do (or don't) work together, and what winning the Hutchins Award and getting involved in SMTA has meant for his career.

IPC’s new chief technologist Matt Kelly will help IPC’s members to engage in latest technology trends and supply chain transformation that continues to evolve across the electronics industry. He will work to define the scope of what future products and services the association should develop in the areas of standards, education and advocacy. Kelly’s primary areas of focus will be leading the following initiatives: “factory of the future” standards and technical research; industry intelligence funding; and creation and launch of an Industry CTO Council.Kelly comes to IPC following a 14-year career at IBM Corporation, holding several senior technology and engineering leadership positions within IBM Systems Division. His technical contributions include 25 patents, 80 publications, and numerous industry awards from NAM, ASM, SMTA, IPC, and IBM.Very familiar with IPC’s standards development process, Kelly has served on seven technical committees and currently serves as vice chair of the 5-21H Bottom Termination Components Task Group and co-chair of the 2-17 Connected Factory Initiative Subcommittee.

Episode 50 - A Conversation with IPC's Matt Kelly on IPC Technology Focus & InvestmentIPC’s New Chief Technologist Matt Kelly talks about Factory and Supply Chain of the Future ModernizationIn this new leadership role, Kelly will help IPC’s members to engage in latest technology trends and supply chain transformation that continues to evolve across the electronics industry. He will work to define the scope of what future products and services the association should develop in the areas of standards, education and advocacy. Kelly’s primary areas of focus will be leading the following initiatives: “factory of the future” standards and technical research; industry intelligence funding; and creation and launch of an Industry CTO Council. Kelly comes to IPC following a 14-year career at IBM Corporation, holding several senior technology and engineering leadership positions within IBM Systems Division. His technical contributions include 25 patents, 80 publications, and numerous industry awards from NAM, ASM, SMTA, IPC, and IBM.Very familiar with IPC’s standards development process, Kelly has served on seven technical committees and currently serves as vice chair of the 5-21H Bottom Termination Components Task Group and co-chair of the 2-17 Connected Factory Initiative Subcommittee.“Matt is widely recognized in the global electronics industry as a premier thought leader and an innovator, and his work will play a pivotal role in helping us know our members and the industry – with greater depth and breadth,” said Sanjay Huprikar, vice president, Solutions. “We are thrilled to welcome Matt to the IPC team, and we look forward to the new contributions he will make to the electronics industry.”Based in Toronto, Kelly can be reached at MattKelly@ipc.org.

Episode 49 - A Conversation with SMTA's Global Executive Director Tanya Martin and SMTA President Greg Vance about SMTAI 2020's new virtual format. Numerous exhibitors are taking part in this new format. More than 100 technical presentations and papers will be available on-demand. Additionally, nine 3.5 hour professional development courses will be presented live!Register to attend the virtual exhibition and technical conference here:https://smta.org/mpage/smtai

As Forbes and SCOOP writer, Philip Stoten, continues to talk to more EMS executives he learns more about their individual and collective experiences during the COVID-19 crisis. In this episode Philip is joined by Dr. Bill Cardoso, CEO of Creative Electron, one of the industry's leading manufacturers of x-ray equipment. Bill is considered an innovator and a leader in the field of x-ray technology and is on the board of the SMTA. They explore pandemic experiences and Bill explain how he returns to his in-garage roots to build a deployed manufacturing ecosystem to keep production going. They also explore the challenges of leadership in a crisis and the need for technology and digital transformation to help lead us to a more agile and resilient future.Like every episode of EMS@C-Level, this one was sponsored by global inspection leader Koh Young (https://www.kohyoung.com) and Adaptable Automation Specialist Launchpad.build (https://launchpad.build).You can see video versions of all of the EMS@C-Level pods on our YouTube playlist.

COVID-19 has impacted daily life and supply chains. Here we bring to you the latest information to help you prepare the best possible response during this unprecedented time. As an electronics industry veteran, Mike Buetow, Vice President and Editor in Chief at PCD&F Circuits Assembly, is uniquely qualified to provide context on the COVID-19 crisis─because he also studied epidemiology. Learn how the electronics industry and supply chains are responding to the coronavirus quarantine, and how this will affect the electronics industry at large in this global industry update. Click here to watch the video. Show Highlights An Electronics Industry ‘State of the Union’: Mike analyzes emerging trends over the last four weeks, and offers his best forecast for how the industry will be affected by COVID-19. A quick breakdown of coronavirus mitigation techniques major companies are using. Trade Associations (e.g., IPC, SMTA, TCPA, IEEE) and their strategies for buffering against the effects of COVID-19. The impact of the COVID-19 travel restrictions and shut-downs on designers and OEMs. When some work can’t be done remotely: CDC recommendations against gatherings, and how EMS companies and fabricators are handling it. Mike responds to questions and comments from industry insiders. How will the coronavirus impact the industry’s dependence on China?  Have we gotten better at weathering supply shortages? Comparative responses to electronics shortages and what we can expect from ripples in the supply chain due to COVID-19.  ”You can’t close your borders to a disease...” Mike speaks from his background as a former student of epidemiology.  Stress test! How 2020 will prove or disprove the effectiveness of the EMS industry’s supply chain.  Will the COVID-19 quarantine amplify trends toward telecommuting?  Links and Resources Twitter @mikeBuetow Mike Buetow on LinkedinPrinted Circuit Design and FabCircuits Assembly websiteOnTrack Podcast: Mike Buetow on PCB West

What finish should I use for my PCB Design? There’s no one single answer, it depends. Meet chemist and surface finish expert Mike Carano, the Vice President of Technology and Business Development at RBP Chemical, industry leaders in high performance chemical technology. Mike emphasizes a key question when it comes to surface finishes, “What are the reliability requirements of the environment?” Learn about the chemistry behind different finishes, fabrication and get tips for avoiding corrosion in unexpected environments in this episode of the OnTrack Podcast. Show Highlights: Mike was Inducted into IPC hall of fame. RBP Chemical - veteran owned small business, based in Milwaukee, founded in 1954 as a supplier for the printing industry and over the years evolved into surface finishes and also carry product lines for Embedded Medical Devices and Semiconductor and Mining industries. On using solder mask over bare copper method - prior to going out to assembly the copper needs to be made pristine. What are the surface finishes and which to use when? 50% of industry using hot air solder leveling (HASL), a surface finish with a long successful history. Other surface finishes: Electroless nickel immersion gold (ENIG), Electroless Nickel Electroless Palladium Immersion Gold (ENEPIG) - which is common in IC substrate, packaging industry. Future of surface finishes: Tin-silver, Direct palladium copper What finish should I use? There’s no one answer, it depends. Are there common examples of things that can go wrong? ie. High frequency design applications - ENIG is a well known issue that most engineers learn about the hard way. Where is the final product going to be used? Is it a domestic product or for the military? Reliability first, cost last. Cost should not be driving force. The environment is what really matters i.e. Shock-drop or Brunel fracture - consider for mobile phones, ENIG - tin-nickel bond, not tin-copper, corrosion environments, temperature extremes What are the reliability requirements of the environment? The most high quality board fabricators have strong process control and automation in place to ensure chemical stability. Board designers are looking for electrical performance. Need to ask about the environment. I would put every designer in a circuit board fabricator for a week and let them build a board they design. To learn, you need to practice and get practical information on building the bareboards. Creep corrosions on the mill automation machines because the OEM is specifying the finish. Japanese techniques i.e. Shokuku chemical Most substrate work is done in Asia; IC substrate packaging at its best is in Japan. Advice for learning: IPC courses, CID and CID+ training is one way to learn more. Links and Resources: RBP Chemical Trouble in Your Tank IPC Hall of Fame Interview Video IPC Hall of Fame induction IPC courses HDP Users Group (HDPUG) SMTA.org   Hey everyone it's Judy Warner with Altium’s OnTrack podcast. Welcome back we are glad to have you join us again today we have a very unique topic and speaker which was actually brought about by Mark Okumura who is the Senior Principal Hardware Engineer from ETS Lindgren who reached out to me and asked me about the topic of surface finishes and lucky for you I happen to know the guy who is a chemist and expert on surface finishes. A longtime friend Mike Carano from RBP Chemical. Before Mike and I get started, I wanted to please invite you to connect with me on LinkedIn or on Twitter, I'm @AltiumJudy. Altium is on LinkedIn, Twitter, and Facebook, and also please know that we're recording on YouTube in case you want to see our sunshiny faces. So Mike, welcome thanks so much we’re delighted to have you. Thanks for inviting me. It's good to know friends in high places right? Well, I have friends in low places. [Laughter] I don't believe it, well maybe, so Mike, I’ve got a question. First of all let's talk about your background a little bit so as a way of introduction Mike Carano was inducted into the IPC Hall of Fame a few years ago and I had the privilege of doing the video interview that was highlighting his induction into the IPC Hall of Fame because he has served on so many committees and boards for IPC, but he really is the go-to guy on chemistry. So Mike, tell us a little bit about your background how you got into chemistry specifically related to the printed circuit board electronics industry? Well sometimes Judy, things happen by accident really, chemistry and sciences were always a love of mine so I always liked to experiment - my parents got me the chemistry set, and   everything from blowing up golf balls to me making things at home, everything from even experimenting with making wine that's chemistry - that seemed like a good thing to do right? I also realized that probably owning a vineyard would not be in the immediate future so onward and upward with chemistry, particularly the area of physical and advanced chemistry electrochemistry working on a Master's Degree, I happened to be walking up on campus one day back in 1980, 24 years old, and there's a gentleman standing outside this building and he noticed my chemistry books he says, hey come here I want to talk to you, and I thought, oh what's this about? And I noticed the sign on the door there, Youngstown Ohio City Electrochemicals, and he asked me if I wanted to interview for a position there. Well it was perfect because graduate school was more part-time. I was doing some teaching assistance and what do you know, I interviewed for this thing on surface finishing chemistry having no idea really what I was getting into, but I did. The idea was finishing my Master's degree, and go on and do something else - maybe do this for two years - well 39 years later here I am still in the industry. In some way, shape, or form, so that's how I got into this and as the company, Electrochemicals in those days, founded primarily on the metal finishing industry - you know, surface finishing for doorknobs and bumpers and decorative plating. Well the company was just then getting into printed circuit board chemistry and a lot of people didn't even know what that was in those days because it was a fledgling industry there was mostly - remember Judy way back then was the 80% of the industry was really run by the OEM... Yeah -So digital equipments the the Adelphi’s, the Delco’s the IBM's, but pretty soon there was that switch, and then I got involved in IPC and pretty soon was formulating chemistries and technical service, traveling globally around the world was fascinating for me, and here I am today, and still in the industry in some way, shape, or form. You know, you evolve, you continue to evolve matter of fact, just like surfaces they've evolved. Yeah right. Where we are today, I'm sure they'll continue to evolve in the very near future. Yeah for sure, so can you give us a quick overview, I know you were Chief for many many years and now you're with RBP can you give us a quick thumb nutch of RBP? Absolutely, great opportunity, company privately owned (veteran owned) small business, our company is based in Milwaukee Wisconsin and was founded in 1954 and has been privately held since. The current CEO and majority owner is Mr Mark Kannenberg, he's my immediate boss, Mark served in Vietnam, he's a West Point graduate and also a Harvard MBA, but he always wanted to kind of get in the business of owning his own company even though he had many, many opportunities. So he's now been running RBP for these last 30 years. Under his control the company has grown beautifully - initially, the company was founded as a supplier of materials and chemistries for the printing industry, newspapers, newsprint magazines, but over the years also evolved into surface finishing, surface treatment and printed circuit board chemistry, which is the company today, because as I said it continues to evolve. Today and we have four major product lines the printed circuit board and photochemical milling chemistries. We have a great product line in the area of embedded medical devices, and we also serve the semiconductor and the mining industries with some specialty additives. A lot of people don't understand the connection but there's a connection all the way through the platforms because the chemistries are basically adapted to work in all those industries which makes working with RBP fascinating for me - the diversification but yet the the continuity and the familiarity - so great opportunity and I've enjoyed it immensely. Good, thank you for sharing that Mike, so let's jump right into surface finishes. I'm sure most of our listeners who are engineers and designers will be familiar with surface finishes but let's just go back to our ABCs for a second and just define surface finishes for us for PCBs. Sure that is the part of the board that is really going to be used to prevent oxidation of the base metal, as you know, typically we have copper as the base metal if you're using the solder mask over bare copper method where you basically put solder mask down that nice green stuff and the copper is showing, you have to make that copper solderable, you have to preserve the solderability so typically, prior to that board going out to the assembly operation, the copper has to be basically made pristine with a finish that does not oxidize so that you can join the component leads, whatever they may be, whether they be surface mounts, through-hole, BGA, QFNS, QFPs, they have to be able to to wet that surface and form a reliable joint. So the surface finish is critical for that application and for that end product. So tell us - give us just a rundown - of what the surface finishes are and then we're gonna jump in to which one to use when. Sure well, here in North America and primarily for the military, we're still using - at least 50 or so percent of the industry - uses hot-air solder leveling. Basically you're taking that solder mask over bare copper board, flexing it, cleaning the copper and then dipping it into a molten solder pot to coat the surface. But over the years, due to a lot of other constraints, one of them was to get rid of lead. And even when we have lead-free, hot air leveling, the other surface finishes have evolved, as a matter of fact, have taken center stage primarily outside of North America. With these surface finishes are we hear the term ENIG, which is Electroless Nickel Immersion Gold we also hear about Electroless Nickel Electrons Palladium Immersion Gold also known as ENAPEG, and while that may be an expensive finish, you see that used quite a bit in the packaging industry, the semiconductor packaging IC substrate industry. Then there is OSP Organic Solderability Preservatives, which is actually the only one of these to be non-metal-containing and then we have immersion silver, and immersion in tin, and again we expect that there’ll be other additions of these finishes coming up in the near future. Potentially a tin silver or direct palladium over copper to get rid of the gold altogether. There's a lot of movement in this area to enhance the surface finish reliability at the same time managing costs because you see how precious metals like gold and palladium can contribute significantly to the cost of that board. Which then makes you wonder, okay what finish should I use and when should I use it? So that's a rundown of our finishes and each one of them - I can tell you this Judy - when people ask me, and I travel all over the world, what finish should I use... Yeah -no one finish fits all. That's a loaded question isn't it Mike? It depends, that's the answer. It depends right. Well as I mentioned in the beginning, this gentleman Mark Okumura reached out to me and said, are you ever going to talk on your podcast, or do you have any information about surface finishes? Because in his particular case - and this is just one of many many high frequency application engineers and designers - have found out the hard way that if they use ENIG the Electroless Nickel Immersion Gold, that if it's high frequency then we have the skin effect and then the signal begins moving through the nickel and the nickel is lossy, and unfortunately that's a well-known issue it's been going on forever but it seems like people have learned that the hard way, unfortunately one at a time, that's just one example. So can we talk about when we talked a few weeks ago, about environment playing a huge role on how to make a selection on your surface finishes. So can you jump into that a little bit? What I mean by environment is, where is that final product going to be used, and let me just preface it this way, if you're in this industry, whether you're in the printed circuit board industry directly or you're an assembler or you're an OEM. Choosing the final finish for that product may be the most important decision you make, because it is going to impact that long-term reliability of least of that solder joint now as I’m saying solder joint,  I'm using it interchangeably with lead-free as well. And compounding that, is again, where are the boards going to be used? Is it to finish in harsh use environments such as automotive under the hood, military aerospace - and that's one application. But then, what about consumer items like mobile phones, smartphones, desktop computers, smart tablets, household devices. You don't need a product or a finish that adds $9 a surface square foot of the board if you're using it in a washing machine in your house, or in a microwave, or even a desktop or laptop computer. Now military aero things like class 3, or class 3A that have to work 24 hours a day, seven days a week and can't fail - you can't fail. You may look at that and you say, well do I need ENAPEG, do I need ENIG? Do I need to make the OSP also work? And some people really are surprised when they find out that OSP’s a very reliable finish. It's not wire bondable but in terms of reliability in forming the copper tin in a metallic, and having a reliable solder joint, it's fantastic. So think about that, it also happens to be the lowest cost finish but I am of the opinion, and I asked somebody this, and I listed ten things I have cost of the finish at the bottom, because that should not be the driving force of what you put on the board. It's the environment where the board is used and then you ask yourself other questions. Is cosmetics important? Do I have to have a shiny silvery finish or don't I need one? I'm worried about shock drop, we know for example, if something I have in my hand drops a lot like a smartphone. you worry about brittle fracture of the components - actually fraction when that phone hits the ground - we've all dropped our phones and the mobile phone companies, the Apples of the world and the Samsung's, conduct shock drop tests all the time because that's important criteria. You don't want to spend money on a new phone, drop it and find out the components fell off. So that's why you don't see ENIG used a lot on the smartphone, you use things like something that makes it much stronger - copper tin and a metallic bond - whereas with ENIG, your tin is formed with the nickel so it's a tin-nickel bond not a tin copper one. I see. So, we all know, and there's been hundreds of papers published by many, many companies and fantastic researchers around the world, showing that the tin to copper in a metallic is much stronger than the tin to nickel in a metallic. So that's something to consider as well, not just the cost. But you might use ENIG in medical devices, we know the military is starting to look at ENIG as a final finish, but they also do some things to ensure the reliability of that component as it is attached to the surface. So there's a myriad of things to look at - oh and corrosion environment - in terms of creep corrosion, and that's an issue and silver tends to be somewhat prone to creep corrosion, but in an industrial environment kind of outside, or in a clay modeling studio or in a paper mill where sulphur is emitted. Yeah that's interesting. So, if you told me, well I'm making this part because I work for General Motors and I'm modeling, I'm gonna use clay to model my next car and I'm gonna have all these computers hooked up inside that studio, I think I'll use boards with silver on them. Well you probably don't want to, your work is gonna be lost, so that's one consideration. As I said shock drop is another, but again where are you using the final product? Industrial automation, using it outside, base stations, all of those things. Industrial controllers where we're subjected to not just environmental contaminants,but maybe significant vibration, temperature extremes etc. So always look at the environment where you're using it and what the reliability requirements are. Can you afford the warranty, what is the warranty when you take something back? If it's inexpensive, you can use an inexpensive finish but if the cost of failure is great, you should rethink that finish which you're going to use and how you're going to use it. That totally makes sense to me. You had mentioned that a lot of people think that OSP is generally a sort of low-tech product, but you were pushing back against that when we discussed that, why is that? Well 25 years ago OSP was what you would call the single attachment finish - one reflow, maybe one through-hole, and that was it. It lasted four to five months whereas the other finishes, like hot air leveling - one year, two year shelf life - that's changed. Companies have made significant improvements in the reliability. Also the the ability of the OSP to reduce oxygen penetration on the copper, and that again is what you're trying to do, you're trying to prevent the underlying copper from oxidizing so that when the solder melts and spreads on the surface, it spreads and encapsulates the leads on the side on the components and solidifies and it's a highly reliable. If the surface is oxidized even slightly and doesn't wet properly you've lost your reliability, but OSP has come on strong now and you see it in automotive under the hoods, major telecommunication companies using it for the reasons of getting away from brittle fracture, you see them in smartphones - a significant number of smartphones - and I have experience in those areas so, I'm talking from personal experience - the reliability is there with the right finish. Now the low-tech you find, if you buy a low-tech OSP from somebody you've never heard of, you’re taking a risk, but the companies out there - two or three that are making significant contributions to the performance of OSP - they've upped the game significantly. Many of them are fifth-generation molecules, these are synthesize organic azone molecules, that just do a fantastic job, and I would not hesitate to recommend it for numerous applications. It's interesting how that's evolved over time, I wasn't aware of that until you mentioned it to me recently, and that's some of the magic of chemistry that just runs in the background of our industry until sometimes - it seems like - until there's a problem. That's right. We don't talk about it, so I'm glad to sort of have this discussion. That’s a good point, to that point Judy, when Black Pad showed up what people will call brittle fracture... Yeah. -it set the industry back 15 years for ENIG because they didn't understand it, they wanted to blame the phosphorus content of the nickel deposit, but that turned out to be incorrect, it turned out that the cause of that was the galvanic effect. When you put immersion gold on top of nickel you're not electrolytically plating it, you're doing an immersion deposit, also known as galvanic cells, so to deposit on nickel, some nickel actually has to corrode and leave the surface, so that the gold can take its place. And that's the main difference of an immersion deposit. Well, what was happening because of the way things were being run, pH, nickel morphology, roughness, etc that galvanic effect was significantly large, causing this corrosion - significant corrosion - to take place on the nickel surface, and that would impact negatively the formation of the solder joint. And there you would get brittle fracture, you drop something, It breaks. So, things are better now, but I still would be very careful, if you told me, I'm gonna put ENIG on my board today, I would say do a first article, make sure that the board design you have, will not end up with this issue. That's a good advice and, for people who are listening. Again - you're going to hear me say this over and over again - and I'm not going to apologize for it, is that you need to get into a board house, find the time because most really good, world-class board houses - you're going to go in and you're going to be surprised to see... and Mike can talk about this, the complexity of the labs they have in place to make sure that their chemicals are stable and doing what they're supposed to do. Mike, I imagine you've spent just more than a little bit of time inside of board houses discussing chemical balance and, if you would, jump in on what the choice of surface finish has on the fabricator and why the designer should know about that? Right yeah, well first let's go back to your first question about these board fabricators the ones that are high-quality board fabricators and I'm looking at not just on the surface finishing side, but also other aspects of the circuit board fabrication including electroless copper, direct metallization, the amount of control that they have in place, process control automation, to keep plating and other the key ingredients within a very tight operating window. And that's not difficult if you invest the time, and you have the commitment to ensure that. I can’t tell you how many times Judy, have been in situations where I've had to troubleshoot a problem because someone said I've got this issue, I've got that issue, you go there and you find out that they were running the chemistry basically way outside the window. Well, why'd you do this? Well, we only check it once every two shifts. Well, you can't have a high volume operation like what you're doing and then check the chemistry once every two shifts and I'm telling you, 90% of these problems that I see related to process, are related to incorrect use of the chemistry and mishandling of the controls that are available to you. Now does that mean that the fabricator needs to work much closer with the supplier, but if the supplier is already doing this for them, the fabricator needs to take some responsibility. But again, I've been with a number of companies who have complete failure analysis labs also in their facility. So, they take it to a very high level, they're basically their own qualification facility to ensure that they understand where the issues are. They categorize every defect and those are the kinds of ones you want to work with. Absolutely, and I've worked for shops like that where they literally had PhDs in chemistry renting the lab. They were doing their own cross section and when suddenly, there's a spike in volume - if you're not on top of it and you don't have those people and all of a sudden - whoops production went up, but we're still checking our bass at the same rate we were before. And then like, oh what happened? Well there's all these things that need to be taken   into consideration and adjust it accordingly. So, what other fabrication considerations are there that that maybe designers or engineers that are designing boards would want to consider as they decide what they're going to choose? Well good that's a good point, and you and I know design is important, because there's this conundrum in our supply chain. The fabricator is looking for design for manufacturing and the designer is designing something to work in a certain fashion. Electrical performance, dielectric spacing, and and they don't take into consideration potentially what that does, how that impacts the bare board fabrication process. That's a very significant right? What - and I'm gonna go back to this - because I find this to be an issue as well on the assembly side boards come into the assembler, they come from somewhere, and they call me and say I have the the plating is lifting from the surface when we assemble, or the solder mask is lifting well I said do you did you specify the grade of solder mask, do you even know what solder mask is being put on the board that you're bringing in to assemble? Well no. Now I find out - it's very easy for me to find out - that they’re using, the fabricator... wherever, typically not here, are using a low $10 a kilo solder mask because no one specified it. And of course, that $10 a kilo or less solder mask is probably gonna work beautifully in a handheld child's toy, it's not going to work very well for your medical device. And you're gonna have all these other problems. So I think, I hope the designers would get more involved in understanding the difficulties in making a bare board and also understand: just don't specify ENAPEG because it sounds great, or sounds sexy. Because number one, you're probably not paying for it, somebody else has to pay for that ENAPEG and at $12 and $10 a square foot.   Understand - and this is where the board designers are looking for the electrical performance - do they ask where the board is going to be used? Is it going to be in a harsh-use environment, is it going to be in a benign environment clay modeling studio? These are the key questions for them. Typically what I see designers do is, say this is how the board should be built, these are the layers, these are the holes, and you should use this material with this dielectric constant. That's all great, but it's not enough. Right And  I've been teaching this advanced troubleshooting course with printed circuit board fabrication for years, and you'd be surprised at the number of designers that actually take that course, and they ask the craziest questions. Which tells me they haven't been outside of the board fabrication, outside of their design studio. Understand that you need to live with that a little bit I would put every designer at least in a circuit board fabricator for two weeks and have them build a board that they designed. Yep I agree it's hard - we encouraged that here a lot - and almost every guest on here says the same thing. Because you and I've been around the block a little while, and understand that there's time constraints for them to get out. However the long-term cost of not getting out there and not onboarding. And this is another plug - you and I've been around IPC awhile - this is another plug for CID and CID+ training, as well because there you onboard some of these things that may be outside of the obvious things that are around manufacturing and assembly. So Kelly Dack wants to start field trips on every CID course. I'm like, yes let's do it! You know, to me that would be fantastic, and to be honest with you and being heavily involved myself in an IPC, one of the things that I've suggested that when CIDs and the CID+ students earned their certifications, they should also have to get some understanding in coursework and practical on the bare board fabrication. You should make it like you did in college, the practicals, you just didn't do the book work, you had to go into the lab... Exactly! -apply what you just learned from the book, because if you couldn't resort to practice, at the end of the day you can't practice it. You've not learned. And as we both know, the cost of ignorance in these areas is so high, like avoidable mistakes. Costly...  I've seen an entire clay modeling studio shut down, a paper mill shut down, because, again the paper mill folks were buying the controls from the OEM who was specifying the boards to be made but the finish... So the poor industrial automation company using these expensive controls were wondering why these inexpensive instruments are no longer doing what they're supposed to do. And they find out that there's creep corrosion in there because the OEM specified immersion silver or bought the board somewhere cheap where the individual companies decided to cut corners, like they do, to meet the cost. Like not putting enough gold on, not putting enough nickel on. You know, there are specs for a reason. There is, absolutely. And that's obviously a discussion for another time. Yeah that's a whole other podcast, and then there's everything you're doing - HDPUG - which is another podcast I'd like to get you on for as well. I want to put a pin in our conversation right now because I realized, in the beginning I failed to mention to our listeners that you may hear some background noise here. There's some... well, what I was telling our producers is, we're building a better podcast but it’s noisy in here, but really what's happening is we have some construction and of course it's overhead in the green room here in our La Jolla office, so it's directly overhead, on this day of course, so please, please excuse any background noise. So Mike, you sit on boards for international companies as well as companies here and you are a respected and trusted advisor. You mentioned to me about things that the Japanese are doing that are very innovative and that is that they're mixing finishes and doing selective finishes can you tell us a little bit about that? Yeah, and this is if you can see the IC substrate side in the Japanese, or the ones who really made miniaturization go. I mean they understood how to make things small, not just lawn mowers and engines like Toyota Camrys and things like in the Prius, but they figured out early on how to do it with circuit boards and and putting more functionality on the chip. Matter of fact, that's where OSP was actually invented was in Japan, in those days it was called pre-flux because it was in the rudimentary 1970s day, but they pioneered the OSP and matter of fact, today the leading OSP company in the world is Shikoku Chemicals out in Japan, they continue to evolve that chemistry and I trust them immensely. So, going back to that question what you do is, in the IC substrate market, where you've got a complex chip that has to have gold leads or gold wire bonding, you have on one side of the substrate, nickel gold, and then you bond the chip with the wires to that feature. But then on the flip side, which is going to be a BGA feature, you have bare copper which is OSP. So they have the BGA balls on the bottom side and the IC substrate - the chip actually, the the die as they call it - on the top side. So you have ENIG - selectively on one side and bare copper meaning OSP - on the other and of course it's a flip chip. So with the IC substrate or the IC chip in there, you marry that BGA to the Barriss surface of the copper board meaning an OSP, and you've got this fantastic package, if you will, instead of doing it all in the nickel gold or all in ENIG and handle it selectively. And they've developed these processes, and they've also developed a selective imaging, if you will, to make that happen. but it's relatively easy to do, once you understand the ramifications and how to make it work, and make sure you don't get an OSP that doesn't say, ‘attack’ the exposed nickel gold. All these things, it's pretty pretty intricate, but it's been around for some time and with a lot of success so I've selected ENIG as they call it. Interesting, so I was just gonna ask you, what does that do to cost and process ? You're saying it's not difficult, how about cost implications? Well there is an additional cost of putting the second imaging step down to protect the board from plating where you don't want it to go, but instead of doing the entire IC substrate in nickel gold, you're doing just one portion of it where the wires from the chip are placed,  from the die so, that does help you significantly in the long run. It also makes the BGA perform better because you're marrying basically tin to bare copper making another opportunity there. Do you think that will find its way here into North America? Well, the thing is there's only a few fabricators here who do work in the substrate industry, most of the substrate work is done in Asia for the Amcor’s and the Intel's and the Samsung’s so you see a lot of the supply chain there. Some big American owned companies in Asia are doing it in volume, but again, if you want to see IC substrate packaging at its best it's the Japanese. Yeah that makes sense. Yep they’re the leaders,and they've been doing that for 30 years, so they tend to be ahead of their time, but now the time has come. Yeah well it's interesting to get your perspective on sort of a global scale, as well this has been great. Our time is coming to a close here, but will you please share with us links to any white papers or slide decks or anything you have? Because I think how I want to wrap up is Mike, if you are a designer what would you do with all this information? And we've kind of shared it sort of anecdotally and quickly here, but if you wanted to learn more about this where would you go, and what kind of things maybe can you share with our listeners that we can throw on the show notes so they can maybe get better at this. Well very good. I would encourage you designers who haven't taken an IDC course outside of design - I encourage you to take them - you look on the IPC website. We just had Apex where, in addition to technical papers, there were workshops on a number of different subjects including my Advanced Troubleshooting course, but there were also courses on the Basics of Bare Board Fabrication, and some of the instructors do a great job of giving you the tour, if you will, of the very basics. So you can get a feel for how the board starts with bare laminate, actually starts from the design, and actually ends with the finished product, going out to assembly from a manufacturing standpoint, and you can follow that up by taking the Advanced Troubleshooting, so you can understand where some of the problems and technical issues come from when the board is fabricated, with the various chemical steps and the mechanical steps like drilling and plating and immersion gold and silver. Whatever you need to do, that would be something you should do, and also watch for IPC Tech Ed, where they're going to be putting more and more of these courses. Standalones in different parts of the company whether it be San Jose, San Diego. We just did a course in Boston back in April which was well attended, and we just had the High Reliability Conference in Baltimore a few weeks ago, which had a high military aero content to it. But there's a webcast as well. And also, I encourage you to look at the IPC website - http://ipc.org/. Go through the technical papers, look for the events that are going on there but obviously at every Apex there will be this myriad of courses to take, and I encourage you to go to your boss and say, look this is something I think will benefit me, and you're gonna send me there anyways for the other events, so why not get there on a Sunday and take this course? Yeah good advice. SMTA is another good place that has a lot of technical papers and seminars and webinars related to things like surface finishes and design for reliability etc. Matter of fact, IPC actually has a Design for Manufacturing workshop that is taught by some really highly-skilled people too, so that might be something that a designer would benefit from. Again, because the designer or an actual designer is actually teaching the course from experience because he lives it... Yeah -let me build bare boards...   I'm talking like Gary Ferrari and Susie Webb and those folks, they've actually built boards but they also design. Happy Holden and he's built boards, he designs boards, he understands - they get it. Right. That would be an interesting perspective for all those out there. Okay good, that's great stuff. Well we'll make sure to attach the links to IPC and I know they're doing a lot with education right now, and so I'll make sure - and if you have anything to share with me please do - and we'll make sure we also include links to RBP Chemical. Yeah, https://www.rbpchemical.com/ And then we will share anything else that you want, and I'm hoping I might be able to twist Mike's arm to come teach a surface finish course at Altiumlive in October. But we'll see, he's so in demand, hie’s a popular guy - but if I had my wish, that's what we would do because I think it'd be a great place again hope to have about five six hundred designers there so I think they would benefit. So Mike thank you again, you're a dear friend, and thank you so much for always freely sharing your information. Mike also writes a column for PCB007 Magazine, called Trouble in Your Tank, and that's where I learned a lot and actually how I became friends with Mike as I was asking him if I could please take some of his content and repurpose it for blogs I was writing. So we'll also include that link to his column. So Mikey, thank you again you're a dear contributor and friend to the industry and thanks so much for taking time out of your busy day to do this with us it's been fun. Well, thank you Judy, thanks for inviting me. I appreciate it, you have a great day. Thanks you too again. This has been Judy Warner with Altium’s OnTrack podcast and Mike Carano of RBP Chemical. please join us again next time - until then - always stay OnTrack.  

Vandaag een interview van Hanneke Vries met Remi Adriaansz. Remi is muziektherapeut, en oprichter en opleidingscoördinator van de opleiding Muziekagogie.  Sinds 1978 ben is Remi Adriaansz werkzaam als muziektherapeut en muziekagoog, met name bij verstandelijk beperkten, in de ouderenzorg en ouderenrevalidatie. Daar ontdekte hij de meerwaarde van muziek op het gebied van contact, communicatie, expressie en ontspanning. Muziek kan als middel in meerdere vormen gehanteerd worden dan alleen als muziektherapie. Hij heeft daarom ook altijd sterk gemaakt voor muziekactiviteiten en muziekagogie. Tussen 2008 en 2012 was hij mede grondlegger van en docent aan de studie Verkorte Route Muziektherapie aan de Stenden Hogeschool te Leeuwarden. Van 1990 tot 2015 is hij verbonden geweest aan de Leergang Orthoagogische Muziekbegeleiding van Hogeschool InHolland te Alkmaar. Vanaf september 2018 wordt deze leergang gecontinueerd als opleiding Muziekagogie door Artiance. Naast muziektherapie en SMTA (combinatiebehandeling muziek en logopedie) geeft Remi regelmatig workshops, trainingen en cursussen over het gebruik van muziek als middel. Tussen 2008 en 2012 was hij mede grondlegger van en docent aan de studie Verkorte Route Muziektherapie aan de Stenden Hogeschool te Leeuwarden. Van 1990 tot 2015 is hij verbonden geweest aan de Leergang Orthoagogische Muziekbegeleiding van Hogeschool InHolland te Alkmaar. Vanaf september 2018 wordt deze leergang gecontinueerd als opleiding Muziekagogie door Artiance. Naast muziektherapie en SMTA (combinatiebehandeling muziek en logopedie) geeft Remi regelmatig workshops, trainingen en cursussen over het gebruik van muziek als middel. Meer informatie: www.artiance.nl

On this Saturday’s episode of MotortradeRadio.com, Philip Nothard of COX Automotive joined by Curtis Hutchinson, editor at Motortrader.com to discuss the latest headlines, Lance Bradley to step down as MD of Mitsubishi UK in 2018 and Motors.co.uk to launch Price & Go part-exchange and disposal service. Vertu Motors is poised to support its online used car buying service with an “aggressive” marketing campaign following its soft launch in May. In other news, Polestar, Volvo Car Group’s performance arm, has announced that its cars, which go into production in 2019, will be configured and ordered online using an app or online portal. Less than 2% of the total value of car finance arranged via dealers is provided by companies specialising in the sub-prime segment, that’s the conclusion of a new report from Apex Insight. And finally, a survey carried out by Cox Automotive found that nearly nine out of 10 dealers plan to review their fuel profiles in 2018 in response to consumer uncertainties around diesel. Plus, shout-out for the SMTA dinner and Motor Trader Summit in November, and an exclusive interview with Sam Watkins, Sales & Marketing Director at CW Walton (Bruntingthorpe), discussing with Philip, the relaunch of the VRA and the forthcoming Seminar. 

On today's Sunday Interview, Derek Blair talks with Sandy Burgess, the Chief Executive of the Scottish Motor Trade Association. Two years into Sandy's tenure, we discuss the history of the association and what the future holds for the SMTA and its members.

Today's episode features Philip Nothard and guest Curtis Hutchinson of Motor Trader Magazine. They discuss the winners of last week's #MTraderAwards at the prestigious JW Marriott Grosvenor Hotel on Park Lane, London.  Special mentions are given to: New Dealership of the Year – TrustFord Epsom Text book example of opening a new site in a busy town and hitting the ground running Social Media – Group – Day’s Motor Group South Wales based group shows how to integrate social media platforms to drive interaction and sales Social Media – Single Site – Luscombe Suzuki Leeds A single-site that uses social media to punch above its weight to interact with customers and drive sales Sales Team of the Year/Business Manager – SG Petch Hyundai Middlesbrough-based multi-franchise business that excels at selling to its local community Dealer Group of the Year – Swansway Group (by judges’ nomination) Motor Trader Top 200 group that has grown organically and by acquisition and is setting high standards across the sector Carmaker of the Year – Suzuki GB (by judges’ nomination) Consistently outperforms most carmakers in the NFDA Dealer Attitude Survey through its close relationship with its retailers Outstanding Achievement – Mark Squires, NFDA One of the most highly respected dealer group bosses in the industry now sharing his industry experience as chairman of the NFDA  Sunday bonus interview: On tomorrow's bonus Sunday interview, Derek Blair talks with Sandy Burgess, Chief Executive of the SMTA. Sandy shares recent strategies and exciting plans for the association's future.

Animé par nul autre que J.u.D., BAOÛS est une toute nouvelle émission dédiée à la musique House/Techno, etc. Cette semaine à l'émission: Des nouveautés de Dusky et de Shadow Child qui ont respectivement sorti des projets solos vendredi dernier, un extrait d'un projet de remix de Frank Ocean qui a fait une grosse vague sur le web et plus encore.Tracklist01. Blonde - Feel Good (It’s Alright) (feat. Karen Harding) (Ferdinand Weber & Fabich Remix)02. Disclosure & Friend Within - The Mechanism03. Dusky - Runny Nose04. Charles Fenckler - Frozen Room05. Somore - I Refuse (What You Want) (feat. Damon Trueitt) (Industry Standard Remix)06. Nicky Night Time - Flowers (feat. Nat Dunn)07. Klangkuenstler - Jam Master Jack08. Frank Ocean - Skyline To (Kweku Saunderson Remix)09. Dj Cameo, Myles & Gravin Francis - What I Need10. Duane Harden, Ryan Blyth - Back To You11. David Morales & The Bad Yard Club - In De Ghetto (Dex & Jonesy Remix)12. Bontan - 33 45 (Jhonsson Remix)13. DEVolution - Admire (Low Steppa Old Skool Flex)14. Shadow Child & Ben Pearce - Nothing Ever Hurts (feat. Laurel)15. Coca District - Only Begun16. Example - Later17. Lowheads - Need Role18. Detlef - Kink Tail19. Kamera - Consignia (Truncate Remix)20. Soul Vision - Don’t Stop (Dario D’Attis Remix)21. Supernova - I Can’t Do Without You22. Tink & My Digital Enemy - Clocks23. SMTA & Aston Martinez - Never Too Much24. DJ E-Clyps - Deeper Than Love25. Nu Birth - Anytime26. Hardwell - No Holding Back (feat. Craig David)27. Offaiah - Trouble28. Eddie Amador - House Music (Ian Pooley Remix) Écoutez les derniers projets de:Dusky - Outerhttps://play.spotify.com/album/5n1PfsPsRiYuMWXfyfx5HWShadow Child - Connectedhttps://play.spotify.com/album/10Q37VmCSD2W7BKcuk4hsEKweku Saunderson - Brunetthttps://soundcloud.com/first-one-up/sets/kweku-brunette Pour contacter J.u.D.Soundcloud: soundcloud.com/judexperienceInstagram: instagram.com/judexperienceTwitter: twitter.com/judexperienceFacebook: facebook.com/judexperienceEmail: judexperience@gmail.com